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    ECA oxide-resistant connection to a hermetic seal ferrule for an active implantable medical device
    31.
    发明授权
    ECA oxide-resistant connection to a hermetic seal ferrule for an active implantable medical device 有权

    公开(公告)号：US11541233B2

    公开(公告)日：2023-01-03

    申请号：US17181416

    申请日：2021-02-22

    Applicant: Greatbatch Ltd.

    Inventor： Christine A. Frysz ,  Robert A. Stevenson ,  Jason Woods

    IPC: A61N1/00 ,  A61N1/08 ,  H01G4/005 ,  H01G4/30 ,  H01G4/35 ,  A61N1/375 ,  H01G4/236 ,  A61N1/36 ,  A61N1/39 ,  A61N1/362 ,  H01G4/12 ,  H03H1/00 ,  A61N1/37

    Abstract: A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimide, or a thermal-setting electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.

    Electrical Connection For An AIMD Utilizing An Anisotropic Conductive Layer
    34.
    发明申请
    Electrical Connection For An AIMD Utilizing An Anisotropic Conductive Layer 有权

    公开(公告)号：US20210154483A1

    公开(公告)日：2021-05-27

    申请号：US17165500

    申请日：2021-02-02

    Applicant: Greatbatch Ltd.

    Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Brian P. Hohl ,  Marc Gregory Martino

    IPC: A61N1/375 ,  H01G4/35 ,  H01G4/236 ,  H01G4/008 ,  H01G4/12

    Abstract: A feedthrough for an AIMD includes a ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A circuit board disposed adjacent to the insulator device side has a ground plate or ground trace electrically connected to a circuit board ground conductive pathway disposed in a circuit board ground via hole. An anisotropic conductive layer disposed between the circuit board and the insulator device side has an electrically insulative matrix supporting a plurality of electrically conductive particles. The anisotropic conductive layer has a first thickness where at least one first electrically conductive particle is longitudinally aligned and in electrical contact with the ferrule and the circuit board ground conductive pathway electrically connected to the at least one circuit board ground plate or ground trace. The anisotropic conductive layer has a second, greater thickness where the ferrule and the circuit board ground conductive pathway are not longitudinally aligned, and no electrically conductive particles are in electrical contact with the ferrule and the circuit board ground conductive pathway.

    Ground electrical path from an MLCC filter capacitor on an AIMD circuit board to the ferrule of a hermetic feedthrough
    35.
    发明授权
    Ground electrical path from an MLCC filter capacitor on an AIMD circuit board to the ferrule of a hermetic feedthrough 有权

    公开(公告)号：US11013928B2

    公开(公告)日：2021-05-25

    申请号：US16045035

    申请日：2018-07-25

    Applicant: Greatbatch Ltd.

    Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

    IPC: A61N1/08 ,  A61N1/37 ,  A61N1/375 ,  H01G4/35 ,  H05K1/18 ,  H01G4/06 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/00 ,  H03H7/01 ,  H05K9/00 ,  H05K5/00

    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

    Ground electrical path from an MLCC filter capacitor on an AIMD circuit board to the ferrule of a hermetic feedthrough
    36.
    发明授权
    Ground electrical path from an MLCC filter capacitor on an AIMD circuit board to the ferrule of a hermetic feedthrough 有权

    公开(公告)号：US10857369B2

    公开(公告)日：2020-12-08

    申请号：US16364953

    申请日：2019-03-26

    Applicant: Greatbatch Ltd.

    Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

    IPC: A61N1/08 ,  H05K9/00 ,  A61N1/37 ,  A61N1/375 ,  H05K5/00 ,  H05K1/18 ,  H03H7/01 ,  H01R13/7195 ,  H01G4/40 ,  H01G4/35 ,  H01G4/06 ,  H03H1/00

    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

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