公开(公告)号：US20220287196A1

公开(公告)日：2022-09-08

申请号：US17249449

申请日：2021-03-02

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz ,  Michael Hanson

IPC: H05K7/14

Abstract: Examples described herein relate to a securing sub-system. The securing sub-system includes a lever and a cam assembly engaged with the lever. The cam assembly is movable due to a pivotal movement of the lever and includes a cam body, a cantilevered arm, and a load support member. The cantilevered arm extends from the cam body and is deformable when the cantilevered arm contacts a restrictive structure. The load support member disposed on the insertion cam. A portion of the load support member is offset from an open end of the cantilevered arm to limit deformation of the cantilevered arm. Further, some examples described herein relate to a securing system including a plurality of securing sub-systems coupled via a synchronous movement link is also presented. Moreover, certain examples described herein relate to a computing system including at least one such securing sub-system.

公开(公告)号：US20210088735A1

公开(公告)日：2021-03-25

申请号：US16948726

申请日：2020-09-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kevin Leigh ,  Everett Salinas ,  John Franz

IPC: G02B6/38 ,  H01R12/70 ,  G02B6/44

Abstract: Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.

公开(公告)号：US20210033226A1

公开(公告)日：2021-02-04

申请号：US16579254

申请日：2019-09-23

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Tahir Cader

IPC: F16L21/03 ,  H05K7/20

Abstract: Hose barb fittings and apparatuses described herein provide increased fluid-flow rates for cooling loops used for thermal control in computer system. A hose barb fitting comprises a fluid-flow passage that extends through the hose barb fitting from a first opening to a second opening. The ratio of the cross-sectional area of the fluid-flow passage to the cross-sectional area of the hose barb fitting is between 0.4 and 0.7, inclusive. When the hose barb fitting is fully seated within a housing structure, a specialized gasket acts as both a radial seal and a face seal. Also, a flange extending from the housing structure engages with a flange extending from the hose barb fitting to prevent the hose barb fitting from being unseated.

公开(公告)号：US10888031B2

公开(公告)日：2021-01-05

申请号：US15714811

申请日：2017-09-25

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Vincent W Michna

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/473 ,  H05K7/14 ,  H05K1/18 ,  G06F1/18 ,  G11C29/56 ,  G06F13/00 ,  G11C5/04

Abstract: An example memory device includes a printed circuit board, a case, a bus, and memory modules. The case includes a number of walls, and at least some of the walls and the printed circuit board together form a liquid coolant chamber that is liquid-tight (excluding any hose connectors). The bus includes memory sockets connected to the printed circuit board and located within the liquid coolant chamber, and the memory modules are installed in the memory sockets and within the liquid coolant chamber. The bus also includes a connector to connect to a memory bus of a main printed circuit board of a computing device, the connector being external to the liquid coolant chamber.

公开(公告)号：US10809466B2

公开(公告)日：2020-10-20

申请号：US16192445

申请日：2018-11-15

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kevin Leigh ,  Everett Salinas ,  John Franz

IPC: G02B6/38 ,  G02B6/36 ,  H01R12/70 ,  G02B6/44

Abstract: Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.

公开(公告)号：US20200315062A1

公开(公告)日：2020-10-01

申请号：US16371956

申请日：2019-04-01

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kevin B. Leigh ,  Everett R. Salinas ,  John Franz

IPC: H05K7/20 ,  F28F9/013

Abstract: In some examples, a receiving bay includes a first heat transfer member that is moveable along a first axis, and a retainer to restrict movement of the first heat transfer member along a second axis different from the first axis. The first heat transfer member is to contact a second heat transfer member of a device when inserted in the receiving bay, the first heat transfer member moveable along the first axis by the contact with the second heat transfer member as the device is inserted in the receiving bay.

公开(公告)号：US10763191B1

公开(公告)日：2020-09-01

申请号：US16438271

申请日：2019-06-11

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz ,  Harvey Lunsman ,  Steven Dean

IPC: H05K7/20 ,  G06F1/20 ,  F28F7/00 ,  H01L23/473 ,  F28D15/02 ,  F16F1/02

Abstract: Systems and apparatus are provided for thermal cooling of integrated circuits, such as dual in-line memory modules (DIMMs). The apparatus includes a plurality of rows pieces that include individual leaf springs. Each of the leaf springs can exert compression to support thermal contact and a stable coupling with a received DIMM. The plurality of row pieces can be assembled to form a single structure, having a space to receive an individual DIMM for insertion. Further, each of the leaf springs are structured to allow a portion of its surface, having a conductive material disposed thereon, to support transfer of heat away from the DIMM at a point of thermal contact. The apparatus can be coupled to a printed circuit assembly (PCA) having additional cooling mechanisms installed thereon, in a manner that allows the additional cooling mechanisms to be integrated with the apparatus and provide increased thermal cooling for the DIMMs.

公开(公告)号：US10705578B2

公开(公告)日：2020-07-07

申请号：US16191916

申请日：2018-11-15

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  William K. Norton ,  Ernesto Ferrer Medina

IPC: G06F1/20 ,  H05K1/02 ,  H05K7/20 ,  G11C5/04 ,  H01L27/108 ,  H01L23/473 ,  H01L23/427

Abstract: A system for cooling memory modules mounted in parallel on a printed circuit board may include a coolant tube installed in parallel between two of the memory modules, and a heat spreader disposed in parallel between the two memory modules. The heat spreader may include a base having an outer surface thermally coupled to the coolant tube and first and second fins. The first fin has a first spring force toward a first of the two memory modules. The first spring force causes the first fin to provide contact pressure to the first memory module to thermally couple the first fin and the first memory module. The second fin has a second spring force toward a second of the two memory modules. The second spring force causes the second fin to provide contact pressure to the second memory module to thermally couple the second fin and the second memory module.

公开(公告)号：US10579115B2

公开(公告)日：2020-03-03

申请号：US16139109

申请日：2018-09-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Thomas Robert Bowden ,  Alan B Doerr ,  John Franz ,  Melvin K Benedict ,  Joseph Allen ,  John Norton ,  Binh Nguyen

IPC: G06F1/20 ,  G06F1/18 ,  H01L23/367 ,  H01L23/40 ,  G06F13/42

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

公开(公告)号：US20190227606A1

公开(公告)日：2019-07-25

申请号：US16369144

申请日：2019-03-29

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz ,  Tahir Cader ,  Cullen E. Bash ,  Niru Kumari ,  Sarah Anthony ,  Sergio Escobar-Vargas ,  Siamak Tavallaei

IPC: G06F1/20 ,  H05K7/20

Abstract: Apparatuses associated with liquid coolant supply are disclosed. One example apparatus is a computing cartridge which includes a first electronic device and a liquid-cooled cold plate. The computing cartridge also includes a first thermal couple between the first electronic device and the cold plate. The computing cartridge also includes an inlet fluid connector. The inlet fluid connector may supply a liquid coolant to the cold plate. The computing cartridge also includes an outlet fluid connector. The outlet fluid connector may facilitate return of the coolant from the cold plate.