公开(公告)号：US5742481A

公开(公告)日：1998-04-21

申请号：US539052

申请日：1995-10-04

Applicant: James V. Murphy ,  Robert N. Taylor

Inventor： James V. Murphy ,  Robert N. Taylor

IPC: H01R43/20 ,  H05K7/10 ,  H01R9/09

CPC classification number: H01R43/205 ,  H01R12/716 ,  H05K7/1069 ,  H05K7/1084

Abstract: A socket/adapter assembly includes a insulative support member for supporting terminals soldered to connection regions of a leadless integrated circuit (IC) package, a printed circuit board, or another intercoupling component. The insulative support member is removable/replaceable from the terminals to allow visual inspection of the solder connections between the terminals and connection regions. The terminals of the socket/adapter assembly are retained by the insulative support member before the connections soldered. The insulative support member is then removed so that the individual solder connections can be examined for defective solder joints and repaired, if necessary.

Abstract translation: 插座/适配器组件包括用于支持焊接到无引线集成电路（IC）封装，印刷电路板或另一互连部件的连接区域的端子的绝缘支撑构件。 绝缘支撑构件可从端子移除/更换，以便目视检查端子和连接区域之间的焊接连接。 在连接焊接之前，插座/适配器组件的端子由绝缘支撑构件保持。 然后去除绝缘支撑构件，使得可以检查各个焊接连接件是否有缺陷的焊点，如果需要可以修复。

公开(公告)号：US5702255A

公开(公告)日：1997-12-30

申请号：US552602

申请日：1995-11-03

Applicant: James V. Murphy ,  Michael J. Murphy ,  Burton Fisher ,  Robert Taylor

Inventor： James V. Murphy ,  Michael J. Murphy ,  Burton Fisher ,  Robert Taylor

IPC: H01R12/51 ,  H01R13/24 ,  H05K3/32 ,  H05K7/10 ,  H01R9/09

CPC classification number: H01R13/2478 ,  H01R13/2485 ,  H05K3/325 ,  H05K7/1061 ,  H05K7/1084

Abstract: A ball grid array socket assembly consists of a socket body having a plurality of vias extending through the socket body between upper and lower surfaces thereof, a plurality of electrically conductive contact assemblies respectively disposed in corresponding vias, and a releasable cover assembly. Each of the contact assemblies includes a lower terminal end projecting outwardly from the lower surface of the body for engaging a terminal pad on a circuit board, and further includes an upper multi-fingered contact arrangement for engaging a ball contact of a ball grid array package. Three separate embodiments of the contact assemblies are disclosed. In use, the ball grid array package is received in assembled relation with the socket body adjacent the upper surface thereof wherein the ball contacts of the ball grid array package are received into the vias in engaging electrical communication with the upper contact ends of the contact assemblies. The multi-fingered upper ends of the contact assemblies engage the BGA ball contact at multiple points to reduce creep associated failure of the contact, while a pivoting contact body portion provides relative movement between the BGA contact ball and the circuit board substrate to reduce thermal expansion stresses. The lower end of the contact assembly may comprise a removable, pivotable post which permits visual inspection of the terminal post solder joint on the terminal pad of the circuit board.

Abstract translation: 球栅阵列插座组件由具有多个通孔的插座主体组成，多个通孔在其上表面和下表面之间延伸穿过插座主体，分别设置在对应的通孔中的多个导电触头组件和可释放的盖组件。 每个接触组件包括从主体的下表面向外突出的下端子端，用于接合电路板上的端子焊盘，并且还包括用于接合球栅阵列封装的球接触件的上多个多指接触装置 。 公开了接触组件的三个独立的实施例。 在使用中，球栅阵列封装以与插座主体相邻的上表面接合的方式接收，其中球栅阵列封装的球触点被接收到通孔中，以与接触组件的上接触端电连接 。 接触组件的多指上端在多个点处接合BGA球接触以减少接触的蠕变相关故障，而枢转接触体部分提供BGA接触球和电路板基底之间的相对运动，以减少热膨胀 压力。 接触组件的下端可以包括可移动的可枢转柱，其允许目视检查电路板的端子焊盘上的端子焊点。

