公开(公告)号：US20220407216A1

公开(公告)日：2022-12-22

申请号：US17354891

申请日：2021-06-22

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Neelam PRABHU GAUNKAR ,  Aleksandar ALEKSOV ,  Veronica STRONG

IPC: H01Q1/22 ,  H05K1/02 ,  H01Q9/04 ,  H01Q13/02 ,  H01L23/498 ,  H01L21/48

Abstract: Embodiments disclosed herein include package substrates with antennas on the core. In an embodiment, a package substrate comprises a core with a first surface and a second surface. In an embodiment, a first conductive plane is formed into the core, where the first conductive plane is substantially orthogonal to the first surface, and a second conductive plane is formed into the core, where the second conductive plane is substantially orthogonal to the first surface. In an embodiment, an antenna is on the core, where the antenna is between the first conductive plane and the second conductive plane.

公开(公告)号：US20220407205A1

公开(公告)日：2022-12-22

申请号：US17349774

申请日：2021-06-16

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Neelam PRABHU GAUNKAR ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN

IPC: H01P3/16 ,  H01Q9/04 ,  H01Q1/22 ,  H01P11/00 ,  H01L23/14 ,  H01L23/15 ,  H01L23/498 ,  H01L23/66 ,  H01L21/48

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to contactless transmission within a package that combines radiating elements with vertical transitions in the package, in particular to a waveguide within a core of the package that is surrounded by a metal ring. A radiating element on one side of the substrate core and above the waveguide surrounded by the metal ring communicates with another radiating element on the other side of the substrate core and below the waveguide surrounded by the metal ring. Other embodiments may be described and/or claimed.

公开(公告)号：US20220406617A1

公开(公告)日：2022-12-22

申请号：US17349673

申请日：2021-06-16

Applicant: Intel Corporation

Inventor： Veronica STRONG ,  Neelam PRABHU GAUNKAR ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01L21/48 ,  H01L23/498

Abstract: Embodiments disclosed herein include a package substrate and methods of fabricating such package substrates. In an embodiment a package substrate comprises a core with a first surface and a second surface opposite from the first surface, and a via through the core. In an embodiment a first pad is over the via, and the first pad is embedded within the core with a third surface that is substantially coplanar with the first surface of the core. In an embodiment, a second pad is over the via, where the second pad is embedded within the core with a fourth surface that is substantially coplanar with the second surface of the core.

公开(公告)号：US20220406523A1

公开(公告)日：2022-12-22

申请号：US17350164

申请日：2021-06-17

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Veronica STRONG ,  Neelam PRABHU GAUNKAR ,  Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Hiroki TANAKA

IPC: H01G4/002

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to creating capacitors at the interface of a glass substrate. These capacitors may be three-dimensional (3-D) capacitors formed using trenches within the glass core of the substrate using laser-assisted etching techniques. A first electrode may be formed on the glass, including on the surface of trenches or other features etched in the glass, followed by a deposition of a dielectric material or a capacitive material. A second electrode may then be formed on top of the dielectric material. Other embodiments may be described and/or claimed.

公开(公告)号：US20200219830A1

公开(公告)日：2020-07-09

申请号：US16714502

申请日：2019-12-13

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING

IPC: H01L23/66 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00 ,  H01L23/64 ,  H01Q1/38

Abstract: Embodiments of the invention include a microelectronic device that includes a transceiver coupled to a first substrate and a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. An interposer substrate can provide a spacing between the first and second substrates.

公开(公告)号：US20200051743A1

公开(公告)日：2020-02-13

申请号：US16606130

申请日：2017-06-27

Applicant: Intel Corporation

Inventor： Thomas L. SOUNART ,  Aleksandar ALEKSOV ,  Feras EID ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN ,  Kristof DARMAWIKARTA

IPC: H01G4/14 ,  H05K1/02 ,  H05K1/03

Abstract: Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers and a capacitor formed in-situ with at least one organic dielectric layer of the plurality of organic dielectric layers. The capacitor includes first and second conductive electrodes and an ultra-high-k dielectric layer that is positioned between the first and second conductive electrodes.

公开(公告)号：US20190334227A1

公开(公告)日：2019-10-31

申请号：US16344717

申请日：2016-12-14

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Telesphor KAMGAING

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/02 ,  H04W88/08

Abstract: Embodiments of the invention include a base station that includes a central transceiver unit (CTU) having a plurality of transceiver cores and a substrate. A printed circuit board (PCB) supports the substrate and at least one antenna unit is coupled to the PCB with at least one of a cable and a waveguide. The at least one antenna unit transmits and receives communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20190288382A1

公开(公告)日：2019-09-19

申请号：US16464678

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Sasha N. OSTER ,  Georgios C. DOGIAMIS

IPC: H01Q1/38 ,  H01Q21/22 ,  H01Q21/00 ,  H01Q1/24

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having organic dielectric material, conductive layers, and a first portion of a distributed antenna unit. The first substrate supports at least one radio frequency (RF) component. A second substrate is coupled to the first substrate. The second substrate is integrated with a housing of the microelectronic device and includes a second portion of the distributed antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20190188976A1

公开(公告)日：2019-06-20

申请号：US16327252

申请日：2016-10-01

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN

IPC: G08B6/00 ,  G06F1/16 ,  H01L23/538 ,  H01L25/18 ,  H01L23/367 ,  G06F1/20 ,  B23K1/20

CPC classification number: G08B6/00 ,  B23K1/203 ,  G04G21/00 ,  G06F1/16 ,  G06F1/163 ,  G06F1/203 ,  G06F3/01 ,  G06F3/016 ,  H01L23/3675 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/18 ,  H04B1/385

Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination; one or more pins attached to each of the plurality of actuators, one end of each of the plurality of pins affixed to the actuators extrudes beyond surface of the wearable device case and is exposed outside of the wearable device case; electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. Other related embodiments are disclosed.

公开(公告)号：US20190006298A1

公开(公告)日：2019-01-03

申请号：US16127820

申请日：2018-09-11

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Brandon M. RAWLINGS ,  Feras EID

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/014 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/00014

Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.