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    Use of molding materials based on vinyl aromatic/diene block copolymers for 3-D-printing
    31.
    发明授权
    Use of molding materials based on vinyl aromatic/diene block copolymers for 3-D-printing 有权

    公开(公告)号：US11130276B2

    公开(公告)日：2021-09-28

    申请号：US15105853

    申请日：2014-12-18

    Applicant: INEOS STYROLUTION GROUP GMBH

    Inventor： Norbert Niessner ,  Frank Eisentraeger

    IPC: B29C64/118 ,  B33Y70/00 ,  C08L25/04 ,  C08L53/02 ,  B33Y10/00 ,  B29K25/00 ,  B29K105/00

    Abstract: The invention relates to the use of molding materials for 3-D printing, containing components A, B1, B2, and C, wherein: A:5 to 100 wt % of at least one vinyl aromatic/diene block copolymer A, containing: a) 30 to 95 wt % of at least one vinyl aromatic and b) 5 to 70 wt % of at least one diene, B1:0 to 95 wt % of at least one polymer B1 selected from the group comprising standard polystyrene, high-impact polystyrene (HIPS), styrene/acrylonitrile copolymers, α-methylstyrene/acrylonitrile copolymers, styrene/maleic anhydride copolymers, styrene/phenylmaleimide copolymers, styrene/methylmethacrylate copolymers, styrene/acrylonitrile/maleic anhydride copolymers, styrene/acrylonitrile/phenylmaleimide copolymers, methylstyrene/acrylonitrile/methylmethacrylate copolymers, α-methylstyrene/acrylonitrile/t-butyl methacrylate copolymers, and styrene/acrylonitrile/t-butyl methacrylate copolymers, B2:0 to 60 wt % of one or more further polymers B2 selected from: polycarbonates, polyamides, poly(meth)acrylates, polyesters, semicrystalline polyolefins, and polyvinyl chloride, C:0 to 50 wt % of common additives and auxiliary agents, wherein the viscosity (measured as per ISO 11443) of the molding material at shear rates of 1 to 10 1/s and at temperatures of 250° C. is not greater than 1×105 Pa*s and the melt volume rate (MVR, measured as per ISO 1133 at 220° C. and 10 kg load) is more than 6 ml/10 min.

    High heat resistant ABS molding composition
    37.
    发明授权
    High heat resistant ABS molding composition 有权

    公开(公告)号：US11603464B2

    公开(公告)日：2023-03-14

    申请号：US16970033

    申请日：2019-02-13

    Applicant: INEOS STYROLUTION GROUP GMBH

    Inventor： Norbert Niessner ,  Gisbert Michels ,  KwanHee Lee ,  Shridhar Madhav ,  Kirit Gevaria ,  Nirmalendu Debata

    IPC: C08L55/02 ,  C08L25/12 ,  C08L25/14 ,  C08L25/16 ,  C08L35/06 ,  C08L53/02

    Abstract: High heat resistant ABS molding compositions for use in the automotive sector, electronics, and household or healthcare sector comprising: (A) 15 to 35 wt.-% ABS graft copolymer (A); (B) 15 to 35 wt.-% a-methylstyrene/acrylonitrile copolymer (B) (weight ratio 95:5 to 50:50); (C) 20 to 40 wt.-% styrene/acrylonitrile copolymer (C) (weight ratio 95:5 to 50:50; Mw 150,000 to 300,000); (D) 10 to 30 wt.-% random terpolymer (D) made from 13 to 27 wt.-% α, β ethylenically unsaturated cyclic anhydride, 60 to 74 wt.-% aromatic vinyl monomer, and 13 to 27 wt.-% maleimide monomer); (E) 0.1 to 5 wt.-%, of at least one elastomeric block copolymer (E) comprising a vinylaromatic monomer block S and an elastomeric random diene/vinylaromatic onomer block B/S; hard phase proportion is 1 to 40 vol.-% and the diene proportion is less than 50 wt.-%; and (F) 0 to 5 wt.-% of further additives and/or processing aids (F).

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