Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus
    31.
    发明授权
    Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus 失效
    电子部件,电路板和电子部件安装装置的接合装置及其方法

    公开(公告)号:US06995342B2

    公开(公告)日:2006-02-07

    申请号:US10919264

    申请日:2004-08-17

    IPC分类号: H05B3/18 B23K31/02

    摘要: Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.

    摘要翻译: 公开了一种用于接合电子部件的装置和方法,电路板和电子部件安装装置,由此与现有技术相比,能够以高生产率少量地制造各种电路板。 设置有台架构件和加热装置,使得电路板在与台架构件保持接触的状态下被加热装置加热,该台架构件的尺寸几乎等于一个电路板的尺寸。 对于紧凑型电路板,可以减少损耗的产生,并且可以相应地针对各种电路板单独执行加热。 与现有技术相比,能够高生产率地制造各种各样的电路板。

    Semiconductor light receiving device and manufacturing method for the same
    32.
    发明申请
    Semiconductor light receiving device and manufacturing method for the same 有权
    半导体光接收装置及其制造方法

    公开(公告)号:US20050051816A1

    公开(公告)日:2005-03-10

    申请号:US10819772

    申请日:2004-04-06

    申请人: Hiroshi Yamauchi

    发明人: Hiroshi Yamauchi

    CPC分类号: H01L27/14689 H01L27/14806

    摘要: An object of the present invention is to provide a highly sensitive semiconductor light receiving device wherein the efficiency of light convergence into the light receiving region has been increased. The semiconductor light receiving device includes a light receiving region formed on a semiconductor substrate, and an electrode formed in a peripheral portion of the light receiving region on the semiconductor substrate for transferring a charge generated through photoelectric conversion in the light receiving region to the outside of the light receiving region, wherein a part of or the entirety of the peripheral portion of the electrode is processed so as to recede toward the center of the electrode as the electrode is away from the semiconductor substrate. In addition, two types of etching of isotropic etching and anisotropic etching are used at the time of the pattern formation of the electrode at least once, respectively.

    摘要翻译: 本发明的目的是提供一种高灵敏度的半导体光接收装置,其中光收敛区域的光收敛效率已经提高。 半导体光接收装置包括形成在半导体衬底上的光接收区域和形成在半导体衬底上的光接收区域的周边部分中的电极,用于将在光接收区域中通过光电转换产生的电荷传送到 所述光接收区域,其中,当所述电极远离所述半导体衬底时,所述电极的周边部分的一部分或整体被处理以朝向所述电极的中心后退。 此外,在电极图案形成时,分别使用两种类型的各向同性蚀刻和各向异性蚀刻蚀刻。

    Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus
    33.
    发明授权
    Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus 失效
    用于接合电子元件,电路板和电子元件安装装置的装置和方法

    公开(公告)号:US06797926B2

    公开(公告)日:2004-09-28

    申请号:US10244429

    申请日:2002-09-17

    IPC分类号: H05B368

    摘要: Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.

    摘要翻译: 公开了一种用于接合电子部件的装置和方法,电路板和电子部件安装装置,由此与现有技术相比,能够以高生产率少量地制造各种电路板。 设置有台架构件和加热装置,使得电路板在与台架构件保持接触的状态下被加热装置加热,该台架构件的尺寸几乎等于一个电路板的尺寸。 对于紧凑型电路板,可以减少损耗的产生,并且可以相应地针对各种电路板单独执行加热。 与现有技术相比,能够高生产率地制造各种各样的电路板。

    Control apparatus and method for input screens
    40.
    发明授权
    Control apparatus and method for input screens 有权
    输入屏幕的控制装置和方法

    公开(公告)号:US08022938B2

    公开(公告)日:2011-09-20

    申请号:US12155220

    申请日:2008-05-30

    IPC分类号: G06F3/041

    CPC分类号: G01C21/3664 G09B29/106

    摘要: A control apparatus for input screens includes a display unit, a switch portion and a control unit including a microcomputer. If one of a menu switch of the switch portion and a plurality of dummy switches included in a screen displayed by the display unit is operated, the microcomputer causes the display unit to display a new screen including a plurality of dummy switches. The microcomputer estimates a time period required for the operator to watch a screen to operate the dummy switch, depending on the displayed screen (the number of dummy switches). If the sum of estimated time periods exceeds a reference time period, the microcomputer nullifies operation of the dummy switch to prevent the screen from being switched. After the lapse of a predetermined time period, the microcomputer cancels the nullification of the operation of the dummy switch.

    摘要翻译: 用于输入屏幕的控制装置包括显示单元,开关部分和包括微计算机的控制单元。 如果切换部分的菜单开关和显示单元显示的画面中包含的多个虚拟开关中的一个被操作,则微型计算机使显示单元显示包括多个虚拟开关的新屏幕。 微型计算机根据显示的屏幕(虚拟开关的数量),估计操作者观看屏幕来操作虚拟开关所需的时间。 如果估计时间段的总和超过参考时间段,则微机使虚拟开关的操作无效,以防止屏幕被切换。 在经过预定时间段之后,微计算机取消虚拟开关的操作的无效。