公开(公告)号：US08829391B2

公开(公告)日：2014-09-09

申请号：US12907349

申请日：2010-10-19

申请人： Kosuke Kurachi ,  Masahiko Kubota ,  Akihiko Okano ,  Atsushi Hiramoto

发明人： Kosuke Kurachi ,  Masahiko Kubota ,  Akihiko Okano ,  Atsushi Hiramoto

IPC分类号： B23K26/42 ,  B23K26/40 ,  B23K26/18 ,  B23K26/36 ,  H01L21/268 ,  B23K26/00

CPC分类号： B23K26/18 ,  B23K26/361 ,  B23K26/40 ,  B23K26/53 ,  B23K26/60 ,  B23K2103/50 ,  H01L21/268

摘要： A laser processing method of processing an object to be processed. The object to be processed has a modified portion and a non-modified portion. A modified layer forming step forms a modified layer of the object to be processed by scanning an inner portion of the object with a condensing point of first laser light. The modified layer (i) has a processing speed with second laser light that is lower than a processing speed of a non-modified portion and (ii) is formed below the non-modified portion. A removing step removes a portion of the non-modified portion. The portion of the non-modified portion ranges from a surface of the object to the modified layer. The removing step includes irradiating the portion of the non-modified portion with the second laser light.

摘要翻译： 一种处理被处理物体的激光加工方法。 待处理对象具有修改部分和未修改部分。 改性层形成步骤通过用第一激光的聚光点扫描物体的内部来形成被处理物体的改性层。 改性层（i）的处理速度与第二激光的处理速度相比低于非变形部的处理速度，（ii）形成在非变形部的下方。 去除步骤去除未修饰部分的一部分。 未改性部分的部分从物体的表面到改性层的范围。 去除步骤包括用第二激光照射非改性部分的部分。

公开(公告)号：US20120069094A1

公开(公告)日：2012-03-22

申请号：US13218851

申请日：2011-08-26

申请人： Akihiko Okano ,  Masahiko Kubota ,  Ryoji Kanri ,  Yoshiyuki Fukumoto ,  Masafumi Morisue

发明人： Akihiko Okano ,  Masahiko Kubota ,  Ryoji Kanri ,  Yoshiyuki Fukumoto ,  Masafumi Morisue

IPC分类号： B41J2/045 ,  B23P17/00

CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1645 ,  Y10T29/49401

摘要： Provided is a liquid ejection head including a substrate including a liquid supply port and an energy generating element, in which the liquid supply port has at least one groove shape formed in a wall surface thereof, the at least one groove shape extending from a rear surface, which is a surface opposite to a front surface on which the energy generating element is formed, toward the front surface.

摘要翻译： 本发明提供一种液体喷射头，其特征在于，包括：液体供给口和能量产生元件的基板，所述液体供给口和能量产生元件的壁面形成有至少一个槽形状，所述至少一个槽形状从后表面 ，其是形成有能量产生元件的正面的表面朝向前表面。

公开(公告)号：US20120028383A1

公开(公告)日：2012-02-02

申请号：US13186740

申请日：2011-07-20

申请人： Atsushi Hiramoto ,  Masahiko Kubota ,  Ryoji Kanri ,  Akihiko Okano ,  Yoshiyuki Fukumoto ,  Atsunori Terasaki

发明人： Atsushi Hiramoto ,  Masahiko Kubota ,  Ryoji Kanri ,  Akihiko Okano ,  Yoshiyuki Fukumoto ,  Atsunori Terasaki

IPC分类号： H01L21/3065

CPC分类号： B41J2/1603 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2002/14467 ,  H01L21/30655

摘要： A processing method of a silicon substrate including forming a second opening in a bottom portion of a first opening using a patterning mask having a pattern opening by plasma reactive ion etching. The reactive ion etching is performed with a shield structure formed in or on the silicon substrate, the shield structure preventing inside of the first opening from being exposed to the plasma.

摘要翻译： 一种硅衬底的处理方法，包括使用具有通过等离子体反应离子蚀刻的图案开口的图案化掩模在第一开口的底部形成第二开口。 反应离子蚀刻通过形成在硅衬底中或之上的屏蔽结构进行，防止第一开口内部的屏蔽结构暴露于等离子体。

公开(公告)号：US20100156990A1

公开(公告)日：2010-06-24

申请号：US12629238

申请日：2009-12-02

申请人： Masafumi Morisue ,  Takumi Suzuki ,  Masahiko Kubota ,  Ryoji Kanri ,  Akihiko Okano ,  Atsushi Hiramoto

发明人： Masafumi Morisue ,  Takumi Suzuki ,  Masahiko Kubota ,  Ryoji Kanri ,  Akihiko Okano ,  Atsushi Hiramoto

IPC分类号： B41J2/14 ,  B23P17/00

CPC分类号： B41J2/1404 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1639 ,  B41J2/1645 ,  B41J2002/14467 ,  Y10T29/494

摘要： A liquid discharge head includes an Si substrate which is provided with an element for generating energy used in discharging a liquid and a liquid supply port which is provided to pass through the Si substrate from first surface to rear surface so as to supply a liquid to the element. A method of manufacturing the substrate includes: forming a plurality of concave portions on the rear surface of the Si substrate of which a plane orientation is {100}, the concave portions facing the first surface and aligned in rows along a direction the first surface; and forming a plurality of the supply ports by carrying out a crystal axis anisotropic etching on the Si substrate through the concave portions using an etching liquid of which an etching rate of the {100} plane of the Si substrate is slower than that of the {110} plane of the Si substrate.

