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公开(公告)号:US20190294042A1
公开(公告)日:2019-09-26
申请号:US16432043
申请日:2019-06-05
申请人: FUJIFILM Corporation
发明人: Keita KATO , Kyohei SAKITA , Daisuke ASAKAWA , Akiyoshi GOTO , Masafumi KOJIMA
摘要: Provided are an actinic ray-sensitive or radiation-sensitive resin composition which satisfies a relational expression represented by a specific formula in a case where an exposure latitude is represented by EL and an normalized image log slope is represented by NILS, in which the actinic ray-sensitive or radiation-sensitive resin composition can provide very excellent roughness performance, exposure latitude, and depth of focus, particularly, in the formation of an ultrafine pattern (for example, a contact hole pattern having a hole diameter of 45 nm or less, or a line-and-space pattern having a line width of 45 nm or less); and an actinic ray-sensitive or radiation-sensitive film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
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公开(公告)号:US20210318616A1
公开(公告)日:2021-10-14
申请号:US17344967
申请日:2021-06-11
申请人: FUJIFILM Corporation
摘要: According to the present invention, an actinic ray-sensitive or radiation-sensitive resin composition including a resin P having a repeating unit represented by General Formula (P1) and a compound that generates an acid having a pKa of −1.40 or more upon irradiation with actinic rays or radiation; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the composition, are provided. Mp represents a single bond or a divalent linking group. Lp represents a divalent linking group. Xp represents O, S, or NRN1. RN1 represents a hydrogen atom or a monovalent organic group. Rp represents a monovalent organic group.
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公开(公告)号:US20210072642A1
公开(公告)日:2021-03-11
申请号:US16953305
申请日:2020-11-19
申请人: FUJIFILM Corporation
发明人: Daisuke ASAKAWA , Akiyoshi GOTO , Masafumi KOJIMA , Takashi KAWASHIMA , Yasufumi OISHI , Keita KATO
摘要: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin including a repeating unit represented by Formula (1) and capable of increasing a polarity by an action of an acid.
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公开(公告)号:US20210191265A1
公开(公告)日:2021-06-24
申请号:US17193007
申请日:2021-03-05
申请人: FUJIFILM Corporation
发明人: Kazunari YAGI , Michihiro OGAWA , Akiyoshi GOTO , Daisuke ASAKAWA
IPC分类号: G03F7/039 , G03F7/038 , G03F7/004 , C08F220/28 , C08F212/14
摘要: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition which is excellent in the sensitivity of a resist film to be formed to EUV and excellent in the LER of a positive tone pattern to be formed upon EUV exposure. In addition, the present invention provides a resist film, a pattern forming method, and a method for manufacturing an electronic device, each of which uses the actinic ray-sensitive or radiation-sensitive resin composition.
The actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention includes a compound that generates an acid upon irradiation with actinic rays or radiation, and a resin having a polarity that increases by an action of an acid, in which the resin includes a repeating unit represented by General Formula (B-1).-
公开(公告)号:US20190196326A1
公开(公告)日:2019-06-27
申请号:US16286984
申请日:2019-02-27
申请人: FUJIFILM Corporation
发明人: Masafumi KOJIMA , Daisuke ASAKAWA , Akiyoshi GOTO , Keita KATO , Keiyu OU
IPC分类号: G03F7/004 , G03F7/20 , C07C309/17 , C07C309/16 , C07C309/19 , C07C309/07 , C07C317/06 , C07C317/12 , C07D295/185 , G03F7/32
CPC分类号: G03F7/0045 , C07C309/07 , C07C309/16 , C07C309/17 , C07C309/19 , C07C317/06 , C07C317/12 , C07C2601/14 , C07C2603/74 , C07D295/185 , G03F7/004 , G03F7/0046 , G03F7/038 , G03F7/039 , G03F7/20 , G03F7/2004 , G03F7/32
摘要: An actinic ray-sensitive or radiation-sensitive resin composition contains a compound that generates an acid represented by Formula (I) by irradiation with an actinic ray or radiation, and a resin. The resist film is formed of the actinic ray-sensitive or radiation-sensitive resin composition. In the pattern forming method and the method of manufacturing an electronic device, the actinic ray-sensitive or radiation-sensitive resin composition is used.
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公开(公告)号:US20180292751A1
公开(公告)日:2018-10-11
申请号:US16007421
申请日:2018-06-13
申请人: FUJIFILM Corporation
发明人: Daisuke ASAKAWA , Akiyoshi GOTO , Yasunori YONEKUTA , Naoya HATAKEYAMA , Michihiro SHIRAKAWA , Keiyu OU
IPC分类号: G03F7/038 , G03F7/16 , G03F7/20 , G03F7/38 , G03F7/32 , C08F220/16 , C08F220/28 , C08F220/36 , C08F220/38 , C08F220/34 , C08F230/08 , G03F7/039
摘要: The present invention has an object to provide an actinic ray-sensitive or radiation-sensitive resin composition having excellent collapse performance, an actinic ray-sensitive or radiation-sensitive film formed using the composition, a pattern forming method using the composition, and a method for manufacturing an electronic device, including the pattern forming method. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention is an actinic ray-sensitive or radiation-sensitive resin composition containing a resin whose solubility with respect to a developer changes by the action of an acid, in which the resin includes a repeating unit derived from a monomer having at least one of a lactone structure or an amide structure, and the dissolution parameter of the monomer is 24.0 or more.
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