公开(公告)号：US10439725B2

公开(公告)日：2019-10-08

申请号：US15927521

申请日：2018-03-21

Applicant: Luxtera, Inc.

Inventor： Gianlorenzo Masini ,  Joseph Balardeta ,  Scott Denton

IPC: H04B10/00 ,  H04B10/40 ,  H04B10/077

Abstract: Methods and systems for an optical connection service interface may include, in an optical data link comprising an optical fiber, a local control system, first and second transceivers at ends of the optical fiber, generating a signal for the local control system at a low frequency and communicating, utilizing the optical fiber, an optical data signal at a high frequency and an Optical Connection Service interface (OCSi) signal at an intermediate frequency. An optical signal may be modulated at the intermediate frequencies for the OCSi, and may be modulated and communicated to the second transceiver. The communicated modulated signal and the optical data signal may be detected utilizing a photodetector in the second transceiver. The detected optical signal may be demodulated, and an optical power of the optical data signal may be configured based on the demodulated signal.

公开(公告)号：US10205533B2

公开(公告)日：2019-02-12

申请号：US15231332

申请日：2016-08-08

Applicant: Luxtera, Inc.

Inventor： Gianlorenzo Masini ,  Subal Sahni

IPC: H04B10/60 ,  G01J1/44 ,  H01L31/0224 ,  H01L31/028 ,  H01L31/0368 ,  H01L31/11 ,  H03F3/08

Abstract: A method and system for optoelectronic receivers utilizing waveguide heterojunction phototransistors (HPTs) integrated in a wafer are disclosed and may include receiving optical signals via optical fibers operably coupled to a top surface of the chip. Electrical signals may be generated utilizing HPTs that detect the optical signals. The electrical signals may be amplified via voltage amplifiers, or transimpedance amplifiers, the outputs of which may be utilized to bias the HPTs by a feedback network. The optical signals may be coupled into opposite ends of the HPTs. A collector of the HPTs may comprise a silicon layer and a germanium layer, a base may comprise a silicon germanium alloy with germanium composition ranging from 70% to 100%, and an emitter including crystalline or poly Si or SiGe. The optical signals may be demodulated by communicating a mixer signal to a base terminal of the HPTs.

公开(公告)号：US10027420B2

公开(公告)日：2018-07-17

申请号：US14752696

申请日：2015-06-26

Applicant: Luxtera, Inc.

Inventor： Subal Sahni ,  Kam-Yan Hon ,  Attila Mekis ,  Gianlorenzo Masini ,  Lieven Verslegers

IPC: G02F1/225 ,  H04B10/00 ,  H04B10/548 ,  G02F1/025

Abstract: Methods and systems for a silicon-based optical phase modulator with high modal overlap are disclosed and may include, in an optical modulator having a rib waveguide in which a cross-shaped depletion region separates four alternately doped sections: receiving an optical signal at one end of the optical modulator, modulating the received optical signal by applying a modulating voltage, and communicating a modulated optical signal out of an opposite end of the modulator. The modulator may be in a silicon photonically-enabled integrated circuit which may be in a complementary-metal oxide semiconductor (CMOS) die. An optical mode may be centered on the cross-shaped depletion region. The four alternately doped sections may include: a shallow depth p-region, a shallow depth n-region, a deep p-region, and a deep n-region. The shallow depth p-region may be electrically coupled to the deep p-region periodically along the length of the modulator.

公开(公告)号：US10025120B2

公开(公告)日：2018-07-17

申请号：US14105527

申请日：2013-12-13

Applicant: Luxtera Inc.

Inventor： Ali Ayazi ,  Gianlorenzo Masini ,  Subal Sahni ,  Attila Mekis ,  Thierry Pinguet

IPC: G02F1/025 ,  G02F1/225 ,  G02F1/21

Abstract: Methods and systems for a low-parasitic silicon high-speed phase modulator are disclosed and may include fabricating an optical phase modulator that comprises a PN junction waveguide formed in a silicon layer, wherein the silicon layer may be on an oxide layer and the oxide layer may be on a silicon substrate. The PN junction waveguide may have p-doped and n-doped regions on opposite sides along a length of the PN junction waveguide, and portions of the p-doped and n-doped regions may be removed. Contacts may be formed on remaining portions of the p-doped and n-doped regions. Portions of the p-doped and n-doped regions may be removed symmetrically about the PN junction waveguide. Portions of the p-doped and n-doped regions may be removed in a staggered fashion along the length of the PN junction waveguide. Etch transition features may be removed along the p-doped and n-doped regions.

