公开(公告)号：US20070228569A1

公开(公告)日：2007-10-04

申请号：US11783186

申请日：2007-04-06

申请人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga

发明人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga

IPC分类号： H01R43/00 ,  H01L23/48

CPC分类号： H01L21/76849 ,  H01L21/76819 ,  H01L21/7685 ,  Y10S438/976 ,  Y10T29/41

摘要： The present invention provides an interconnects-forming method and an interconnects-forming apparatus which can minimize the lowering of processing accuracy in etching, minimize light exposure processing for the formation of interconnect recesses in the production of multi-level interconnects, improve the electromigration resistance of interconnects without impairing the electrical properties of the interconnects, and enhance the reliability of the device. The interconnects-forming method, includes providing interconnect recesses in an insulating film formed in a surface of a substrate; embedding an interconnect material in the interconnect recesses while forming a metal film of the interconnect material on a surface of the insulating film; removing an extra metal material other than the metal material in the interconnect recesses and flattening the substrate surface, thereby forming interconnects; forming a first protective film of a conductive material selectively on exposed surfaces of the interconnects; forming a second protective film on the surface of the substrate having the thus-formed first protective film; forming an interlevel insulating film on the surface of the substrate having the thus-formed second protective film; and flattening a surface of the interlevel insulating film.

公开(公告)号：US20070171035A1

公开(公告)日：2007-07-26

申请号：US10590218

申请日：2005-11-07

申请人： Takanobu Ikari ,  Yoshinori Ohwada ,  Yoshinori Furuno ,  Shinji Akino ,  Daisuke Takagi

发明人： Takanobu Ikari ,  Yoshinori Ohwada ,  Yoshinori Furuno ,  Shinji Akino ,  Daisuke Takagi

IPC分类号： B60Q1/00 ,  G01L3/26

CPC分类号： F02D41/1446 ,  E02F9/226 ,  E02F9/24 ,  E02F9/26 ,  F02D41/008 ,  F02D41/221 ,  Y02T10/40

摘要： An engine protection system for a construction machine can individually diagnose the exhaust temperature specific to each cylinder of an engine corresponding to an engine revolution speed in order to find an abnormal condition of each engine cylinder in advance. A revolution speed sensor 14 detects revolution speed of an engine mounted in the construction machine and a plurality, e.g., 16, cylinder temperature sensors 20a-20p detect exhaust temperatures of respective cylinders of the engine. A data recording unit 26 and a display controller 24 store the detected engine revolution speed and the detected exhaust temperatures of the respective cylinders. Trend data, which is produced based on the stored data, is sent to an office via a portable terminal and the display controller 24 outputs a signal for playing back and displaying snapshots based on the stored data to a display unit 23 disposed in the cab 5.

摘要翻译： 用于施工机械的发动机保护系统可以单独地诊断与发动机转速相对应的发动机的每个气缸的排气温度，以便事先找到每个发动机气缸的异常状况。 转速传感器14检测安装在建筑机械中的发动机的转速，并且多个例如16个气缸温度传感器20a- 20p检测发动机的各个气缸的排气温度。 数据记录单元26和显示控制器24存储检测到的发动机转速和检测到的气缸的排气温度。 基于所存储的数据产生的趋势数据经由便携式终端被发送到办公室，并且显示控制器24根据所存储的数据将显示快照的信号输出到设置在驾驶室5中的显示单元23 。

