公开(公告)号：US08727507B2

公开(公告)日：2014-05-20

申请号：US13449364

申请日：2012-04-18

申请人： Kazuki Fukada ,  Hiroshi Hayata ,  Hidehiro Yoshida

发明人： Kazuki Fukada ,  Hiroshi Hayata ,  Hidehiro Yoshida

IPC分类号： B41J2/045

CPC分类号： B41J2/14274 ,  B41J2202/11 ,  B41J2202/12

摘要： Provided is an ink-jet apparatus that: has a wide control range of the direction for ink ejection; can correct a variation in the direction for ink ejection; and can improve the yield of a product when used for manufacture of electronic devices. The ink-jet apparatus includes: pressure chamber 110 configured with a pair of partition walls 111; nozzle plate 101 having nozzle 100; diaphragm 112 supported by partition walls 111; piezoelectric elements 131 and 132 that are in contact with diaphragm 112 for pressurizing pressure chamber 110; and piezoelectric elements 141, 142 and 143 supporting partition walls 111. A voltage can be applied individually to piezoelectric elements 131, 132, and 141 to 143. The widths of part A and part B of diaphragm 112, part A being in contact with a piezoelectric element, and part B being in contact with partition wall 111 satisfy a particular relationship.

摘要翻译： 本发明提供一种喷墨装置，其具有油墨喷射方向的宽的控制范围; 可以校正喷墨方向的变化; 并且当用于制造电子设备时可以提高产品的产量。 喷墨装置包括：配置有一对分隔壁111的压力室110; 具有喷嘴100的喷嘴板101; 由分隔壁111支撑的隔膜112; 压电元件131和132与隔膜112接触，用于对压力室110加压; 以及支撑分隔壁111的压电元件141,142和143.可以将电压分别施加到压电元件131,132和141至143上。隔膜112的部分A和部分B的宽度部分A与 压电元件和与分隔壁111接触的部分B满足特定的关系。

公开(公告)号：US20120268523A1

公开(公告)日：2012-10-25

申请号：US13449364

申请日：2012-04-18

申请人： KAZUKI FUKADA ,  HIROSHI HAYATA ,  HIDEHIRO YOSHIDA

发明人： KAZUKI FUKADA ,  HIROSHI HAYATA ,  HIDEHIRO YOSHIDA

IPC分类号： B41J2/15

CPC分类号： B41J2/14274 ,  B41J2202/11 ,  B41J2202/12

摘要： Provided is an ink-jet apparatus that: has a wide control range of the direction for ink ejection; can correct a variation in the direction for ink ejection; and can improve the yield of a product when used for manufacture of electronic devices. The ink-jet apparatus includes:pressure chamber 110 configured with a pair of partition walls 111; nozzle plate 101 having nozzle 100; diaphragm 112 supported by partition walls 111; piezoelectric elements 131 and 132 that are in contact with diaphragm 112 for pressurizing pressure chamber 110; and piezoelectric elements 141, 142 and 143 supporting partition walls 111.A voltage can be applied individually to piezoelectric elements 131, 132, and 141 to 143. The widths of part A and part B of diaphragm 112, part A being in contact with a piezoelectric element, and part B being in contact with partition wall 111 satisfy a particular relationship.

摘要翻译： 本发明提供一种喷墨装置，其具有油墨喷射方向的宽的控制范围; 可以校正喷墨方向的变化; 并且当用于制造电子设备时可以提高产品的产量。 喷墨装置包括：配置有一对分隔壁111的压力室110; 具有喷嘴100的喷嘴板101; 由分隔壁111支撑的隔膜112; 压电元件131和132与隔膜112接触，用于对压力室110加压; 以及支撑分隔壁111的压电元件141,142和143.可以将电压分别施加到压电元件131,132和141至143上。隔膜112的部分A和部分B的宽度部分A与 压电元件和与分隔壁111接触的部分B满足特定的关系。

公开(公告)号：US20110234706A1

公开(公告)日：2011-09-29

申请号：US13072895

申请日：2011-03-28

申请人： HIDEHIRO YOSHIDA ,  KAZUKI FUKADA ,  KEISEI YAMAMURO

发明人： HIDEHIRO YOSHIDA ,  KAZUKI FUKADA ,  KEISEI YAMAMURO

IPC分类号： B41J2/045

CPC分类号： B41J2/14274 ,  B41J2002/14419 ,  B41J2202/12

摘要： An ink-jet apparatus includes an ink supply flow path, an ink discharge flow path, and an ink flow path connecting them, in which piezoelectric elements are provided in the ink flow path having at least one turn part, the piezoelectric elements are arranged to be opposed to the ink flow path and are provided upstream of the turn part in the ink flow path and downstream of the turn part in the ink flow path, and a nozzle is provided between the piezoelectric element and the turn part in the ink flow path.

