摘要:
Guide rails for guiding a band-form member such as a film carrier tape in a semiconductor manufacturing apparatus. The guide rails include a pair of rail main bodies with a plurality of guide assemblies provided on the upper surfaces of the rail main bodies so that the guide assemblies partially guide the upper surface of the band-form member.
摘要:
First and second shelf sections are positioned side by side in an outer frame having front left and right doors. The first self section is fixed to a rear wall of the outer frame, and the second shelf section is secured to the front left and right doors. By opening the front left and right doors, access to the first self section is facilitated for storing a plurality of racks therein, the racks holding sample containers. A transfer section is movable along a linear space defined between the first and second shelf sections. The transfer section includes a pair of rack pull-out mechanisms each for pulling out each rack stored in the shelf sections. A repacking mechanism including a picker mechanism is provided on the transfer section for moving a sample container from the rack on the first rack pull-out mechanism to a rack on the other rack pull-out mechanism.
摘要:
In a refrigeration cycle device in which heat generated by heat absorption of an evaporator is used for heating in a condenser, a disadvantage that a cooling capacity of the evaporator deteriorates owing to shortage or drop of an amount of the heat to be rejected from the condenser is securely avoided and a cooling function is maintained. In the refrigeration cycle device which is provided with a refrigerant circuit including a compressor, a condenser, an expansion valve and an evaporator and which exhibits a heating function by the heat rejected from the condenser and which exhibits the cooling function by the heat absorption of the evaporator, an operation to secure a predetermined amount of the heat to be rejected from the condenser is executed in order to maintain the cooling function of the evaporator based on an index capable of grasping the amount of the heat to be rejected from the condenser.
摘要:
In a refrigerating machine, a water cooling device having a cooling tower or an ice heat storage tank is provided as a heat exchanger for cooling refrigerant after heat-exchange in a heat-source side heat exchanger between an outdoor expansion valve and the heat-source side heat exchanger.
摘要:
In a radially anisotropic sintered magnet of annular shape, the remanence in a radial direction of the annulus increases and decreases at intervals of 90° in a circumferential direction of the annulus, and the remanence in a radial direction over the entire circumference of the annulus has a maximum of 0.95-1.60 T and a minimum equal to 50-95% of the maximum. In a permanent magnet motor comprising a plurality of stator teeth, the radially anisotropic annular sintered magnet is incorporated after it is magnetized in 4n poles (wherein n is an integer of 1 to 20) so that the boundary between N and S poles is located within the range that is centered at the radial direction where the remanence exhibits the minimum and extends ±10° therefrom in a circumferential direction. The radially anisotropic annular sintered magnet undergoes neither fracture nor cracking during the sintering and aging/cooling steps even when it is shaped to a low inner/outer diameter ratio and has satisfactory magnetic properties. A permanent magnet motor comprising the radially anisotropic annular sintered magnet is inexpensive and of high performance.
摘要:
The present invention provides a solder ball that has solved the problem of micro-adhesion and, moreover, has solved both of the problems of micro-adhesion and wetting properties, and a method for preventing the micro-adhesion of solder balls. That is, the present invention provides a solder ball obtained by solidification and spheroidization in a gas phase and having metal soap molecules, preferably a metal soap molecules film of 3 nm or less in thickness, adsorbed on its surface. As the metal soap, there can be used, for example, calcium stearate, magnesium stearate or barium stearate. The present invention is preferably applied to solder balls with a diameter of 400 μm or less. The present invention also provides a method for preventing the micro-adhesion of solder balls which comprises immersing solder balls obtained by solidification and spheroidization in a gas phase, in a solution containing a metal soap dispersed therein, preferably, a solution containing a metal soap dispersed therein to a concentration of less than 5 ppm; taking out the solder balls from the solution; vaporizing the solvent on the surfaces of the solder balls; and then drying the surfaces. The drying is preferably conducted in an atmosphere having a relative humidity RH≦40%.
摘要:
A refrigerating machine including a two-stage compressor, a high-pressure gas cooler, a first expansion valve, an intermediate-pressure receiver, a second expansion valve, and an evaporator is further equipped with an intermediate-pressure refrigerant bypass circuit for bypassing gas refrigerant in the intermediate-pressure receiver to an intermediate-pressure portion of the two-stage compressor, a back flow preventing device provided to the intermediate-pressure refrigerant bypass circuit for preventing back flow of refrigerant from the two-stage compressor to the intermediate-pressure receiver, and a refrigerant-pressure control unit for controlling the pressure of the refrigerant in the intermediate-pressure receiver on the basis of the difference between a specific enthalpy of refrigerant discharged from the high-pressure gas cooler and a predetermined reference enthalpy.
摘要:
In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a mother board is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.
摘要:
Fluorine or a fluorine compound is subjected to a reaction with a spent oxide fuel to produce fluorides of uranium and plutonium, and the fluorides are recovered using a difference in volatility behavior. The spent oxide fuel is subjected to a reaction with an HF gas, whereby uranium, plutonium and most impurities are converted into solid fluorides having low valences or remained as oxides to inhibit volatilization thereof, and then in an F2 fluorination step, the HF fluorination product is subjected to a reaction with a fluorine gas in two stages: one at a low temperature and the other at a high temperature, whereby a certain amount of gaseous uranium and volatile impurities are separated with plutonium kept in a solid form in the first stage, and mixed fluorides of remaining uranium and plutonium are fluorinated into hexafluorides at the same time in the second stage. By such a reprocessing method, plutonium enrichment can be adjusted, uranium and plutonium can be purified, and steps are simplified as well. In addition, reactors are hard to be corroded or deteriorated.
摘要:
Fluorine or a fluorine compound is subjected to a reaction with a spent oxide fuel to produce fluorides of uranium and plutonium, and recovering the fluorides using a difference in volatility behavior. The method includes steps of: subjecting a mixture of UO2 and PuO2 with hydrogen fluoride mixed with hydrogen to HF-fluorinate uranium and plutonium into UF4 and PuF3; subjecting UF4 and PuF3 with a fluorine gas to F2-fluorinate uranium and plutonium into UF6 and PuF6; and fractionating UF6 and PuF6 using a difference in phase change of obtained UF6and PuF6, removing a part of UF6, and volatilizing the remaining UF6 and PuF6 at the same time. By such a reprocessing method, PuF4 hard to undergo a reaction is prevented from being formed as an intermediate fluoride, the material of a reactor is hard to be corroded, and a consumption of expensive fluorine gas is reduced.