中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

35 records (took 0.014 seconds)

    LIGHT EMITTING DIODE DEVICE
    31.
    发明申请
    LIGHT EMITTING DIODE DEVICE 有权

    公开(公告)号：US20220037571A1

    公开(公告)日：2022-02-03

    申请号：US17383402

    申请日：2021-07-22

    Applicant: Lextar Electronics Corporation

    Inventor： Chih-Hao LIN ,  Jian-Chin LIANG ,  Shih-Lun LAI ,  Jo-Hsiang CHEN

    IPC: H01L33/62 ,  H01L33/54 ,  H01L33/10 ,  H01L33/22

    Abstract: A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.

    LIGHT EMITTING DEVICE, PACKAGE DEVICE AND METHOD OF LIGHT EMITTING DEVICE MANUFACTURING
    32.
    发明申请
    LIGHT EMITTING DEVICE, PACKAGE DEVICE AND METHOD OF LIGHT EMITTING DEVICE MANUFACTURING 有权

    公开(公告)号：US20210328120A1

    公开(公告)日：2021-10-21

    申请号：US17078098

    申请日：2020-10-23

    Applicant: Lextar Electronics Corporation

    Inventor： Shiou-Yi KUO ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Chih-Hao LIN

    IPC: H01L33/62 ,  H01L33/54 ,  H01L33/00

    Abstract: A light-emitting device includes a micro light-emitting diode chip (micro LED chip), a first electrical connecting layer, a second electrical connecting layer and a housing layer. The micro LED chip includes a light exit surface, a bottom surface opposite to the light exit surface and first and second electrodes located on the bottom surface. The first and second electrical connecting layers respectively connect to the first and second electrodes and extend along two opposite sidewalls to two sides of a perimeter of the light exit surface. The housing layer encloses the micro LED chip and the first and second electrical connecting layer. The light exit surface of the micro LED chip and top surfaces of the first and second electrical connecting layers are not enclosed by the housing layer.

    LIGHT-ENHANCEMENT DEVICE, AND APPLIANCE HAVING THE SAME
    33.
    发明申请
    LIGHT-ENHANCEMENT DEVICE, AND APPLIANCE HAVING THE SAME 审中-公开

    公开(公告)号：US20180106994A1

    公开(公告)日：2018-04-19

    申请号：US15729649

    申请日：2017-10-10

    Applicant: Lextar Electronics Corporation

    Inventor： Chih-Hao LIN ,  Hui-Ru WU ,  Jo-Hsiang CHEN ,  Tzong-Liang TSAI

    IPC: G02B26/00 ,  G02B5/26 ,  F21V9/16

    CPC classification number: G02B26/008 ,  F21V9/30 ,  F21Y2115/10 ,  G02B5/26 ,  G02B5/285

    Abstract: A light-enhancement device includes a wavelength conversion member and a wavelength controlling element. The wavelength conversion member includes a light-transmissive substrate and wavelength conversion material which is disposed within the light-transmissive substrate for converting a portion of light with a first wavelength into another light with a second wavelength. The wavelength controlling element is disposed on a surface of the light-transmissive substrate for reflecting another portion of the light with the first wavelength into the light-transmissive substrate and enabling the portion of the light with the second wavelength to pass through the wavelength controlling element. A roughness of the surface of the light-transmissive substrate facing towards the wavelength controlling element is configured to be 0-1 μm.

Patent Agency Ranking