摘要翻译： 喷墨装置包括供墨流路，排墨流路和连接它们的墨流路，其中压电元件设置在具有至少一个匝部分的墨流路中，压电元件被布置成 设置在油墨流动路径的上游侧，设置在油墨流路中的转向部的上游侧以及油墨流路的转向部的下游侧，在墨流路中的压电元件与转向部之间设置有喷嘴 。

公开(公告)号：US20070193682A1

公开(公告)日：2007-08-23

申请号：US10599638

申请日：2005-04-06

申请人： Tatsuo Sasaoka ,  Satoshi Horie ,  Isamu Aokura ,  Yoshihiko Yagi ,  Kazuki Fukada

发明人： Tatsuo Sasaoka ,  Satoshi Horie ,  Isamu Aokura ,  Yoshihiko Yagi ,  Kazuki Fukada

IPC分类号： B32B38/16 ,  B32B38/10 ,  B32B38/00 ,  B31F1/07

CPC分类号： B23K1/203 ,  B23K2101/40 ,  H01L21/4864 ,  H01L21/6835 ,  H01L23/3142 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1181 ,  H01L2224/1184 ,  H01L2224/13019 ,  H01L2224/13144 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/75753 ,  H01L2224/81009 ,  H01L2224/81011 ,  H01L2224/81012 ,  H01L2224/81013 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2224/81801 ,  H01L2224/8182 ,  H01L2224/81894 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H05K3/328 ,  H05K3/3489 ,  H05K3/383 ,  H05K2201/0373 ,  H05K2201/10674 ,  H05K2203/0307 ,  Y10S438/974 ,  Y10T156/1023 ,  Y10T156/14 ,  H01L2224/05599

摘要： A bonding method and an apparatus that enable metal bonding under the atmospheric pressure and at room temperature, wherein the surfaces of objects (1b, 2a) to be bonded together are cleaned in an initial cleaning step (S1) to remove bonding inhibitor substances (G) such as oxides and adhered substances; one (1b) of the bonding surfaces is provided with an uneven profile with a predetermined roughness in a surface roughness control step (S3); a surface treatment step (S5) is performed to remove the substances (F) that have been removed but adhered to the bonding surfaces (1b, 2a) again; and the uneven bonding surface (1b) is pressed against the other bonding surface (2a) to bond them together.

摘要翻译： 在大气压和室温下能够进行金属接合的接合方法和装置，其中在初始清洁步骤（S1）中清洁要结合在一起的物体（1b，2a）的表面以除去结合抑制剂 物质（G），如氧化物和附着物质; 一个（1b）的粘合表面在表面粗糙度控制步骤（S 3）中设置有具有预定粗糙度的凹凸轮廓; 执行表面处理步骤（S 5）以除去已经去除但又粘附到接合表面（1b，2a）上的物质（F） 并且不平坦的接合表面（1b）被压靠在另一个接合表面（2a）上以将它们结合在一起。

公开(公告)号：US08827427B2

公开(公告)日：2014-09-09

申请号：US13092339

申请日：2011-04-22

申请人： Hidehiro Yoshida ,  Kazuki Fukada

发明人： Hidehiro Yoshida ,  Kazuki Fukada

IPC分类号： B41J2/155 ,  B41J2/175

CPC分类号： B41J2/175 ,  B41J2/155 ,  B41J2202/20

摘要： An ink-jet head comprising: a supply channel configured to allow ink to flow; ink chamber groups, each having two or more ink chambers that are alternately provided on either side of the supply channel, along a direction of the ink, the ink chambers each having nozzles for discharging ink; wherein: each of the ink chamber groups has two or more ink chamber sequences in parallel with the direction, and two or more nozzle sequences in parallel with the direction, in each of the ink chamber groups, when the ink chamber sequence closest to the supply channel is a first ink chamber sequence, and the ink chamber sequence furthest away from the supply channel is an n-th ink chamber sequence, the number of the ink chambers in the first ink chamber sequence is greater than the number of the ink chambers in the n-th ink chamber sequence.

