公开(公告)号：US11101077B2

公开(公告)日：2021-08-24

申请号：US16940869

申请日：2020-07-28

Applicant: KEMET Electronics Corporation

Inventor： Ajaykumar Bunha ,  Antony P. Chacko ,  Yaru Shi ,  Qingping Chen ,  Philip M. Lessner

IPC: H01G9/00 ,  H01G9/042 ,  C09D125/18 ,  C09D5/24 ,  C09D4/06 ,  C09D165/00 ,  C08F12/30 ,  C09D133/14 ,  C09D7/65 ,  H01G9/15 ,  H01G9/025 ,  C08F212/14 ,  C09D7/40 ,  H01G9/028

Abstract: A dispersion comprising first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.

公开(公告)号：US11081290B2

公开(公告)日：2021-08-03

申请号：US16741105

申请日：2020-01-13

Applicant: KEMET Electronics Corporation

Inventor： Yaru Shi ,  Antony P. Chacko ,  Ajaykumar Bunha ,  Qingping Chen ,  Elisabeth Crittendon Key

IPC: H01G9/15 ,  H01G9/028 ,  H01G9/00 ,  H01G9/042 ,  H01G9/08 ,  H01G11/48 ,  H01G9/052 ,  H01G9/012

Abstract: Provided is an improved capacitor formed by a process comprising: providing an anode comprising a dielectric thereon wherein the anode comprises a sintered powder wherein the powder has a powder charge of at least 45,000 μFV/g; and forming a first conductive polymer layer encasing at least a portion of the dielectric by applying a first slurry wherein the first slurry comprises a polyanion and a conductive polymer and wherein the polyanion and conductive polymer are in a weight ratio of greater than 3 wherein the conductive polymer and polyanion forms conductive particles with an average particle size of no more than 20 nm.

公开(公告)号：US10943742B2

公开(公告)日：2021-03-09

申请号：US16435762

申请日：2019-06-10

Applicant: KEMET Electronics Corporation

Inventor： Ajaykumar Bunha ,  Antony P. Chacko ,  Yaru Shi ,  Qingping Chen ,  Philip M. Lessner

IPC: H01G9/00 ,  H01G9/042 ,  C09D125/18 ,  C09D5/24 ,  C09D4/06 ,  C09D165/00 ,  C08F212/14 ,  C08F12/30 ,  C09D133/14 ,  C09D7/65 ,  H01G9/15 ,  H01G9/025

Abstract: A capacitor, and process for forming a capacitor, is described wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.

公开(公告)号：US20200373089A1

公开(公告)日：2020-11-26

申请号：US16992714

申请日：2020-08-13

Applicant: KEMET Electronics Corporation

Inventor： Yaru Shi ,  Antony P. Chacko ,  Chenyi Gu ,  Ajaykumar Bunha ,  Qingping Chen

IPC: H01G9/00 ,  H01G9/028 ,  H01B1/12

Abstract: The invention is related to an improved capacitor and an improved process for forming a capacitor. The process comprises forming an anode comprising a dielectric on the anode. A cathode layer is then formed on the dielectric wherein the cathode layer comprises a self-doped conductive polymer and a cross-linker wherein a weight ratio of crosslinker to self-doped conductive polymer is at least 0.01 to no more than 2.

公开(公告)号：US10650980B2

公开(公告)日：2020-05-12

申请号：US16165649

申请日：2018-10-19

Applicant: KEMET Electronics Corporation

Inventor： Ajaykumar Bunha ,  Antony P. Chacko ,  Qingping Chen ,  Yaru Shi ,  Philip M. Lessner

IPC: H01G9/042 ,  C09D125/18 ,  C09D4/06 ,  C09D7/65 ,  C09D5/24 ,  C09D165/00 ,  H01G9/00 ,  H01G9/15 ,  H01G9/025 ,  C08F12/30 ,  H01B1/12 ,  C08F212/14 ,  C09D133/14 ,  H01G9/028

Abstract: A capacitor and process for forming the capacitor, is provided wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.

