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    Micromirror having reduced space between hinge and mirror plate of the micromirror
    33.
    发明授权
    Micromirror having reduced space between hinge and mirror plate of the micromirror 有权

    公开(公告)号：US06972891B2

    公开(公告)日：2005-12-06

    申请号：US11034399

    申请日：2005-01-11

    Applicant: Satyadev R. Patel ,  Andrew G. Huibers

    Inventor： Satyadev R. Patel ,  Andrew G. Huibers

    IPC: B81C20060101 ,  G02B26/00 ,  G02B26/08 ,  G02F1/29 ,  H04N5/74

    CPC classification number: B82Y30/00 ,  G02B26/0841 ,  H04N5/7458

    Abstract: A spatial light modulator is disclosed, along with a method for making such a modulator that comprises an array of micromirror devices. The center-to-center distance and the gap between adjacent micromirror devices are determined corresponding to the light source being used so as to optimize optical efficiency and performance quality. The micromirror device comprises a hinge support formed on a substrate and a hinge that is held by the hinge support. A mirror plate is connected to the hinge via a contact, and the distance between the mirror plate and the hinge is determined according to desired maximum rotation angle of the mirror plate, the optimum gap and pitch between the adjacent micromirrors. In a method of fabricating such spatial light modulator, one sacrificial layer is deposited on a substrate followed by forming the mirror plates, and another sacrificial layer is deposited on the mirror plates followed by forming the hinge supports. The two sacrificial layers are removed via the small gap between adjacent mirror devices with spontaneous vapor phase chemical etchant. Also disclosed is a projection system that comprises such a spatial light modulator, as well as a light source, condensing optics, wherein light from the light source is focused onto the array of micromirrors, projection optics for projecting light selectively reflected from the array of micromirrors onto a target, and a controller for selectively actuating the micromirrors in the array.

    Micromirrors and off-diagonal hinge structures for micromirror arrays in projection displays
    34.
    发明授权
    Micromirrors and off-diagonal hinge structures for micromirror arrays in projection displays 有权
    投影显示器中微镜阵列的微镜和非对角铰链结构

    公开(公告)号：US06867897B2

    公开(公告)日：2005-03-15

    申请号：US10366297

    申请日：2003-02-12

    Applicant: Satyadev R. Patel ,  Andrew G. Huibers

    Inventor： Satyadev R. Patel ,  Andrew G. Huibers

    IPC: G02B26/08 ,  G03B21/28 ,  G02B26/00 ,  C23F1/00 ,  G02B7/182 ,  H01L21/00

    CPC classification number: G03B21/28 ,  G02B26/0841

    Abstract: A spatial light modulator is disclosed, along with methods for making such a modulator, that comprises an array of micromirrors each having a hinge and a micromirror plate held via the hinge on a substrate, the micromirror plate being disposed in a plane separate from the hinge and having a diagonal extending across the micromirror plate, the micromirror plate being attached to the hinge such that the micromirror plate can rotate along a rotation axis that is parallel to, but off-set from the diagonal of the micromirror plate. Also disclosed is a projection system that comprises such a spatial light modulator, as well as a light source, condensing optics, wherein light from the light source is focused onto the array of micromirrors, projection optics for projecting light selectively reflected from the array of micromirrors onto a target, and a controller for selectively actuating the micromirrors in the array.

    Abstract translation: 公开了一种空间光调制器，以及用于制造这种调制器的方法，其包括每个具有铰链的微镜阵列和通过铰链固定在基板上的微镜板，微镜板设置在与铰链相分离的平面中 并且具有延伸穿过微镜板的对角线，微镜板附接到铰链，使得微镜板可以沿着与微镜板的对角线平行但偏离的旋转轴线旋转。 还公开了一种投影系统，其包括这样的空间光调制器以及光源，聚光光学器件，其中来自光源的光聚焦到微镜阵列上，用于投射从微镜阵列反射的光的投影光学器件 以及用于选择性地致动阵列中的微镜的控制器。

    Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
    35.
    发明授权
    Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants 有权
    通过用多个顺序蚀刻剂去除牺牲层来制造微机械装置的方法

    公开(公告)号：US06800210B2

    公开(公告)日：2004-10-05

    申请号：US10154150

    申请日：2002-05-22

    Applicant: Satyadev R. Patel ,  Andrew G. Huibers ,  Gregory P. Schaadt ,  Peter J. Heureux

    Inventor： Satyadev R. Patel ,  Andrew G. Huibers ,  Gregory P. Schaadt ,  Peter J. Heureux

    IPC: H01L21306

    CPC classification number: B81C1/00476 ,  B81C1/00547 ,  B81C2201/0109 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2201/112 ,  B82Y30/00

    Abstract: An etching method, such as for forming a micromechanical device, is disclosed. One embodiment of the method is for releasing a micromechanical structure, comprising, providing a substrate; providing a sacrificial layer directly or indirectly on the substrate; providing one or more micromechanical structural layers on the sacrificial layer; performing a first etch to remove a portion of the sacrificial layer, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of the sacrificial layer; performing a second etch to remove additional sacrificial material in the sacrificial layer, the second etch comprising providing a gas that chemically but not physically etches the additional sacrificial material. Another embodiment of the method is for etching a silicon material on or within a substrate, comprising: performing a first etch to remove a portion of the silicon, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of silicon; performing a second etch to remove additional silicon, the second etch comprising providing an etchant gas that chemically but not physically etches the additional silicon.

    Abstract translation: 公开了一种诸如用于形成微机械装置的蚀刻方法。 该方法的一个实施例是用于释放微机械结构，包括：提供衬底; 在衬底上直接或间接提供牺牲层; 在所述牺牲层上提供一个或多个微机械结构层; 执行第一蚀刻以去除牺牲层的一部分，所述第一蚀刻包括提供蚀刻剂气体并激发蚀刻剂气体，以允许蚀刻剂气体在物理或化学和物理上移除牺牲层的该部分; 执行第二蚀刻以去除牺牲层中的附加牺牲材料，第二蚀刻包括提供化学上但不物理蚀刻附加牺牲材料的气体。 该方法的另一实施例是用于在衬底上或衬底内蚀刻硅材料，包括：执行第一蚀刻以去除硅的一部分，第一蚀刻包括提供蚀刻剂气体并激发蚀刻剂气体以允许蚀刻剂 物理或化学和物理的气体去除硅的部分; 执行第二蚀刻以去除附加的硅，第二蚀刻包括提供蚀刻剂气体，其化学地但不物理地蚀刻附加的硅。

    Fluoride gas etching of silicon with improved selectivity
    36.
    发明授权
    Fluoride gas etching of silicon with improved selectivity 有权
    氟化物气体蚀刻硅，提高了选择性

    公开(公告)号：US06290864B1

    公开(公告)日：2001-09-18

    申请号：US09427841

    申请日：1999-10-26

    Applicant: Satyadev R. Patel ,  Gregory P. Schaadt ,  Douglas B. MacDonald

    Inventor： Satyadev R. Patel ,  Gregory P. Schaadt ,  Douglas B. MacDonald

    IPC: B81C500

    CPC classification number: H01L21/32135 ,  B81C1/00595 ,  H01L21/3065 ,  H01L21/3081

    Abstract: The etching of a sacrificial silicon portion in a microstructure such as a microelectromechanical structure by the use of etchant gases that are noble gas fluorides or halogen fluorides is performed with greater selectivity toward the silicon portion relative to other portions of the microstructure by the addition of non-etchant gaseous additives to the etchant gas. An additional discovery is that non-etchant gaseous additives that have a molar averaged formula weight that is below that of molecular nitrogen offer significant advantages over gaseous additives of higher formula weights by causing completion of the etch in a shorter period of time while still achieving the same improvement in selectivity.

