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公开(公告)号：USD638809S1
公开(公告)日：2011-05-31
申请号：US29378856
申请日：2010-11-10
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32.发明申请公开(公告)号：US20070056157A1
公开(公告)日：2007-03-15
申请号：US10596218
申请日：2005-08-31
CPC分类号： B23K3/087 , B23K37/047 , H01L2224/75502 , Y10T29/49004 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53187
摘要： A method of controlling contact load in an apparatus for mounting electronic components on a substrate includes moving a head holding an electronic component down by a predetermined distance. Contact load is measured after moving the head down. A determination is made as to whether the measured contact load has reached the target contact load. The moving and measuring are repeated until the measured contact load reaches the predetermined target contact load.
摘要翻译： 在将电子部件安装在基板上的装置中控制接触负荷的方法包括将保持电子部件的头部向下移动预定距离。 在向下移动头后测量接触负载。 确定测量的接触载荷是否达到目标接触载荷。 重复移动和测量，直到测得的接触载荷达到预定的目标接触载荷。
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公开(公告)号：USD657757S1
公开(公告)日：2012-04-17
申请号：US29378850
申请日：2010-11-10
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34.发明申请公开(公告)号：US20120044669A1
公开(公告)日：2012-02-23
申请号：US13265821
申请日：2011-03-11
申请人： Toshifumi Ogata , Kenji Sugiura , Makoto Morikawa
发明人： Toshifumi Ogata , Kenji Sugiura , Makoto Morikawa
CPC分类号： F21K9/90 , F21K9/23 , F21V3/00 , F21V17/101 , F21V19/005 , F21V19/0055 , F21V29/507 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/54 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/3025 , H05K3/284 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： Provided is a light-emitting module, a light source device and a liquid crystal display device in which unevenness in the luminance and color hardly occurs as compared to conventional technology. A light-emitting module 100 is structured such that a plurality of element columns, each composed of light-emitting elements 120 arranged in line, are mounted on a substrate 110, and each element column is individually sealed by a separate sealing member 130. The light source device and the liquid crystal device each include the above light-emitting module 100.
摘要翻译： 提供了与传统技术相比，发光模块，光源装置和液晶显示装置，其中亮度和颜色的不均匀性几乎不发生。 发光模块100被构造为使得由衬底110上安装有排列成一行的发光元件120构成的多个元件列，并且通过单独的密封构件130分别密封各元件柱。 光源装置和液晶装置各自包括上述发光模块100。
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公开(公告)号：USD642997S1
公开(公告)日：2011-08-09
申请号：US29378924
申请日：2010-11-11
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公开(公告)号：US07748112B2
公开(公告)日：2010-07-06
申请号：US11792235
申请日：2005-12-06
IPC分类号： H05K3/30
CPC分类号： H01L23/544 , H01L21/563 , H01L21/67144 , H01L21/67253 , H01L21/67259 , H01L24/75 , H01L24/81 , H01L25/50 , H01L2223/54426 , H01L2223/5448 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/13144 , H01L2224/16 , H01L2224/75 , H01L2224/759 , H01L2224/81121 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2225/06513 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/14 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53039 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A component mounting apparatus has a stage 41 with a fixed height position for holding a substrate 5, and a mounting head 48 that releasably holds a component 2, is moved downward toward the stage 41 from a first reference height position HB1 fixedly positioned above the stage 41, and mounts the held component 2 on the substrate 5 or an already mounted component 2. A controller 14 has a mounting reference height calculation unit 103 for calculating a mounting reference height Hn corresponding to a distance from the first reference height position HB1, and a first target movement height calculation unit 104 for calculating a first target movement height ZTAGn based on at least the mounting reference height Hn and a thickness PTn of the component 2 held by the mounting head 48. The controller 14 moves the mounting head 48 holding the component 2 downward from the first reference height position HB1 to the first target movement height ZTAGn to mount the held component 2 on the substrate 5 or the already mounted component 2.