公开(公告)号：US20180188459A1

公开(公告)日：2018-07-05

申请号：US15907543

申请日：2018-02-28

Applicant: Luxtera, Inc.

Inventor： Attila Mekis ,  Peter De Dobbelaere ,  Gianlorenzo Masini ,  Yannick De Koninck ,  Thierry Pinguet

IPC: G02B6/42 ,  H04B10/80 ,  H04B10/50 ,  G02B6/124 ,  G02B6/38 ,  G02B6/34 ,  G02B6/30

CPC classification number: G02B6/428 ,  G02B6/124 ,  G02B6/30 ,  G02B6/34 ,  G02B6/3897 ,  G02B6/4206 ,  G02B6/4208 ,  G02B6/4214 ,  G02B6/4239 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/4255 ,  H04B10/501 ,  H04B10/801

Abstract: Methods and systems for a chip-on-wafer-on-substrate assembly are disclosed and may include in an optical communication system comprising an electronics die and a substrate. The electronics die is bonded to a first surface of a photonic interposer and the substrate is coupled to a second surface of the photonic interposer opposite to the first surface. An optical fiber and a light source assembly are coupled to the second surface of the interposer in one or more cavities formed in the substrate. A continuous wave (CW) optical signal may be received in the photonic interposer from the light source assembly, and a modulated optical signal may be communicated between the optical fiber and photonic interposer. The received CW optical signal may be coupled to an optical waveguide in the photonic interposer using a grating coupler.

公开(公告)号：US09929811B2

公开(公告)日：2018-03-27

申请号：US15286150

申请日：2016-10-05

Applicant: Luxtera, Inc.

Inventor： Gianlorenzo Masini ,  Joseph Balardeta ,  Scott Denton

IPC: H04B10/00 ,  H04B10/40 ,  H04B10/077

CPC classification number: H04B10/40 ,  H04B10/0779

Abstract: Methods and systems for an optical connection service interface may include, in an optical data link comprising an optical fiber, a local control system, first and second transceivers at ends of the optical fiber, generating a control signal for the local control system at a low frequency and communicating, utilizing the optical fiber, an optical data signal at a high frequency and an optical service signal for an Optical Connection Service interface (OCSi) at an intermediate frequency. An optical signal may be modulated at the intermediate frequencies for the OCSi, and may be modulated and communicated to the second transceiver. The communicated modulated signal and the optical data signal may be detected utilizing a photodetector in the second transceiver. The detected optical signal may be demodulated, and an optical power of the optical data signal may be configured based on the demodulated signal.

公开(公告)号：US09910232B2

公开(公告)日：2018-03-06

申请号：US15299098

申请日：2016-10-20

Applicant: Luxtera, Inc.

Inventor： Attila Mekis ,  Peter De Dobbelaere ,  Gianlorenzo Masini ,  Yannick De Koninck ,  Thierry Pinguet

IPC: H04B10/50 ,  H04B10/80 ,  G02B6/42 ,  G02B6/34 ,  G02B6/38 ,  G02B6/30 ,  G02B6/124

CPC classification number: G02B6/428 ,  G02B6/124 ,  G02B6/30 ,  G02B6/34 ,  G02B6/3897 ,  G02B6/4206 ,  G02B6/4208 ,  G02B6/4214 ,  G02B6/4239 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/4255 ,  H04B10/501 ,  H04B10/801

Abstract: Methods and systems for a chip-on-wafer-on-substrate assembly are disclosed and may include in an integrated optical communication system comprising an electronics die and a substrate. The electronics die is bonded to a first surface of a photonic interposer and the substrate is coupled to a second surface of the photonic interposer opposite to the first surface. An optical fiber and a light source assembly are coupled to the second surface of the interposer in one or more cavities formed in the substrate. The integrated optical communication system is operable to receive a continuous wave (CW) optical signal in the photonic interposer from the light source assembly; and communicate a modulated optical signal to the optical fiber from said photonic interposer. A mold compound may be on the first surface of the interposer and in contact with the electronics die. The received CW optical signal may be coupled to an optical waveguide in the photonic interposer using a grating coupler.

公开(公告)号：US20170141853A1

公开(公告)日：2017-05-18

申请号：US15356010

申请日：2016-11-18

Applicant: Luxtera, Inc.