公开(公告)号：US07217653B2

公开(公告)日：2007-05-15

申请号：US10896014

申请日：2004-07-22

申请人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga

发明人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga

IPC分类号： H01L21/4763

CPC分类号： H01L21/76849 ,  H01L21/76819 ,  H01L21/7685 ,  Y10S438/976 ,  Y10T29/41

摘要： The present invention provides an interconnects-forming method and an interconnects-forming apparatus which can minimize the lowering of processing accuracy in etching, minimize light exposure processing for the formation of interconnect recesses in the production of multi-level interconnects, improve the electromigration resistance of interconnects without impairing the electrical properties of the interconnects, and enhance the reliability of the device. The interconnects-forming method, includes providing interconnect recesses in an insulating film formed in a surface of a substrate; embedding an interconnect material in the interconnect recesses while forming a metal film of the interconnect material on a surface of the insulating film; removing an extra metal material other than the metal material in the interconnect recesses and flattening the substrate surface, thereby forming interconnects; forming a first protective film of a conductive material selectively on exposed surfaces of the interconnects; forming a second protective film on the surface of the substrate having the thus-formed first protective film; forming an interlevel insulating film on the surface of the substrate having the thus-formed second protective film; and flattening a surface of the interlevel insulating film.

摘要翻译： 本发明提供一种互连形成方法和互连形成装置，其能够最小化蚀刻中的处理精度的降低，使在多层互连的制造中形成互连凹槽的光曝光处理最小化，提高电镀迁移电阻 互连，而不损害互连的电性能，并且增强器件的可靠性。 互连形成方法包括在形成在基板的表面中的绝缘膜中提供互连凹槽; 在互连凹槽中嵌入互连材料，同时在绝缘膜的表面上形成互连材料的金属膜; 除去互连凹部中的金属材料以外的多余的金属材料，使基板表面变平，从而形成互连件; 在互连的暴露表面上选择性地形成导电材料的第一保护膜; 在具有如此形成的第一保护膜的基板的表面上形成第二保护膜; 在具有如此形成的第二保护膜的基板的表面上形成层间绝缘膜; 并平坦化层间绝缘膜的表面。

公开(公告)号：US20060057839A1

公开(公告)日：2006-03-16

申请号：US11219777

申请日：2005-09-07

申请人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga ,  Akira Owatari

发明人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga ,  Akira Owatari

IPC分类号： H01L21/4763 ,  H01L21/20

CPC分类号： H01L21/288 ,  C23C18/1619 ,  C23C18/1669 ,  C23C18/32 ,  H01L21/76846 ,  H01L21/76849 ,  H01L21/76874

摘要： A metal film-forming method of the present invention can form a metal film having different film qualities in the thickness direction, in a continuous manner using a single processing solution. The metal film-forming method including: providing a substrate having embedded interconnects formed in interconnect recesses provided in a surface of the substrate; and forming a metal film, having different film qualities in the thickness direction, on surfaces of the interconnects in a continuous manner by changing the flow state of a processing solution relative to the surface of the substrate while keeping the surface of the substrate in contact with the processing solution.

公开(公告)号：US20050064702A1

公开(公告)日：2005-03-24

申请号：US10896014

申请日：2004-07-22

申请人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga

发明人： Xinming Wang ,  Daisuke Takagi ,  Akihiko Tashiro ,  Yukio Fukunaga ,  Akira Fukunaga

IPC分类号： H01L21/3205 ,  H01L21/768 ,  H01L21/4763

CPC分类号： H01L21/76849 ,  H01L21/76819 ,  H01L21/7685 ,  Y10S438/976 ,  Y10T29/41

摘要： The present invention provides an interconnects-forming method and an interconnects-forming apparatus which can minimize the lowering of processing accuracy in etching, light exposure or the like processing for the formation of interconnect recesses in the production of multi-level interconnects, can improve the electromigration resistance of interconnects without impairing the electrical properties of the interconnects, and can enhance the reliabilityof the device. The interconnects-formingmethod, including: providing interconnect recesses in an insulating film formed in a surface of a substrate; embedding an interconnect material in the interconnect recesses while forming a metal film of the interconnect material on a surface of the insulating film; removing an extra metal material other than the metal material in the interconnect recesses and flattening the substrate surface, thereby forming interconnects; forming a first protective film of a conductive material selectively on exposed surfaces of the interconnects; forming a second protective film on the surface of the substrate having the thus-formed first protective film; forming an interlevel insulating film on the surface of the substrate having the thus-formed second protective film; and flattening a surface of the interlevel insulating film.

