公开(公告)号：US20230133710A1

公开(公告)日：2023-05-04

申请号：US18063496

申请日：2022-12-08

Applicant: FUJIFILM Corporation

Inventor： Aina USHIYAMA ,  Akira TAKADA ,  Masafumi KOJIMA ,  Akiyoshi GOYO ,  Michihiro SHIRAKAWA ,  Keita KATO

IPC: G03F7/004 ,  G03F7/039 ,  G03F7/20

Abstract: An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having excellent LWR performance can be formed even after the composition is stored for a long period of time. In addition, another object of the present invention is to provide a resist film, a pattern forming method, and a method for manufacturing an electronic device, each relating to the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a resin of which polarity increases through decomposition by an action of an acid, and a compound that generates an acid upon irradiation with actinic rays or radiation, and the compound that generates an acid upon irradiation with actinic rays or radiation is selected from compounds (I) and (II).

公开(公告)号：US20210364917A1

公开(公告)日：2021-11-25

申请号：US17386440

申请日：2021-07-27

Applicant: FUJIFILM Corporation

Inventor： Minoru UEMURA ,  Masafumi KOJIMA ,  Akiyoshi GOTO ,  Kei YAMAMOTO ,  Takashi KAWASHIMA

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039 ,  C07C381/12 ,  C07C317/28 ,  C07C317/44 ,  C07D327/06 ,  C07C255/17 ,  C07D333/46 ,  C07C311/16 ,  C07C25/02 ,  C07D317/72

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition having excellent storage stability during long-term storage. In addition, also provided are a resist film, a pattern forming method, and a method for manufacturing an electronic device, each relating to the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a compound represented by General Formula (I) and an acid-decomposable resin. M1+A−-L-B−M2+  (I)

公开(公告)号：US20210088905A1

公开(公告)日：2021-03-25

申请号：US17106170

申请日：2020-11-29

Applicant: FUJIFILM Corporation

Inventor： Masafumi KOJIMA ,  Minoru UEMURA ,  Takashi KAWASHIMA ,  Akiyoshi GOTO ,  Kei YAMAMOTO ,  Kazuhiro MARUMO ,  Keiyu OU

IPC: G03F7/039 ,  G03F7/038 ,  C08L33/10 ,  G03F7/32

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a photoacid generator A that generates an acid represented by General Formula (I), the acid having a pKa of −1.00 or more; one or more selected from the group consisting of a photoacid generator B that generates an acid having a pKa larger than that of an acid generated from the photoacid generator A by 1.00 or more, and a nitrogen-containing compound C having a pKa of a conjugate acid thereof larger than that of the acid generated from the photoacid generator A by 1.00 or more; and an acid-decomposable resin, in which in a case where the actinic ray-sensitive or radiation-sensitive resin composition includes a photoacid generator D that generates an acid having a pKa of less than −1.00, a ratio of the number of moles of the photoacid generator A to the number of moles of the photoacid generator D in the composition, is 1.0 or more.

公开(公告)号：US20210072642A1

公开(公告)日：2021-03-11

申请号：US16953305

申请日：2020-11-19

Applicant: FUJIFILM Corporation

Inventor： Daisuke ASAKAWA ,  Akiyoshi GOTO ,  Masafumi KOJIMA ,  Takashi KAWASHIMA ,  Yasufumi OISHI ,  Keita KATO

IPC: G03F7/039 ,  G03F7/038 ,  C08F20/18 ,  C08F26/06

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin including a repeating unit represented by Formula (1) and capable of increasing a polarity by an action of an acid.

公开(公告)号：US20200012189A1

公开(公告)日：2020-01-09

申请号：US16507150

申请日：2019-07-10

Applicant: FUJIFILM Corporation

Inventor： Akiyoshi GOTO ,  Masafumi KOJIMA ,  Akira TAKADA ,  Keita KATO ,  Kyohei SAKITA

IPC: G03F7/031 ,  G03F7/038

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition contains a compound represented by General Formula (1). In General Formula (1), X represents a sulfur atom or an iodine atom. m represents 1 or 2, in a case where X is a sulfur atom, m is 2, and in a case where X is an iodine atom, m is 1. R1's each independently represent an alkyl group or alkenyl group which may include a heteroatom, an aromatic heterocyclic group, or an aromatic hydrocarbon ring group. Further, in a case where m is 2, two R1's may be bonded to each other to form a ring. R2 represents a divalent linking group. R3 represents a divalent linking group having no aromatic group. Y− represents an anionic moiety. The pKa of the compound represented by General Formula (1) as Y− is protonated is −2.0 to 1.5.

