公开(公告)号：US10992021B2

公开(公告)日：2021-04-27

申请号：US15745681

申请日：2015-09-24

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Georgios C. Dogiamis

IPC: H01Q1/22 ,  H01Q1/52

Abstract: Embodiments of the invention may include packaged device that may be used for reducing cross-talk between neighboring antennas. In an embodiment the packaged device may comprise a first package substrate that is mounted to a printed circuit board (PCB). A plurality of first antennas may also be formed on the first package. Embodiments may also include a second package substrate that is mounted to the PCB, and the second package substrate may include a second plurality of antennas. According to an embodiment, the cross-talk between the first and second plurality of antennas is reduced by forming a guiding structure between the first and second packages. In an embodiment the guiding structure comprises a plurality of fins that define a plurality of pathways between the first antennas and the second antennas.

公开(公告)号：US10950919B2

公开(公告)日：2021-03-16

申请号：US16325522

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Aleksandar Aleksov ,  Shawna M. Liff ,  Richard J. Dischler ,  Johanna M. Swan

IPC: H01P5/02 ,  H01P3/12 ,  H01P3/16 ,  H01P1/04 ,  H01P1/02 ,  H01P11/00

Abstract: An apparatus comprises a waveguide section including an outer layer of conductive material tubular in shape and having multiple ends; and a joining feature on at least one of the ends of the waveguide section configured for joining to a second separate waveguide section.

公开(公告)号：US10910305B2

公开(公告)日：2021-02-02

申请号：US16464972

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster

IPC: H01L23/64 ,  H01L23/522 ,  H01G4/33 ,  H01G4/38 ,  H01L23/488 ,  H01L23/50 ,  H01L23/00 ,  H01L49/02 ,  H05K1/16

Abstract: Embodiments of the invention include a microelectronic device that includes a substrate having transistor layers and interconnect layers including conductive layers to form connections to transistor layers. A capacitive bump is disposed on the interconnect layers. The capacitive bump includes a first electrode, a dielectric layer, and a second electrode. In another example, an inductive bump is disposed on the interconnect layers. The inductive bump includes a conductor and a magnetic layer that surrounds the conductor.

公开(公告)号：US10903818B2

公开(公告)日：2021-01-26

申请号：US15089001

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Feras Eid ,  Adel A. Elsherbini ,  Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Valluri R. Rao ,  Johanna M. Swan

IPC: H03H9/54 ,  H03H9/05 ,  H03H9/58 ,  G06F1/18 ,  H03H9/56

Abstract: Embodiments of the invention include a piezoelectric package integrated filtering device that includes a film stack. In one example, the film stack includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The film stack is suspended with respect to a cavity of an organic substrate having organic material and the film stack generates an acoustic wave to be propagated across the film stack in response to an application of an electrical signal between the first and second electrodes.

公开(公告)号：US10886606B2

公开(公告)日：2021-01-05

申请号：US16464678

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Sasha N. Oster ,  Georgios C. Dogiamis

IPC: H01Q1/38 ,  H01Q21/00 ,  H01Q1/24 ,  H01Q21/22 ,  H01L23/66 ,  H01L23/522 ,  H01Q9/04 ,  H01Q19/22 ,  H01L23/498 ,  H01Q1/22 ,  H01Q21/06

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having organic dielectric material, conductive layers, and a first portion of a distributed antenna unit. The first substrate supports at least one radio frequency (RF) component. A second substrate is coupled to the first substrate. The second substrate is integrated with a housing of the microelectronic device and includes a second portion of the distributed antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US10721568B2

公开(公告)日：2020-07-21

申请号：US16096568

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Feras Eid ,  Adel A. Elsherbini ,  Johanna Swan ,  Shawna M. Liff ,  Thomas L. Sounart ,  Sasha N. Oster

IPC: H04R17/00 ,  B06B1/06

Abstract: Embodiments of the invention include an acoustic transducer device having a base structure that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material in contact with a first electrode of the base structure, and a second electrode in contact with the piezoelectric material. In one example, for a transmit mode, a voltage signal is applied between the first and second electrodes and this causes a stress in the piezoelectric material which causes a stack that is formed with the first electrode, the piezoelectric material, and the second electrode to vibrate and hence the base structure to vibrate and generate acoustic waves.