Inventor： Brian Welch ,  Gianlorenzo Masini

IPC: H04B10/69 ,  H03F3/08 ,  H03G3/30 ,  H04B10/80

CPC classification number: H04B10/693 ,  H03F3/085 ,  H03G3/3084 ,  H03H21/0012 ,  H04B10/80

Abstract: Methods and systems for a distributed optoelectronic receiver are disclosed and may include an optoelectronic receiver having a grating coupler, a splitter, a plurality of photodiodes, and a plurality of transimpedance amplifiers (TIAs). The receiver receives a modulated optical signal utilizing the grating coupler, splits the received signal into a plurality of optical signals, generates a plurality of electrical signals from the plurality of optical signals utilizing the plurality of photodiodes, communicates the plurality of electrical signals to the plurality of TIAs, amplifies the plurality of electrical signals utilizing the plurality of TIAs, and generates an output electrical signal from coupled outputs of the plurality of TIAs. Each TIA may be configured to amplify signals in a different frequency range. One of the plurality of electrical signals may be DC coupled to a low frequency TIA of the plurality of TIAs.

公开(公告)号：US20160359568A1

公开(公告)日：2016-12-08

申请号：US15171233

申请日：2016-06-02

Applicant: Luxtera, Inc.

Inventor： Peter De Dobbelaere ,  Attila Mekis ,  Gianlorenzo Masini

IPC: H04B10/80 ,  G02B6/34 ,  G02B6/42 ,  G02B6/122

CPC classification number: H04B10/801 ,  G02B6/1228 ,  G02B6/34 ,  G02B6/4279

Abstract: Methods and systems for large silicon photonic interposers by stitching are disclosed and may include, in an integrated optical communication system including CMOS electronics die coupled to a silicon photonic interposer, where the interposer includes a plurality of reticle sections: communicating an optical signal between two of the plurality of reticle sections utilizing a waveguide. The waveguide may include a taper region at a boundary between the two reticle sections, the taper region expanding an optical mode of the communicated optical signal prior to the boundary and narrowing the optical mode after the boundary. A continuous wave (CW) optical signal may be received in a first of the reticle sections from an optical source external to the interposer. The CW optical signal may be received in the interposer from an optical source assembly coupled to a grating coupler in the first of the reticle sections in the silicon photonic interposer.

Abstract translation: 公开了用于通过缝合的大型硅光子插入器的方法和系统，并且可以包括在包括耦合到硅光子插入器的CMOS电子器件裸片的集成光学通信系统中，其中插入器包括多个标线器部分：在两个 所述多个标线片部分利用波导。 波导可以在两个标线片部分之间的边界处包括锥形区域，锥形区域在边界之前扩展所传送的光信号的光学模式，并且在边界之后使光学模式变窄。 连续波（CW）光信号可以从插入器外部的光源接收在第一掩模版区段中。 CW光信号可以在耦合到硅光子插入器中的第一掩模版部分中的光栅耦合器的光源组件的插入器中接收。

公开(公告)号：US20160352431A1

公开(公告)日：2016-12-01

申请号：US15231332

申请日：2016-08-08

Applicant: Luxtera, Inc.

Inventor： Gianlorenzo Masini ,  Subal Sahni

IPC: H04B10/60 ,  G01J1/44 ,  H01L31/0368 ,  H01L31/0224 ,  H01L31/11 ,  H01L31/028

CPC classification number: H04B10/60 ,  G01J1/44 ,  G01J2001/446 ,  H01L31/022408 ,  H01L31/028 ,  H01L31/03682 ,  H01L31/1105 ,  H03F3/08

Abstract: A method and system for optoelectronic receivers utilizing waveguide heterojunction phototransistors (HPTs) integrated in a wafer are disclosed and may include receiving optical signals via optical fibers operably coupled to a top surface of the chip. Electrical signals may be generated utilizing HPTs that detect the optical signals. The electrical signals may be amplified via voltage amplifiers, or transimpedance amplifiers, the outputs of which may be utilized to bias the HPTs by a feedback network. The optical signals may be coupled into opposite ends of the HPTs. A collector of the HPTs may comprise a silicon layer and a germanium layer, a base may comprise a silicon germanium alloy with germanium composition ranging from 70% to 100%, and an emitter including crystalline or poly Si or SiGe. The optical signals may be demodulated by communicating a mixer signal to a base terminal of the HPTs.

Abstract translation: 公开了利用集成在晶片中的波导异质结光电晶体管（HPT）的光电子接收器的方法和系统，并且可以包括通过可操作地耦合到芯片顶表面的光纤接收光信号。 可以利用检测光信号的HPT产生电信号。 电信号可以经由电压放大器或跨阻放大器来放大，其输出可用于通过反馈网络偏置HPT。 光信号可以耦合到HPT的相对端。 HPT的集电极可以包括硅层和锗层，碱可以包括具有70％至100％的锗组成的硅锗合金，以及包括晶体或多晶硅或SiGe的发射极。 可以通过将混合器信号传送到HPT的基站来解调光信号。