公开(公告)号：US20180364571A1

公开(公告)日：2018-12-20

申请号：US16110394

申请日：2018-08-23

Applicant: FUJIFILM Corporation

Inventor： Ryo NISHIO ,  Masafumi KOJIMA ,  Akiyoshi GOTO ,  Tomotaka TSUCHIMURA ,  Michihiro SHIRAKAWA ,  Keita KATO

IPC: G03F7/004 ,  G03F7/16 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  G03F7/038 ,  G03F7/039 ,  C07C309/12 ,  C07C321/28 ,  C07D327/08 ,  C07D217/08 ,  C07D335/16 ,  C07C309/15 ,  C07C309/17 ,  C07D213/70 ,  C07D333/46 ,  C07J43/00

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition which is capable of forming a pattern having a low LWR and is further suppressed in the collapse of the formed pattern, a resist film, a pattern forming method, and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains a photoacid generator represented by General Formula (1) or a resin having a residue obtained by removing one hydrogen atom from the photoacid generator represented by General Formula (1).

公开(公告)号：US20170115569A1

公开(公告)日：2017-04-27

申请号：US15400491

申请日：2017-01-06

Applicant: FUJIFILM Corporation

Inventor： Akiyoshi GOTO ,  Masafumi KOJIMA ,  Michihiro SHIRAKAWA ,  Keita KATO

IPC: G03F7/039 ,  C08F220/18 ,  G03F7/16 ,  G03F7/40 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  G03F7/004 ,  G03F7/09

CPC classification number: G03F7/0397 ,  C08F212/14 ,  C08F220/10 ,  C08F220/18 ,  C08F220/22 ,  C08F220/26 ,  C08F220/28 ,  C08F220/36 ,  C08F2220/1858 ,  C08F2220/282 ,  C08F2220/283 ,  G03F7/004 ,  G03F7/0045 ,  G03F7/0392 ,  G03F7/091 ,  G03F7/16 ,  G03F7/168 ,  G03F7/2041 ,  G03F7/26 ,  G03F7/325 ,  G03F7/327 ,  G03F7/38 ,  G03F7/40 ,  H01L21/0274

Abstract: Provided are an active-light-sensitive or radiation-sensitive resin composition having high DOF and excellent LWR, a pattern forming method using the composition, and a method for manufacturing an electronic device. The composition is an active-light-sensitive or radiation-sensitive resin composition containing a resin (P), in which the resin (P) includes a repeating unit (a) having a group that decomposes by the action of an acid to generate a polar group, including at least a specific repeating unit (a1) represented by General Formula (1); a repeating unit (b1) having at least one of a lactone structure, a sultone structure, or a carbonate structure; and a repeating unit (b2) having at least one of a lactone structure, a sultone structure, or a carbonate structure, which is different from the repeating unit (b1), the Ohnishi parameter of the repeating unit (b1) is larger than the Ohnishi parameter of the repeating unit (b2), and the difference between both the Ohnishi parameters is 0.85 or more.

公开(公告)号：US20170059995A1

公开(公告)日：2017-03-02

申请号：US15350913

申请日：2016-11-14

Applicant: FUJIFILM Corporation

Inventor： Hajime FURUTANI ,  Akiyoshi GOTO ,  Michihiro SHIRAKAWA ,  Masahiro YOSHIDOME ,  Masafumi KOJIMA

IPC: G03F7/32 ,  G03F7/16 ,  G03F7/039 ,  G03F7/004 ,  G03F7/20 ,  G03F7/038

CPC classification number: G03F7/322 ,  G03F7/0045 ,  G03F7/038 ,  G03F7/0397 ,  G03F7/16 ,  G03F7/2006 ,  G03F7/325

Abstract: A pattern forming method includes a pattern forming method using an actinic ray-sensitive or radiation-sensitive resin composition in which ΔDth represented by the following Formula (1) satisfies 0.8 or more (in the formula, Dth(PTI) represents the threshold deprotection rate of the acid-decomposable group with respect to the film thickness of the actinic ray-sensitive or radiation-sensitive film after development using the alkali developer, and Dth(NTI) represents the threshold deprotection rate of the acid-decomposable group with respect to the film thickness of the actinic ray-sensitive or radiation-sensitive film after development using the developer including an organic solvent). ΔDth=Dth(PTI)/Dth(NTI)  (1)

Abstract translation: 使用被配置为使得由式（1）表示的ΔDth为0.8以上的活性光敏性或辐射敏感性树脂组合物的图案形成方法。 ΔDth= Dth（PTI）/ Dth（NTI）（1）（在公式中，Dth（PTI）表示酸分解基团与显影后的有源光敏感或辐射敏感膜的膜厚度的阈值去保护率 碱性显影剂液体; Dth（NTI）表示使用含有有机溶剂的显影剂液体显影后的酸分解基团与活性的光敏感或感光性膜的膜厚度的阈值去保护比。）