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    Determining One or More Characteristics of a Pattern of Interest on a Specimen
    33.
    发明申请
    Determining One or More Characteristics of a Pattern of Interest on a Specimen 审中-公开
    确定样本的兴趣模式的一个或多个特征

    公开(公告)号：US20170059491A1

    公开(公告)日：2017-03-02

    申请号：US15243809

    申请日：2016-08-22

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy ,  Ashok Kulkarni ,  Michael Lennek ,  Allen Park

    IPC: G01N21/956 ,  G01N21/95

    CPC classification number: G01N21/95607 ,  G01N21/9501 ,  G01N2021/95615 ,  G01N2021/95676 ,  G06K9/64 ,  G06T7/001 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/20

    Abstract: Methods and systems for determining characteristic(s) of patterns of interest (POIs) are provided. One system is configured to acquire output of an inspection system generated at the POI instances without detecting defects at the POI instances. The output is then used to generate a selection of the POI instances. The system then acquires output from an output acquisition subsystem for the selected POI instances. The system also determines characteristic(s) of the POI using the output acquired from the output acquisition subsystem.

    Abstract translation: 提供了用于确定感兴趣模式（POI）特征的方法和系统。 一个系统被配置为获取在POI实例处生成的检查系统的输出，而不检测POI实例的缺陷。 然后，输出用于生成POI实例的选择。 然后，系统从所选POI实例的输出采集子系统获取输出。 该系统还使用从输出采集子系统获得的输出来确定POI的特性。

    Virtual Inspection Systems for Process Window Characterization
    34.
    发明申请
    Virtual Inspection Systems for Process Window Characterization 审中-公开
    用于过程窗口表征的虚拟检测系统

    公开(公告)号：US20160150191A1

    公开(公告)日：2016-05-26

    申请号：US14946777

    申请日：2015-11-20

    Applicant: KLA-Tencor Corporation

    Inventor： Laurent Karsenti ,  Kris Bhaskar ,  Mark Wagner ,  Brian Duffy ,  Vijayakumar Ramachandran

    IPC: H04N7/18 ,  G06T19/00 ,  G06T7/00

    CPC classification number: G06F16/9535 ,  G06T1/0007 ,  G06T7/0006 ,  G06T2207/10144 ,  G06T2207/30148 ,  H04L67/306 ,  H04N7/181

    Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes a storage medium configured for storing images for a physical version of a specimen generated by an inspection system. At least two dies are formed on the specimen with different values of one or more parameters of a fabrication process performed on the specimen. The system also includes computer subsystem(s) configured for comparing portions of the stored images generated at locations on the specimen at which patterns having the same as-designed characteristics are formed with at least two of the different values. The portions of the stored images that are compared are not constrained by locations of the dies on the specimen, locations of the patterns within the dies, or locations of the patterns on the specimen. The computer subsystem(s) are also configured for detecting defects at the locations based on results of the comparing.

    Abstract translation: 提供了检测试样缺陷的方法和系统。 一个系统包括被配置为存储由检查系统生成的样本的物理版本的图像的存储介质。 在样品上形成至少两个模具，其具有在样品上进行的制造工艺的一个或多个参数的不同值。 该系统还包括计算机子系统，其被配置用于比较在样本上产生的存储图像的部分，其中形成具有相同设计特征的图案具有不同值中的至少两个。 被比较的存储的图像的部分不受标本上的模具的位置，模具内的图案的位置或样本上的图案的位置的约束。 计算机子系统还被配置为基于比较的结果来检测位置处的缺陷。

    Automated Pattern Fidelity Measurement Plan Generation
    35.
    发明申请
    Automated Pattern Fidelity Measurement Plan Generation 审中-公开
    自动图案保真度测量计划生成

    公开(公告)号：US20160116420A1

    公开(公告)日：2016-04-28

    申请号：US14918394

    申请日：2015-10-20

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy ,  Ajay Gupta ,  Thanh Huy Ha

    IPC: G01N21/88 ,  G01N23/00 ,  G01N21/95

    CPC classification number: G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N23/00 ,  G01N2021/8883 ,  G03F7/70625

    Abstract: Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (ROIs) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.

