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37 条记录 (耗时 0.038 秒)

    STATIC TRANSFER SWITCH DEVICE, POWER SUPPLY APPARATUS USING THE SWITCH DEVICE AND SWITCHING METHOD THEREOF
    33.
    发明申请
    STATIC TRANSFER SWITCH DEVICE, POWER SUPPLY APPARATUS USING THE SWITCH DEVICE AND SWITCHING METHOD THEREOF 有权
    静态转换开关装置，使用开关装置的电源装置及其切换方法

    公开(公告)号：US20100264743A1

    公开(公告)日：2010-10-21

    申请号：US12740895

    申请日：2008-10-31

    申请人： Hyun-Chul Jung ,  Jung-Bong Kim

    发明人： Hyun-Chul Jung ,  Jung-Bong Kim

    IPC分类号： H02J4/00 ,  H03K17/56

    CPC分类号： H02J9/061 ,  H01H9/541 ,  H01H2300/018 ,  Y10T307/696 ,  Y10T307/729

    摘要： Disclosed is a static transfer switch with a modified structure that can selectively supply power from power sources to a load stably and continuously, a power supplying apparatus employing the same, and a switching method thereof. The present invention includes mechanical/electrical contact point switches in parallel to semiconductor switches, and minimizes operation time of the semiconductor switches by turning on/off the mechanical or electrical contact point switches together when the semiconductor switches are turned on/off to reduce a failure rate of the semiconductor switch. Also, the static transfer switch makes a switching unit electrically/mechanically separable from a power source with failure to switch a power supply path and thereby prevent superposition caused by the switching unit. This prevents a problem caused when electrical or mechanical contact point switches simply in parallel, that is, a problem that power sources are turned on simultaneously when the power supply paths are switched.

    摘要翻译： 公开了一种具有改变结构的静态转移开关，其可以选择性地从电源向负载稳定且持续地供给电力，使用该电力的供电装置及其切换方法。 本发明包括与半导体开关并联的机械/电接触点开关，并且通过在半导体开关导通/断开时将机械或电接触点开关接通/断开来最小化半导体开关的操作时间以减少故障 半导体开关的速率。 此外，静电转换开关使得切换单元电/机械地与电源分离，而不能切换电源路径，从而防止由开关单元引起的叠加。 这防止了当电或机械接触点简单并联时引起的问题，即当切换电源路径时电源同时接通的问题。

    Surface treatment method, circuit lines formation method, circuit lines formation apparatus, and printed circuit board formed thereby
    34.
    发明授权
    Surface treatment method, circuit lines formation method, circuit lines formation apparatus, and printed circuit board formed thereby 失效
    表面处理方法，电路线形成方法，电路线形成装置和由此形成的印刷电路板

    公开(公告)号：US07682652B2

    公开(公告)日：2010-03-23

    申请号：US11278205

    申请日：2006-03-31

    申请人： Yoon-Ah Baik ,  Hyun-Chul Jung

    发明人： Yoon-Ah Baik ,  Hyun-Chul Jung

    IPC分类号： B05D5/12

    CPC分类号： H05K3/125 ,  H05K3/1208 ,  H05K3/381 ,  H05K2203/013 ,  H05K2203/0793 ,  H05K2203/1157 ,  Y10T29/49124

    摘要： The present invention relates to a method of surface treatment, a method for forming circuit lines, a printed circuit board formed thereby, and an apparatus for forming circuit lines on a substrate, wherein fine circuit lines are formed simply, rapidly, and economically. The method for forming circuit lines of the present invention comprises: (a) selectively applying a surface treatment solution which includes an alkali metal compound on a base film in accordance with circuit patterns by a discharging method; (b) applying a conductive ink which includes metal nanoparticles in accordance with the surface-treated circuit pattern; and (c) curing the base film on which the conductive ink is applied under a reduction atmosphere lines.

    摘要翻译： 本发明涉及一种表面处理方法，一种形成电路线的方法，由此形成的印刷电路板，以及用于在基板上形成电路线的装置，其中简单，快速和经济地形成精细电路线。 本发明的电路线形成方法包括：（a）通过放电方法根据电路图案在基膜上选择性地施加包含碱金属化合物的表面处理溶液; （b）根据表面处理的电路图案涂覆包括金属纳米颗粒的导电油墨; 和（c）在还原气氛线下固化其上施加有导电油墨的基膜。

    Supercapacitor and manufacturing method thereof
    36.
    发明申请
    Supercapacitor and manufacturing method thereof 失效
    超级电容器及其制造方法

    公开(公告)号：US20090027828A1

    公开(公告)日：2009-01-29

    申请号：US12155538

    申请日：2008-06-05

    申请人： Hyun-Chul Jung ,  Sang-Yool Lee ,  Young-Kwan Lee

    发明人： Hyun-Chul Jung ,  Sang-Yool Lee ,  Young-Kwan Lee

    IPC分类号： H01G9/025 ,  B05D5/12 ,  B05D3/14

    CPC分类号： H01G9/045 ,  H01G9/0032 ,  H01G9/0036 ,  Y02E60/13

    摘要： A supercapacitor and a manufacturing method thereof are disclosed. With manufacturing method of Supercapacitor including: arranging a plurality of filters to be spaced at a designated interval apart, forming a first plating layer connecting one end of the filter, forming a second plating layer lengthened along the filter from the first plating layer, polymerizing to form a conductive polymer layer between the second plating layer, and removing the filter, capacitance (C), power (kw) and energy (E) can be increased as the space for absorbing electrons is widened, by making the surface area of an electrode wider than the a general film.

    摘要翻译： 公开了一种超级电容器及其制造方法。 利用超级电容器的制造方法，其特征在于，包括：以规定的间隔排列多个滤波器，形成连接所述滤波器一端的第一镀层，形成沿着所述第一镀层沿着所述过滤器延长的第二镀层，聚合成 在第二镀层之间形成导电聚合物层，并且除去过滤器之后，可以通过使电极的表面积变宽来增加电容（C），功率（kw）和能量（E），因为吸收电子的空间变宽 比一般电影宽。

    Method for manufacturing cover lay of printed circuit board
    37.
    发明申请
    Method for manufacturing cover lay of printed circuit board 审中-公开
    制造印刷电路板盖板的方法

    公开(公告)号：US20080081125A1

    公开(公告)日：2008-04-03

    申请号：US11902486

    申请日：2007-09-21

    申请人： Hyun-Chul Jung ,  Jae-Woo Joung ,  Hye-Jin Cho ,  Yoon-Ah Baik ,  Sung-Il Oh

    发明人： Hyun-Chul Jung ,  Jae-Woo Joung ,  Hye-Jin Cho ,  Yoon-Ah Baik ,  Sung-Il Oh

    IPC分类号： C23C18/00 ,  H05H1/00

    CPC分类号： H05K3/28 ,  H05K3/0091 ,  H05K2203/013

    摘要： A method for manufacturing cover lay of printed circuit board is disclosed. With a method that includes preparing a board on which a circuit pattern is formed, and jetting a protecting ink selectively on the board by inkjet printing, a cover lay of a complicated shape may be formed easily with high accuracy and high productivity, as a polymer ink is jetted by inkjet printing to form the cover lay for a flexible circuit board.

    摘要翻译： 公开了印刷电路板盖板的制造方法。 通过包括制备在其上形成电路图案的板并且通过喷墨印刷在板上选择性地喷射保护油墨的方法，可以以高精度和高生产率容易地形成复杂形状的盖板作为聚合物 通过喷墨打印喷墨，形成柔性电路板的盖板。