摘要:
A mounting apparatus for a fan includes a bracket, and a fan lid. The bracket includes two opposite locking plates for holding the fan therebetween. Each of the locking plates defines a locking hole therein. The fan lid includes a body attached to the fan, and a pair of resilient securing portions extending from the body. Each of the securing portions includes a vertical portion that protrudes a protrusion for being engaged in a corresponding locking hole of the bracket, and a horizontal portion forming an operation member for being pulled when disassembling the fan from the bracket.
摘要:
An electronic device includes a cage, a hood, a fastener, and a resilient member. The hood is detachably secured to the cage. The hood includes a first post and a second post extending downwardly from a side thereof respectively. The fastener is movably mounted to the cage. The fastener includes a first guiding surface for the first post sliding thereon during assembling the hood to the cage, and a second guiding surface for the second post sliding thereon during removing the hood from the cage. The resilient member is connected between the fastener and the cage.
摘要:
A fixing mechanism for a button includes a shelf (11) and a bracket (80). The bracket includes a body (81). A pair of spaced apart first resilient arms (85) extends from an edge of the body 81, and a second resilient arm (83) extends from the edge between the first resilient arms. A free end of each first resilient arm is attached to the shelf, and the second resilient arm is for holding the button.
摘要:
An ejection assembly as shown is used for rapidly ejecting a motherboard (10) from a server chassis (20). The ejection assembly includes a tray (30) for supporting the motherboard, and an ejector (40). A connector (22) is disposed in the chassis. The ejector is pivotally mounted to the tray, and includes an ejecting portion (48) to abut against a front edge of a bottom plate (24) of the chassis when the motherboard is electronically connected to the connector of the chassis. The ejector is pivoted outwardly so that the ejecting portion presses the front edge of the bottom plate to draw the tray outwardly, the motherboard is thereby horizontally and rapidly ejected from the connector of the chassis.
摘要:
A process for removing a Group I or Group II metal species from a surface of a semiconductor substrate. The process comprises exposing the surface to a gaseous reactant mixture comprising HF, a second compound and a silane compound, and removing volatile products from the surface. The invention is further directed to a process for etching oxides from a semiconductor substrate comprising exposing the surface to a gaseous reactant mixture comprising HF, a second compound and a silane compound, and removing volatile products from the surface.
摘要:
A process for removing metallic material, for instance copper, iron, nickle and their oxides, from a surface of a substrate such as a silicon, silicon oxide or gallium arsenide substrate. The process includes the steps of: a) placing the substrate in a reaction chamber; b) providing in the reaction chamber a gas mixture, the mixture comprising a first component which is fluorine or a fluorine-containing compound, which will spontaneously dissociate upon adsorption on the substrate surface and a second component which is a halosilane compound, the halosilane, and the fluorine if present, being activated by: i) irradiation with UV; ii) heating to a temperature of about 800.degree. C. or higher; or iii) plasma generation, to thereby convert said metallic material to a volatile metal-halogen-silicon compound, and c) removing the metal-halogen-silicon compound from the substrate by volatilization. The process may be used to remove both dispersed metal and bulk metal films or islands.
摘要:
The present invention belongs to the field of technology known as powder injection moulding. It includes producing a part by powder injection moulding at low to high injection pressure and it discloses a novel binder system for optimized feedstock design. The primary subject matter of the invention resides in introducing a secondary main binder into the feedstock binder composition, meeting, simultaneously, the five (5) following criteria: partially soluble in the primary binder, soluble in water, thermally evaporable, possessing a dispersant functionality and increasing the viscosity at near zero feedstock shear rate. In addition to this binder, the feedstock may contain a small fraction of another dispersant and a back-bone polymer when needed, depending on the type of powder material used for the feedstock. Based on the main modes of binder removal (thermal or water extraction) this novel binder system is denominated as Te-Wex™ system. Using this binder concept feedstocks with a wide variety of powders, including alumina, zirconia, silicon nitride, stainless steel and low-alloyed steel could be prepared and subsequently injected using the MPIM (Medium pressure Powder Injection Moulding) technique into one- or multiple cavity tools to make parts of variable thickness. These parts could be debinded either by partial water extraction and/or thermal evaporation and sintered to final density of over 99 vol % of the respective theoretical values.
摘要:
An assembly includes a circuit board, a support perpendicular to the circuit board, and a mounting apparatus including a sliding bracket to accommodate an expansion card, a driving member pivotably mounted to the second support, and a clamping arm mounted to the sliding bracket. The sliding bracket is slidably mounted to the second support, and the driving member is fixed to the sliding bracket. The clamping arm is operable to press or release the expansion card. When the driving member is moved in a first direction, the sliding bracket is moved towards the circuit board, and the expansion card is moved to connect to the circuit board. When the driving member is moved in a second direction opposite to the first direction, the sliding bracket is moved away from the circuit board, and the expansion card disengages from the circuit board.
摘要:
A mounting apparatus includes a bracket defining a clamping hole, a receiving rack, a connecting member fixed to the receiving rack, a receiving member fixed to the connecting member, and a latching unit. The latching unit includes a pivoting member pivotably mounted to the receiving member, a first resilient member, a second resilient member, a rotating member pivotably mounted to the pivoting member, a contact member abutting against the rotating member, and a hooking member clamped to the rotating member. The contact member and the hooking member are slidably mounted to opposite ends of the pivoting member, respectively, and can be moved towards each other. The first resilient member resists against the pivoting member and the hooking member to return the hooking member back. The second member resists against the pivoting member and the contact member to return the contact member back.
摘要:
A hard disk drive holder includes main body, spindle slidably mounted to the main body, handle rotatably connected to the main body via the spindle, and hook slidably mounted to the main body. The handle includes claw and locking tongue. The handle rotates between closed and opened positions. When the handle is at closed position, if the spindle slides from a first position to a second position, the locking tongue gradually extends out of the main body. When the handle rotates to closed position, if the spindle isn't at first position, the claw engages with a blocking piece of the hook and compels the hook to slide from a third position towards a fourth position until the claw goes over the blocking piece. A first spring biases the spindle to second position. A second spring biases the handle to opened position. A third spring biases the hook to third position.