摘要翻译： 一种喷墨头，包括：供给通道，其构造成允许墨水流动; 每个具有两个或更多个油墨室，每个油墨室沿着油墨的方向交替地设置在供给通道的两侧，每个油墨室均具有用于排出油墨的喷嘴; 其中：每个墨水室组具有与该方向平行的两个或更多个墨水室序列，以及当墨水室序列最靠近电源时在每个墨水室组中与喷墨方向平行的两个或更多个喷嘴顺序 通道是第一墨室序列，并且距离供应通道最远的墨室序列是第n墨室序列，第一墨室序列中的墨室数量大于墨室的数量 第n个墨水室顺序。

公开(公告)号：US08602533B2

公开(公告)日：2013-12-10

申请号：US13069752

申请日：2011-03-23

申请人： Kazuki Fukada ,  Hidehiro Yoshida ,  Keisei Yamamuro

发明人： Kazuki Fukada ,  Hidehiro Yoshida ,  Keisei Yamamuro

IPC分类号： B41J2/045

CPC分类号： B41J2/14274 ,  B41J2202/12

摘要： An ink jet head and an ink jet device having the same are provided, which include an ink supply path supplied with ink from an ink inlet port, an ink discharge path configured to discharge the ink to an ink discharge port, an ink chamber provided to communicate with the ink supply path and the ink discharge path and having a nozzle configured to discharge the ink, and a piezoelectric actuator operable to apply pressure to the ink within the ink chamber by displacement of a vibrating plate of the ink chamber, wherein the piezoelectric actuator is arranged through the vibrating plate of the ink chamber and an island member, the island member is disposed to extend between the ink supply path and the ink discharge path, and a length W1 of a side of the island member on the ink supply path side and a length L that extends from the ink supply path side to the ink discharge path side are different from each other.

摘要翻译： 提供了一种喷墨头和具有该喷墨头的喷墨装置，其包括从墨水入口供给墨水的墨水供给路径，将墨水排出到墨水排出口的墨水排出路径， 与墨水供应路径和墨水排出路径连通并具有用于排出墨水的喷嘴;以及压电致动器，其可操作以通过墨水室的振动板的位移对墨水室内的墨水施加压力，其中压电 驱动器通过墨水室的振动板和岛状部件布置，岛状部件设置成在墨水供给路径和墨水排出路径之间延伸，岛状部件的墨水供给路径侧的长度W1 并且从供墨路径侧延伸到喷墨路径侧的长度L彼此不同。

公开(公告)号：US08567921B2

公开(公告)日：2013-10-29

申请号：US13072895

申请日：2011-03-28

申请人： Hidehiro Yoshida ,  Kazuki Fukada ,  Keisei Yamamuro

发明人： Hidehiro Yoshida ,  Kazuki Fukada ,  Keisei Yamamuro

IPC分类号： B41J2/045 ,  B41J2/175 ,  B41J2/18

CPC分类号： B41J2/14274 ,  B41J2002/14419 ,  B41J2202/12

摘要： An ink-jet apparatus includes an ink supply flow path, an ink discharge flow path, and an ink flow path connecting them, in which piezoelectric elements are provided in the ink flow path having at least one turn part, the piezoelectric elements are arranged to be opposed to the ink flow path and are provided upstream of the turn part in the ink flow path and downstream of the turn part in the ink flow path, and a nozzle is provided between the piezoelectric element and the turn part in the ink flow path.

摘要翻译： 喷墨装置包括供墨流路，排墨流路和连接它们的墨流路，其中压电元件设置在具有至少一个匝部分的墨流路中，压电元件被布置成 设置在油墨流动路径的上游侧，设置在油墨流路中的转向部的上游侧以及油墨流路的转向部的下游侧，在墨流路中的压电元件与转向部之间设置有喷嘴 。