摘要翻译： 部件安装装置具有用于保持基板5的固定高度位置的台架41和可释放地保持部件2的安装头部48从固定地位于台架上方的第一基准高度位置HB1向下移动到台架41 控制器14具有安装基准高度计算部103，用于计算与第一基准高度位置HB1的距离对应的安装基准高度Hn，以及 第一目标移动高度计算单元104，用于基于至少安装基准高度Hn和由安装头48保持的部件2的厚度PTn来计算第一目标移动高度ZTAGn。控制器14使安装头48保持 组件2从第一参考高度位置HB1向下移动到第一目标移动高度ZTAGn以将保持的组件2安装在基板5上 或已经安装的组件2。
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37.发明授权公开(公告)号：US07513036B2
公开(公告)日：2009-04-07
申请号：US10596218
申请日：2005-08-31
IPC分类号： H05K3/30
CPC分类号： B23K3/087 , B23K37/047 , H01L2224/75502 , Y10T29/49004 , Y10T29/4913 , Y10T29/49133 , Y10T29/49137 , Y10T29/53187
摘要： A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to slow down starting position where there is no risk that the electronic component makes contact with the substrate (S1), and from there the head is lowered at low speed until a predetermined target contact load is detected. The process of lowering the head at low speed includes the steps of moving down the head a predetermined distance (S3), measuring load after the step of moving down the head (S5), and determining whether the measured contact load has reached the target contact load (S9). The steps of moving down the head (S3) and measuring the load (S5) are repeated until the measured load reaches the target contact load. The actual load is precisely controlled to be close to a very small set level of target contact load. Accordingly, electronic components using low dielectric constant material are mounted without the risk of damage.
摘要翻译： 一种控制用于将电子部件安装在基板上的装置中的接触负载的方法，其中头部以高速降低以减慢起始位置，其中电子部件不接触基板的风险（S1）;以及 从那里头部以低速降低，直到检测到预定的目标接触负载。 低速降低头部的处理包括以下步骤：使头部向下移动预定距离（S3），测量头部向下移动步骤后的负载（S5），以及确定所测量的接触负载是否已达到目标接触 负载（S9）。 重复下降头部（S3）和测量负载（S5）的步骤，直到测量的负载达到目标接触负载。 实际负载被精确地控制为接近非常小的目标接触负载的设定水平。 因此，使用低介电常数材料的电子部件安装而不会有损坏的危险。
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公开(公告)号：US20080127486A1
公开(公告)日：2008-06-05
申请号：US11792235
申请日：2005-12-06
IPC分类号： H05K3/30
CPC分类号： H01L23/544 , H01L21/563 , H01L21/67144 , H01L21/67253 , H01L21/67259 , H01L24/75 , H01L24/81 , H01L25/50 , H01L2223/54426 , H01L2223/5448 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/13144 , H01L2224/16 , H01L2224/75 , H01L2224/759 , H01L2224/81121 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2225/06513 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/14 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53039 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A component mounting apparatus has a stage 41 with a fixed height position for holding a substrate 5, and a mounting head 48 that releasably holds a component 2, is moved downward toward the stage 41 from a first reference height position HB1 fixedly positioned above the stage 41, and mounts the held component 2 on the substrate 5 or an already mounted component 2. A controller 14 has a mounting reference height calculation unit 103 for calculating a mounting reference height Hn corresponding to a distance from the first reference height position HB1, and a first target movement height calculation unit 104 for calculating a first target movement height ZTAGn based on at least the mounting reference height Hn and a thickness PTn of the component 2 held by the mounting head 48. The controller 14 moves the mounting head 48 holding the component 2 downward from the first reference height position HB1 to the first target movement height ZTAGn to mount the held component 2 on the substrate 5 or the already mounted component 2.
摘要翻译： 部件安装装置具有用于保持基板5的固定高度位置的台架41和可释放地保持部件2的安装头部48从第一基准高度位置HB < / SUB>固定在台41上方，并将保持的部件2安装在基板5上或已经安装的部件2上。 控制器14具有安装基准高度计算单元103，用于计算与从第一参考高度位置HB 1> 1的距离相对应的安装基准高度H SUB n和第一目标 运动高度计算单元104，用于基于至少安装基准高度H n n n和厚度PT N n N计算第一目标移动高度ZTAG
由安装头48保持的部件2。 控制器14将保持组件2的安装头48从第一参考高度位置HB <1>向下移动到第一目标移动高度ZTAG 以将保持的组件2安装在 基板5或已经安装的部件2。 -
公开(公告)号：US5381345A
公开(公告)日：1995-01-10
申请号：US935994
申请日：1992-08-27
CPC分类号： G06F17/5022 , G06F17/5081
摘要： A circuit layout pattern inspection method and a logical simulator for implementing the same. Wiring is substituted by a .pi. or T equivalent circuit and is described by a nodal equation, and a gate is described by a simplified model, that is, a current source calculation formula. By the nodal equation and the current source calculation formula, a simulation is performed to obtain a delay time for every node. The obtained delay time is stored to make the inspection easy.
摘要翻译： 电路布局图案检查方法及其实现方法。 接线由pi或T等效电路代替，并由节点方程描述，并且门由简化模型描述，即电流源计算公式。 通过节点方程和电流源计算公式，进行模拟以获得每个节点的延迟时间。 存储所获得的延迟时间以使检查变得容易。
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