公开(公告)号：US5184285A

公开(公告)日：1993-02-02

申请号：US121568

申请日：1987-11-17

Applicant: James V. Murphy ,  Michael J. Murphy

Inventor： James V. Murphy ,  Michael J. Murphy

IPC: H01L23/12 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R33/76 ,  H01R33/94 ,  H01R33/945 ,  H05K3/32 ,  H05K7/10

CPC classification number: H01L23/49827 ,  H01L23/495 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49861 ,  H05K3/326 ,  H05K7/1023 ,  H05K7/1061 ,  H05K7/1092 ,  H01L2224/4899 ,  H01L2224/49109 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025

Abstract: A socket for connecting a first component to a circuit board. The socket includes pins for connection between the component and the board and a pair of lead frame regions, which are each electrically connected to at least one pin. Each of these regions includes a connection region for making connections to a second component. Insulative plastic is molded around the regions and defines holes through which the pins are inserted. A receptor opening is provided for receiving the second component. The first component may be an integrated circuit, the second a chip capacitor, and the socket may be a DIP socket. The capacitor may be soldered to the connection regions exposed through the receptor opening. Centering bumps may align the capacitor. The plastic may define an exposed area where each of the lead frame regions connects to respective pins, allowing for inspection of the connection between lead frame regions and respective pins.

公开(公告)号：US5118298A

公开(公告)日：1992-06-02

申请号：US680562

申请日：1991-04-04

Applicant: James V. Murphy

Inventor： James V. Murphy

IPC: H05K3/34 ,  H05K7/10

CPC classification number: H05K7/1023 ,  H05K3/3405 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K3/3447 ,  Y10T29/49121

Abstract: An adapter that is to be conneced to contacts on a mother circuit surface. The adapter has a circuit bearing element, such as a printed circuit board, with connection sites that are connected to metalized holes opening onto its top side. Leads are anchored (e.g., by soldering) in the holes and bent down around the edge of the top side of the circuit bearing element to below it, and may be connected to the contacts on the mother circuit surface. The leads may be provided to the circuit bearing element, using lead frame elements provided in a lead frame, by bending the lead frame elements, soldering them in holes in the circuit bearing element, bending the soldered leads down around the edge of the top surface of the circuit bearing element and below it, and removing a side frame portion from the bent lead frame. Bending and cutting of the leads may be performed in a single operation with a single tool.

Abstract translation: 要连接到母电路表面上的接点的适配器。 适配器具有诸如印刷电路板的电路支承元件，其连接位置连接到通向其顶侧的金属化孔。 引线被锚定（例如通过焊接）在孔中并且绕着电路承载元件的顶侧的边缘向下弯曲到其下方，并且可以连接到母线路表面上的触点。 引线可以通过弯曲引线框架元件，将它们焊接在电路承载元件中的孔中，将焊接引线向下弯曲到顶表面的边缘处，将引线设置到电路承载元件，使用设置在引线框架中的引线框架元件 的电路承载元件并在其下方，并且从弯曲的引线框架移除侧框架部分。 引线的弯曲和切割可以用单个工具在单个操作中执行。

公开(公告)号：US4985989A

公开(公告)日：1991-01-22

申请号：US434006

申请日：1989-11-09

Applicant: James V. Murphy

Inventor： James V. Murphy

IPC: H01R43/20 ,  H01R13/633

CPC classification number: H01R13/633 ,  Y10T29/49124 ,  Y10T29/49821 ,  Y10T29/53283 ,  Y10T29/53883 ,  Y10T29/53891

Abstract: An apparatus for removing a multi-contact component installed in sockets on a circuit board. The apparatus includes at least one elongated post for providing an upward force on the lower surface of the component to remove the component from the sockets. The logitudinal axis of the post is generally normal to the lower surface of the component. At least one screw is mechanically coupled to the post so that rotation of the screw causes longitudinal movement of the post.