公开(公告)号：US20120182352A1

公开(公告)日：2012-07-19

申请号：US13345943

申请日：2012-01-09

申请人： Kazuki Fukada ,  Hidehiro Yoshida

发明人： Kazuki Fukada ,  Hidehiro Yoshida

IPC分类号： B41J2/04

CPC分类号： B41J2/14274 ,  B41J2002/14403 ,  B41J2002/14419 ,  B41J2002/14467 ,  B41J2202/12

摘要： Disclosed is an ink-jet head that can suppress occurrence of the crosstalk and facilitate a smooth ink circulation in pressure chambers. The ink jet head includes two or more pressure chambers 110 configured to be supplied with ink and each having a nozzle; ink supply channel 101 communicating with each of pressure chambers 110 and configured to allow the ink to flow to each of pressure chambers 110; ink discharge channel 102 communicating with each of pressure chambers 110 and configured to allow the ink discharged from each of pressure chambers 110 to flow; ink inlet channel 107 connecting each of pressure chambers 110 to ink supply channel 102; ink outlet channel 108 connecting each of pressure chambers 110 to ink discharge channel 102. An inner surface of ink outlet channel 108 includes unevenness 109.

摘要翻译： 公开了一种喷墨头，其可以抑制串扰的发生并且促进压力室中的光滑的油墨循环。 喷墨头包括两个或更多个压力室110，其被构造成供应油墨并且每个具有喷嘴; 供墨通道101与每个压力室110连通并且被配置为允许油墨流动到每个压力室110; 墨水排出通道102与每个压力室110连通并且构造成允许从每个压力室110排出的油流动; 将每个压力室110连接到供墨通道102的墨水入口通道107; 墨水出口通道108将每个压力室110连接到喷墨通道102.墨水出口通道108的内表面包括凹凸109。

公开(公告)号：US06995342B2

公开(公告)日：2006-02-07

申请号：US10919264

申请日：2004-08-17

申请人： Hiroshi Yamauchi ,  Naoto Hosotani ,  Kazuki Fukada ,  Katsuhiko Watanabe

发明人： Hiroshi Yamauchi ,  Naoto Hosotani ,  Kazuki Fukada ,  Katsuhiko Watanabe

IPC分类号： H05B3/18 ,  B23K31/02

CPC分类号： H01L21/67144 ,  B23K3/087 ,  B23K2101/40 ,  H01L24/75 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3494 ,  H05K2203/0165 ,  H05K2203/082 ,  H05K2203/1581 ,  H01L2924/00

摘要： Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.

摘要翻译： 公开了一种用于接合电子部件的装置和方法，电路板和电子部件安装装置，由此与现有技术相比，能够以高生产率少量地制造各种电路板。 设置有台架构件和加热装置，使得电路板在与台架构件保持接触的状态下被加热装置加热，该台架构件的尺寸几乎等于一个电路板的尺寸。 对于紧凑型电路板，可以减少损耗的产生，并且可以相应地针对各种电路板单独执行加热。 与现有技术相比，能够高生产率地制造各种各样的电路板。

公开(公告)号：US06797926B2

公开(公告)日：2004-09-28

申请号：US10244429

申请日：2002-09-17

申请人： Hiroshi Yamauchi ,  Naoto Hosotani ,  Kazuki Fukada ,  Katsuhiko Watanabe

发明人： Hiroshi Yamauchi ,  Naoto Hosotani ,  Kazuki Fukada ,  Katsuhiko Watanabe

IPC分类号： H05B368

CPC分类号： H01L21/67144 ,  B23K3/087 ,  B23K2101/40 ,  H01L24/75 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3494 ,  H05K2203/0165 ,  H05K2203/082 ,  H05K2203/1581 ,  H01L2924/00

摘要： Disclosed are an apparatus and a method for bonding electronic components, a circuit board, and an electronic component mounting apparatus, whereby various kinds of circuit boards can be manufactured, each by a small amount, with high productivity as compared with the conventional art. There are provided a stage member and a heating device, so that a circuit board is heated by the heating device while held in contact with the stage member, which stage member has a size almost equal to that of one circuit board. Generation of losses can be reduced for compact circuit boards, and heating can be performed individually, correspondingly, for each kind of circuit board. Manufacturing various kinds of circuit boards, each by a small amount, with high productivity as compared with the conventional art is enabled accordingly.

摘要翻译： 公开了一种用于接合电子部件的装置和方法，电路板和电子部件安装装置，由此与现有技术相比，能够以高生产率少量地制造各种电路板。 设置有台架构件和加热装置，使得电路板在与台架构件保持接触的状态下被加热装置加热，该台架构件的尺寸几乎等于一个电路板的尺寸。 对于紧凑型电路板，可以减少损耗的产生，并且可以相应地针对各种电路板单独执行加热。 与现有技术相比，能够高生产率地制造各种各样的电路板。