Warpage mitigation structures created on substrate using high throughput additive manufacturing

    公开(公告)号:US11233015B2

    公开(公告)日:2022-01-25

    申请号:US16638741

    申请日:2017-09-30

    Inventor: Feras Eid

    Abstract: Device package and method of forming a device package are described. The device package has a substrate with dies disposed on the substrate. Each die has a bottom surface that is electrically coupled to the substrate and a top surface. The device package further includes a plurality of stiffeners disposed directly on the substrate. The stiffeners may be directly attached to a top surface of the substrate without an adhesive layer. The device package may include stiffeners with one or more different sizes and shapes, including at least one of a rectangular stiffener, a picture frame stiffener, a L-shaped stiffener, a H-shaped stiffener, and a round pillar stiffener. The device package may have the stiffeners disposed on the top surface of the substrate using a cold spray process. The device package may also include a mold layer formed around and over the dies, the stiffeners, and the substrate.

    INTEGRATED CIRCUIT DIE PACKAGES INCLUDING A CONTIGUOUS HEAT SPREADER

    公开(公告)号:US20210407877A1

    公开(公告)日:2021-12-30

    申请号:US16911820

    申请日:2020-06-25

    Abstract: A contiguous integrated heat spreader suitable for an integrated circuit (IC) die package. Heat spreader material may be deposited with a high throughput additive manufacturing (HTAM) technique directly upon a surface of an IC die, and over a portion of a package substrate beyond an edge of the IC die. The contiguous heat spreader may have high thermal conductivity and offer low thermal resistance in absence of any intervening thermal interface material (TIM). The contiguous heat spreader may span multiple IC die and accommodate different die heights. The heat spreader may be contiguous with multiple die. Heat spreader material may be absent where thermal breaks within the heat spreader are advantageous.

    Adaptable displays using piezoelectric actuators

    公开(公告)号:US11016288B2

    公开(公告)日:2021-05-25

    申请号:US16072161

    申请日:2016-04-01

    Abstract: Embodiments of the invention include a display formed on an organic substrate and methods of forming such a device. According to an embodiment, an array of pixel mirrors may be formed on the organic substrate. For example, each of the pixel mirrors is actuatable about one or more axes out of the plane of the organic substrate. Additionally, embodiments of the invention may include an array of routing mirrors formed on the organic substrate. According to an embodiment, each of the routing mirrors is actuatable about two axes out of the plane of the organic substrate. In embodiments of the invention, a light source may be used for emitting light towards the array of routing mirrors. For example, light emitted from the light source may be reflected to one or more of the pixel mirrors by one of the routing mirrors.

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