    Abstract translation: 通过使用作为惰性气体氟化物或卤素氟化物的蚀刻气体在诸如微机电结构的微结构中蚀刻牺牲硅部分，通过添加非金属氧化物，相对于微观结构的其它部分，对硅部分具有更大的选择性 提取气态添加剂到蚀刻剂气体。 另外的发现是，具有低于分子氮的摩尔平均配方重量的非蚀刻剂气体添加剂相对于具有较高配方重量的气体添加剂提供了显着的优点，通过在更短的时间内完成蚀刻，同时仍然实现 同样的选择性提高。

    Etching method used in fabrications of microstructures
    37.
    发明授权
    Etching method used in fabrications of microstructures 有权
    用于微结构制造中的蚀刻方法

    公开(公告)号：US07027200B2

    公开(公告)日：2006-04-11

    申请号：US10666002

    申请日：2003-09-17

    Applicant: Hongqin Shi ,  Gregory P. Schaadt ,  Andrew G. Huibers ,  Satyadev R. Patel

    Inventor： Hongqin Shi ,  Gregory P. Schaadt ,  Andrew G. Huibers ,  Satyadev R. Patel

    IPC: G02B26/00

    CPC classification number: H01L21/67069 ,  B81C1/00595 ,  B81C2201/0132 ,  G02B26/0841

    Abstract: The present invention discloses a method and apparatus for removing the sacrificial materials in fabrications of microstructures using a vapor phase etchant recipe having a spontaneous vapor phase chemical etchant. The vapor phase etchant recipe has a mean-free-path corresponding to the minimum thickness of the sacrificial layers between the structural layers of the microstructure. This method is of particular importance in removing the sacrificial layers underneath the structural layers of the microstructure.

    Abstract translation: 本发明公开了一种使用具有自发气相化学蚀刻剂的气相蚀刻剂配方去除微结构制造中的牺牲材料的方法和装置。 气相蚀刻剂配方具有对应于微结构的结构层之间的牺牲层的最小厚度的平均自由程。 该方法在去除微结构结构层下面的牺牲层时尤其重要。

    High angle micro-mirrors and processes
    39.
    发明授权
    High angle micro-mirrors and processes 有权
    大角度微镜和工艺

    公开(公告)号：US06970280B2

    公开(公告)日：2005-11-29

    申请号：US10990835

    申请日：2004-11-16

    Applicant: Satyadev R. Patel ,  Andrew G. Huibers ,  Peter J. Heureux

    Inventor： Satyadev R. Patel ,  Andrew G. Huibers ,  Peter J. Heureux

    IPC: G02B26/08 ,  G02B26/00 ,  G02F1/00

    CPC classification number: G02B26/0841

    Abstract: A micro-mirror that comprises a substrate, a hinge structure formed on the substrate and a mirror plate attached to the hinge structure is provided for use in display systems. The mirror plate is capable of rotating from a non-deflected resting state to a state that is at least 14° degrees. In operation, the micro-mirror switches between an “ON”-state and “OFF”-state, which are defined in accordance with a rotational position of the mirror plate. The OFF state can be a non-deflected position of the micro-mirror (generally parallel to the substrate), the same angle (though opposite direction) as the ON state, or an angle less than the ON state (though in the opposite direction). Reflected light from the “ON” and “OFF” states are thus separated and the contrast ratio is improved.

    Abstract translation: 提供了一种微镜，其包括基底，形成在基底上的铰链结构和附接到铰链结构的镜板，用于显示系统。 镜板能够从非偏转的静止状态旋转到至少14度的状态。 在操作中，微反射镜在根据镜板的旋转位置限定的“ON”状态和“OFF”状态之间切换。 关闭状态可以是微反射镜（大体上平行于基板）的非偏转位置，与ON状态相同的角度（尽管相反的方向），或者小于ON状态的角度（尽管在相反方向 ）。 因此，从“ON”和“OFF”状态的反射光被分离，并且对比度提高。

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