公开(公告)号：US20190025896A1

公开(公告)日：2019-01-24

申请号：US16139109

申请日：2018-09-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Thomas Robert Bowden ,  Alan B. Doerr ,  John Franz ,  Melvin K. Benedict ,  Joseph Allen ,  John Norton ,  Binh Nguyen

IPC: G06F1/20 ,  G06F13/42 ,  G06F1/18 ,  H01L23/40 ,  H01L23/367

CPC classification number: G06F1/206 ,  G06F1/185 ,  G06F1/20 ,  G06F13/42 ,  H01L23/367 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

公开(公告)号：US20180049340A1

公开(公告)日：2018-02-15

申请号：US15788519

申请日：2017-10-19

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kevin D. Conn ,  Keith J Kuehn ,  Thomas Robert Bowden

IPC: H05K7/14 ,  G06F1/18

CPC classification number: H05K7/1489 ,  G06F1/181 ,  G06F1/183

Abstract: A top loading cartridge is provided herein. The top loading cartridge includes a support member, a rail member, and a lock mechanism. The support member to receive an electronic module. The rail member attached to the support member to engage with a tray that receives the top loading server cartridge. The lock mechanism to lock the top loading cartridge.

公开(公告)号：US10579115B2

公开(公告)日：2020-03-03

申请号：US16139109

申请日：2018-09-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Thomas Robert Bowden ,  Alan B Doerr ,  John Franz ,  Melvin K Benedict ,  Joseph Allen ,  John Norton ,  Binh Nguyen

IPC: G06F1/20 ,  G06F1/18 ,  H01L23/367 ,  H01L23/40 ,  G06F13/42

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

公开(公告)号：US10178807B2

公开(公告)日：2019-01-08

申请号：US14780521

申请日：2013-03-26

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kevin D Conn ,  Keith J Kuehn ,  Thomas Robert Bowden

IPC: H05K7/20 ,  G06F1/18 ,  H05K7/14

Abstract: A top loading cartridge is provided herein. The top loading cartridge includes a support member, a rail member, and a lock mechanism. The support member to receive an electronic module. The rail member attached to the support member to engage with a tray that receives the top loading server cartridge. The lock mechanism to lock the top loading cartridge.

公开(公告)号：US10114433B2

公开(公告)日：2018-10-30

申请号：US15120511

申请日：2014-04-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Thomas Robert Bowden ,  Allen B Doerr ,  John Franz ,  Melvin K Benedict ,  Joseph Allen ,  John Norton ,  Binh Nguyen

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/18 ,  H01L23/367 ,  H01L23/40 ,  G06F13/42

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.