摘要翻译： 本发明提供一种互连形成方法和互连形成装置，其可以最小化在制造多层互连中形成互连凹槽的蚀刻，曝光等处理中的处理精度的降低， 互连的电迁移电阻，而不损害互连的电性能，并且可以提高器件的可靠性。 所述互连形成方法包括：在形成在基板的表面中的绝缘膜中提供互连凹槽; 在互连凹槽中嵌入互连材料，同时在绝缘膜的表面上形成互连材料的金属膜; 除去互连凹部中的金属材料以外的多余的金属材料，使基板表面变平，从而形成互连件; 在互连的暴露表面上选择性地形成导电材料的第一保护膜; 在具有如此形成的第一保护膜的基板的表面上形成第二保护膜; 在具有如此形成的第二保护膜的基板的表面上形成层间绝缘膜; 并平坦化层间绝缘膜的表面。

公开(公告)号：US06354747B1

公开(公告)日：2002-03-12

申请号：US09219901

申请日：1998-12-24

申请人： Takeshi Irie ,  Kazunori Kurima ,  Ichiro Tonai ,  Toshio Mizue ,  Daisuke Takagi

发明人： Takeshi Irie ,  Kazunori Kurima ,  Ichiro Tonai ,  Toshio Mizue ,  Daisuke Takagi

IPC分类号： G02B636

CPC分类号： G02B6/4292 ,  G02B6/4201

摘要： The present invention relates to an optical module or the like having a structure which prevents the efficiency in a sleeve securing operation or optical characteristics from deteriorating and improves adhesion durability. In particular, a resin mold portion including an optical device in the optical module according to the present invention is processed into a shape which can directly irradiate the UV-curable resin introduced between the resin mold portion and the sleeve with ultraviolet rays, and a structure for restricting the flow of the resin changing into a flowing state during the sleeve securing operation or a structure for improving the adhesion durability of the sleeve is provided on at least one of the sleeve side and resin mold portion side.

摘要翻译： 本发明涉及具有防止套筒固定操作或光学特性劣化并提高粘合耐久性的结构的光学模块等。 特别地，将根据本发明的光学组件中的光学装置的树脂模具部分加工成可以用紫外线直接照射引入到树脂模制部分和套筒之间的UV固化树脂的形状， 为了限制在套筒固定操作期间树脂变成流动状态的流动，或者在套筒侧和树脂模制部分侧中的至少一个上提供用于提高套筒的粘合耐久性的结构。

公开(公告)号：USD396210S

公开(公告)日：1998-07-21

申请号：US55822

申请日：1996-05-03

申请人： Nobuo Shiga ,  Takeshi Sekiguchi ,  Sosaku Sawada ,  Daisuke Takagi

设计人： Nobuo Shiga ,  Takeshi Sekiguchi ,  Sosaku Sawada ,  Daisuke Takagi

公开(公告)号：US20170267975A1

公开(公告)日：2017-09-21

申请号：US15459146

申请日：2017-03-15

申请人： Aino Hasegawa ,  Daisuke Takagi ,  Shigeo Hatada ,  Yuuma Usui ,  Chihiro Kubo ,  Shusaku Shiomoto ,  Waka Lin

发明人： Aino Hasegawa ,  Daisuke Takagi ,  Shigeo Hatada ,  Yuuma Usui ,  Chihiro Kubo ,  Shusaku Shiomoto ,  Waka Lin

IPC分类号： C12N5/077

CPC分类号： C12N5/0656 ,  C12N5/0062 ,  C12N2533/54 ,  C12N2533/74

摘要： Provided is a three-dimensional culture structure that is excellent in cell adhesion and cell stretching and can be produced efficiently. The three-dimensional culture structure includes cells, a cell support material configured to support the cells, and bioaffinity particles. In a preferable mode, the bioaffinity particles are exposed from at least part of the surface of the cell support material, or the bioaffinity particles are protruded from the cell support material, or a surface area occupation rate at which the bioaffinity particles are exposed is 20% or greater of the entire surface of the three-dimensional culture structure, or the bioaffinity particles are dispersed in the cell support material.