公开(公告)号：US10340091B2

公开(公告)日：2019-07-02

申请号：US15595137

申请日：2017-05-15

Applicant: KEMET Electronics Corporation

Inventor： Ajaykumar Bunha ,  Antony P. Chacko ,  Yaru Shi ,  Qingping Chen ,  Philip M. Lessner

IPC: H01G9/042 ,  H01G9/00 ,  H01G9/04 ,  H01G9/15 ,  H01M4/136 ,  H01M4/137

Abstract: A capacitor and a method of making a capacitor, is provided with improved reliability performance. The capacitor comprises an anode; a dielectric on the anode; and a cathode on the dielectric wherein the cathode comprises a conductive polymer and a polyanion wherein the polyanion is a copolymer comprising groups A, B and C represented by Formula AxByCz as described herein.

公开(公告)号：US09761347B2

公开(公告)日：2017-09-12

申请号：US15083381

申请日：2016-03-29

Applicant: KEMET Electronics Corporation

Inventor： Yaru Shi ,  Antony P. Chacko ,  Hong Zhang ,  Qingping Chen ,  Randolph S. Hahn ,  Lei Xu ,  Yang Jin ,  Zhen Wu

IPC: H01B1/12 ,  H01G9/15 ,  H01G9/00 ,  H01G9/028 ,  H01G9/042

CPC classification number: H01B1/127 ,  H01G9/0032 ,  H01G9/0036 ,  H01G9/028 ,  H01G9/0425 ,  H01G9/15 ,  Y10T29/417

Abstract: A method for forming a capacitor, a capacitor formed thereby and an improved composition for a conductive coating are described. The method includes providing an anode, forming a dielectric on the anode and forming a cathode layer over the dielectric by applying an amine, a weak acid and a conductive polymer.

公开(公告)号：US20160211082A1

公开(公告)日：2016-07-21

申请号：US15083381

申请日：2016-03-29

Applicant: KEMET Electronics Corporation

Inventor： Yaru Shi ,  Antony P. Chacko ,  Hong Zhang ,  Qingping Chen ,  Randolph S. Hahn ,  Lei Xu ,  Yang Jin ,  Zhen Wu

IPC: H01G9/07 ,  H01B1/12 ,  H01G9/00 ,  H01G9/042 ,  H01G9/15 ,  H01G9/025

CPC classification number: H01B1/127 ,  H01G9/0032 ,  H01G9/0036 ,  H01G9/028 ,  H01G9/0425 ,  H01G9/15 ,  Y10T29/417

Abstract: A method for forming a capacitor, a capacitor formed thereby and an improved composition for a conductive coating are described. The method includes providing an anode, forming a dielectric on the anode and forming a cathode layer over the dielectric by applying an amine, a weak acid and a conductive polymer.

Abstract translation: 描述形成电容器的方法，由此形成的电容器和用于导电涂层的改进的组合物。 该方法包括提供阳极，在阳极上形成电介质并通过施加胺，弱酸和导电聚合物在电介质上形成阴极层。

公开(公告)号：US09147530B2

公开(公告)日：2015-09-29

申请号：US14018001

申请日：2013-09-04

Applicant: Kemet Electronics Corporation

Inventor： Steven C. Hussey ,  Yuri Freeman ,  Philip M. Lessner ,  Qingping Chen ,  Javaid Qazi

IPC: H01G9/00 ,  H01G13/00 ,  H01G9/012 ,  H01G9/028 ,  H01G9/042 ,  H01G9/06 ,  H01G9/08 ,  H01G9/15

CPC classification number: H01G13/00 ,  B23K2101/38 ,  H01G9/012 ,  H01G9/028 ,  H01G9/0425 ,  H01G9/06 ,  H01G9/08 ,  H01G9/15

Abstract: A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.

Abstract translation: 一种用于提供改进的密封电容器的方法，包括以下步骤：将焊料和助焊剂施加到壳体的内表面; 将焊料流到内表面上; 去除焊剂，从而形成焊剂耗尽的焊料; 将电容元件插入壳体中; 回流焊剂消耗的焊料，从而在外壳和可焊层之间形成焊接接头; 并密封外壳。