    Abstract translation: 提供了用于确定要在样本上执行的计量过程的参数的方法和系统。 一个系统包括一个或多个计算机子系统，其被配置为在基于样本的设计的测量子系统为样本执行的度量过程期间自动生成要测量的感兴趣区域（ROI）。 计算机子系统还被配置为在测量子系统的计量过程中自动确定在ROI的第一和第二子集中执行的测量参数，其基于位于 ROI的第一和第二子集。 在第一子集中执行的测量的参数被分开地和独立于在第二子集中执行的测量的参数来确定。

    Inspection recipe setup from reference image variation
    36.
    发明授权
    Inspection recipe setup from reference image variation 有权
    参考图像变化检查配方设置

    公开(公告)号：US09262821B2

    公开(公告)日：2016-02-16

    申请号：US14707573

    申请日：2015-05-08

    Applicant: KLA-Tencor Corporation

    Inventor： Eugene Shifrin ,  Chetana Bhaskar ,  Ashok V. Kulkarni ,  Chien-Huei (Adam) Chen ,  Kris Bhaskar ,  Brian Duffy

    IPC: G06K9/00 ,  G06T7/00

    CPC classification number: G06T7/001 ,  G06T2200/28 ,  G06T2207/30148

    Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.

    Abstract translation: 提供了用于生成用于晶片检查过程的信息的系统和方法。 一种方法包括获取位于晶片上的模具的检查系统的输出，基于输出的管芯位置组合用于管芯的输出，在内部管芯位置的基础上确定统计学 基于针对模具位置确定的统计特性，将组合输出的特性值的变化的属性以及将模具位置分配给不同的组。 该方法还包括在用于执行晶片检查过程的检查系统可访问的存储介质中存储用于管芯位置和内部管芯位置分配的不同组的信息，其包括应用缺陷检测参数， 基于该信息为晶片生成的检查系统的附加输出，从而检测晶片上的缺陷。

    Generalized virtual inspector
    37.
    发明授权
    Generalized virtual inspector 有权
    广义虚拟检查员

    公开(公告)号：US09222895B2

    公开(公告)日：2015-12-29

    申请号：US14184417

    申请日：2014-02-19

    Applicant: KLA-Tencor Corporation

    Inventor： Brian Duffy ,  Kris Bhaskar

    IPC: G06F17/50 ,  G01N21/95 ,  G06T7/00 ,  G06T7/60

    CPC classification number: G01N21/9501 ,  G06T7/50 ,  G06T7/62 ,  G06T2207/10016 ,  G06T2207/30252

    Abstract: Generalized virtual inspectors are provided. One system includes two or more actual systems configured to perform one or more processes on specimen(s) while the specimen(s) are disposed within the actual systems. The system also includes one or more virtual systems coupled to the actual systems to thereby receive output generated by the actual systems and to send information to the actual systems. The virtual system(s) are configured to perform one or more functions using at least some of the output received from the actual systems. The virtual system(s) are not capable of having the specimen(s) disposed therein.

    Abstract translation: 提供广泛的虚拟检查员。 一个系统包括两个或更多个实际系统，其被配置为在样本被布置在实际系统内时对样本执行一个或多个过程。 该系统还包括耦合到实际系统的一个或多个虚拟系统，从而接收由实际系统产生的输出并向实际系统发送信息。 虚拟系统被配置为使用从实际系统接收的至少一些输出来执行一个或多个功能。 虚拟系统不能将样本置于其中。

    Detecting Defects on a Wafer with Run Time Use of Design Data
    38.
    发明申请
    Detecting Defects on a Wafer with Run Time Use of Design Data 有权
    在运行时检测晶圆上的缺陷使用设计数据

    公开(公告)号：US20140376801A1

    公开(公告)日：2014-12-25

    申请号：US14303602

    申请日：2014-06-13

    Applicant: KLA-Tencor Corporation

    Inventor： Laurent Karsenti ,  Brian Duffy

    IPC: G06T7/00

    CPC classification number: G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

    Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes creating a searchable database for a design for a wafer, which includes assigning values to different portions of the design based on patterns in the different portions of the design and storing the assigned values in the searchable database. Different portions of the design having substantially the same patterns are assigned the same values in the searchable database. The searchable database is configured such that searching of the database can be synchronized with generation of output for the wafer by one or more detectors of a wafer inspection system. Therefore, as the wafer is being scanned, design information for the output can be determined as fast as the output is generated, which enables multiple, desirable design based inspection capabilities.

    Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括创建用于晶片设计的可搜索数据库，其包括基于设计的不同部分中的图案将值设计到设计的不同部分，并将所分配的值存储在可搜索的数据库中。 具有基本上相同图案的设计的不同部分在可搜索数据库中被分配相同的值。 可搜索数据库被配置为使得可以通过晶片检查系统的一个或多个检测器与数据库的搜索同步生成晶片的输出。 因此，当正在扫描晶片时，可以确定输出的设计信息与产生的输出一样快，这样可以实现多种基于设计的检测能力。

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