公开(公告)号：US08235443B2

公开(公告)日：2012-08-07

申请号：US12649839

申请日：2009-12-30

申请人： Manabu Kokawa ,  Satoshi Morotomi ,  Daisuke Takagi ,  Naohisa Masuda ,  Shigeru Yamashita ,  Masahiro Kawahara ,  Hirokazu Morita ,  Masashi Sakata ,  Hideyuki Kato

发明人： Manabu Kokawa ,  Satoshi Morotomi ,  Daisuke Takagi ,  Naohisa Masuda ,  Shigeru Yamashita ,  Masahiro Kawahara ,  Hirokazu Morita ,  Masashi Sakata ,  Hideyuki Kato

IPC分类号： B62D33/08

CPC分类号： B62D33/08 ,  B60N2/24 ,  B60N2/36 ,  B60P3/423 ,  B62D33/0273 ,  B62D47/003

摘要： A pick-up style utility vehicle has a front seat and a rear seat surrounded by a cabin frame, and a cargo bed in this order from the vehicle front, a screen shield partitioning the cargo bed and a riding space in front of the cargo bed. The cargo bed is changeable between an expanded state in which the cargo bed is expanded into the riding space of the rear seat and a non-expanded state not occupying the riding space of the rear seat. The screen shield is supported by the upper portion of the cabin frame and is changeable between an expanded position in which the cargo bed and the riding space in front of the cargo bed are partitioned and a non-expanded position in which the cargo bed and the riding space in front of the cargo bed are partitioned without the necessity of detaching the screen shield from the cabin frame.

摘要翻译： 拾起式多功能车具有前座椅和后座，由车厢框架包围，并且从车辆前面依次包括货物床，分隔货物床的屏蔽屏蔽和货物床前面的骑乘空间 。 货物床可以在货舱扩展到后排座椅的乘坐空间的扩张状态与不占据后排座椅的乘坐空间的非扩张状态之间变化。 屏蔽罩由机舱框架的上部支撑，并且在货舱和货舱前面的乘坐空间被分隔的扩展位置和不扩展位置之间是变化的，在该位置中货舱和 在货物舱前面的乘坐空间被分隔，而不需要将屏蔽罩从舱架上拆下。

公开(公告)号：US20120069093A1

公开(公告)日：2012-03-22

申请号：US13231464

申请日：2011-09-13

申请人： Masahiro KUWATA ,  Daisuke Takagi ,  Kazuo Haida

发明人： Masahiro KUWATA ,  Daisuke Takagi ,  Kazuo Haida

IPC分类号： B41J2/14 ,  B67D7/06 ,  B32B37/14 ,  B32B38/10 ,  B32B37/02 ,  B32B37/12

CPC分类号： B41J2/14274 ,  B41J2/055 ,  B41J2002/14419

摘要： A liquid ejection head includes a common-chamber formation member including a common chamber to supply liquid to pressure chambers communicating nozzles for ejecting liquid droplets, a flexible thin-film member to form part of a wall face of the common chamber, and a thin-film support member bonded to the thin-film member with glue. The support member has an opening or a recessed portion at least partially having a shape that is broad in an area proximal to a first surface of the support member bonded to the thin-film member and becomes narrower as an area of the opening or the recessed portion is more distant from the first surface. The opening or the recessed portion is sealed with the thin-film member. A portion of the thin-film member corresponding to the opening or the recessed portion has the glue on only a periphery area of the portion that contacts the support member.

摘要翻译： 液体喷射头包括共用室形成构件，其包括公共室以将液体供应到用于喷射液滴的连通喷嘴的压力室，形成公共室的壁面的一部分的柔性薄膜构件， 薄膜支撑构件用胶粘在薄膜构件上。 支撑构件具有开口或凹部，该开口或凹部至少部分地具有在接近薄膜构件的支撑构件的第一表面附近的区域中宽的形状，并且作为开口的面积变窄或凹入 部分距离第一表面更远。 开口部或凹部用薄膜部件密封。 对应于开口或凹部的薄膜构件的一部分仅在与支撑构件接触的部分的周边区域上具有胶水。