公开(公告)号：US10476545B2

公开(公告)日：2019-11-12

申请号：US15745980

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Brandon M. Rawlings ,  Georgios C. Dogiamis

IPC: H04B1/40 ,  H04B1/00 ,  H01L25/00 ,  H01L23/00

Abstract: Communication is described between integrated circuit packages using a millimeter-wave wireless radio fabric. In one example a first package has a radio transceiver to communicate with a radio transceiver of a second package. The second package has a radio transceiver to communicate with the radio transceiver of the first package. A switch communicates with the first package and the second package to establish a connection through the respective radio transceivers between the first package and the second package. A system board carries the first package, the second package, and the switch.

公开(公告)号：US10462578B2

公开(公告)日：2019-10-29

申请号：US15589203

申请日：2017-05-08

Applicant: Intel Corporation

Inventor： Kevin R. Hoskins ,  Arun P. Jose ,  David Harkness ,  Georgios C. Dogiamis ,  Rajashree Raji Baskaran

IPC: H04R25/00 ,  H04R17/02 ,  H04R1/46 ,  H04R1/26

Abstract: A piezoelectric contact microphone with a mechanical vibration conduction interface provides an improved mobile electronic device microphone. In an embodiment, the mechanical vibration conduction interface is placed on a bone structure and conducts vibration from the bone structure to the piezoelectric contact microphone. Because of the direct contact, this use of piezoelectric contact microphone reduces or eliminates interferences effects due to wind and other airflow over the microphone. The mechanical vibration conduction interface materials and structure are selected to provide effective transmission of vibration from the bone structure to the piezoelectric element within the piezoelectric contact microphone. This piezoelectric contact microphone enables mobile electronic devices to provide improved voice communication, voice transcription, and voice command recognition in the presence of wind noise and other noise.

公开(公告)号：US10461388B2

公开(公告)日：2019-10-29

申请号：US15394990

申请日：2016-12-30

Applicant: INTEL CORPORATION

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Sasha N. Oster

IPC: H04B1/40 ,  H01P3/16 ,  H01P3/12 ,  H01P3/127

Abstract: Radio frequency (RF) data transfer between components in rack mounted systems is facilitated through the use of dielectric waveguides and millimeter Wave (mm-Wave) transceivers. A signal generator provides one or more data signals to a serializer/deserializer (SERDES) which serializes a plurality of parallel data signals to produce a single, serialized, signal containing data from each of the input signals to the SERDES. A mm-Wave die upconverts the serialized signal to a mm-Wave signal and a mm-Wave launcher launches the signal into the dielectric waveguide. At the receiving end the process is reversed such that the mm-Wave signal is first downconverted and passed through a SERDES to provide the original one or more signals to a recipient signal generator. Some or all of the components may be formed directly in the semiconductor package.

公开(公告)号：US10432167B2

公开(公告)日：2019-10-01

申请号：US15088814

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Feras Eid ,  Baris Bicen ,  Telesphor Kamgaing ,  Vijay K. Nair ,  Johanna M. Swan ,  Georgios C. Dogiamis ,  Valluri R. Rao

IPC: H03H9/17 ,  H03H9/02 ,  H03H9/24 ,  H03H9/15

Abstract: Embodiments of the invention include a piezoelectric resonator which includes an input transducer having a first piezoelectric material, a vibrating structure coupled to the input transducer, and an output transducer coupled to the vibrating structure. In one example, the vibrating structure is positioned above a cavity of an organic substrate. The output transducer includes a second piezoelectric material. In operation the input transducer causes an input electrical signal to be converted into mechanical vibrations which propagate across the vibrating structure to the output transducer.