摘要翻译： 液体排出头包括：Si基板，其设置有用于产生用于排出液体的能量的元件和液体供给口，所述液体供给口被设置成从第一表面到后表面穿过Si基板，从而将液体供应到 元件。 一种制造基板的方法包括：在Si基板的背面上形成多个凹部，其中平面取向为{100}，凹面朝向第一表面并且沿着<100>方向排成一列 第一表面 并且通过使用其中Si衬底的{100}面的蚀刻速率比{D“的{100}面的蚀刻速度慢的蚀刻液，通过凹部对Si衬底进行晶轴各向异性蚀刻来形成多个供给口， 110}面。

公开(公告)号：US06986980B2

公开(公告)日：2006-01-17

申请号：US10615302

申请日：2003-07-09

申请人： Masahiko Kubota ,  Wataru Hiyama ,  Shoji Shiba ,  Hiroe Ishikura ,  Akihiko Okano

发明人： Masahiko Kubota ,  Wataru Hiyama ,  Shoji Shiba ,  Hiroe Ishikura ,  Akihiko Okano

IPC分类号： G03F7/30 ,  B41J2/135

CPC分类号： B41J2/1628 ,  B41J2/1404 ,  B41J2/1603 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1637 ,  B41J2/1639 ,  B41J2/1645 ,  B41J2202/11 ,  Y10T29/49401

摘要： The present invention discloses a method of producing a liquid flow path shape capable of refilling ink at a high speed by optimizing a three-dimensional shape of the liquid flow path and suppressing the vibration of a meniscus and a head thereof. According to the invention, a pattern to form the liquid flow path to be formed on a substrate with a heater is formed by a positive photosensitive material in a two-layered structure of upper and lower layers, and the lower layer is used for forming the liquid flow path after being thermally crosslinked.

摘要翻译： 本发明公开了一种能够通过优化液体流路的三维形状并抑制弯液面及其头部的振动来高速重新填充油墨的液体流道形状的方法。 根据本发明，通过正面感光材料形成在具有加热器的基板上形成的液体流动路径的图案，由上下层的双层结构形成，下层用于形成 热交联后的液体流路。

公开(公告)号：US07513601B2

公开(公告)日：2009-04-07

申请号：US11288151

申请日：2005-11-29

申请人： Kazuhiro Asai ,  Masahiko Kubota ,  Ryoji Kanri

发明人： Kazuhiro Asai ,  Masahiko Kubota ,  Ryoji Kanri

IPC分类号： B41J2/14

CPC分类号： B41J2/1404 ,  B41J2002/14387

摘要： With the liquid discharge head, a discharge speed of liquid droplets is increased, a discharge amount of liquid droplets is stabilized, and a discharge efficiency of the liquid droplets is enhanced. A bubbling chamber has a first bubbling chamber which is connected to a supply path with a main surface of an element substrate forming a bottom surface thereof and in which bubbles are generated in ink by a heater, and a second bubbling chamber connected to the first bubbling chamber. Moreover, a nozzle has a discharge port portion including a discharge port connected to the second bubbling chamber. Assuming that an average sectional area of the first bubbling chamber is S1, an average sectional area of the second bubbling chamber is S2, and an average sectional area of the discharge port portion is S3 in sections parallel to the main surface of the element substrate, the nozzle satisfies a relation of S2>S1>S3.

摘要翻译： 利用液体排出头，液滴的排出速度增加，液滴的排出量稳定，液滴的排出效率提高。 起泡室具有第一鼓泡室，其连接到供给路径，其中元件基板的主表面形成其底表面，其中通过加热器在油墨中产生气泡，并且第二鼓泡室连接到第一鼓泡 房间。 此外，喷嘴具有包括连接到第二鼓泡室的排出口的排出口部分。 假设第一发泡室的平均截面积为S1，则第二发泡室的平均截面积为S2，排出口部的平均截面积为与元件基板的主面平行的截面， 喷嘴满足S2> S1> S3的关系。

公开(公告)号：US20060114295A1

公开(公告)日：2006-06-01

申请号：US11288151

申请日：2005-11-29

申请人： Kazuhiro Asai ,  Masahiko Kubota ,  Ryoji Kanri

发明人： Kazuhiro Asai ,  Masahiko Kubota ,  Ryoji Kanri

IPC分类号： B41J2/05 ,  B41J2/04

CPC分类号： B41J2/1404 ,  B41J2002/14387

摘要： According to the present invention, a discharge speed of liquid droplets is increased, a discharge amount of liquid droplets is stabilized, and a discharge efficiency of the liquid droplets is enhanced. A bubbling chamber has: a first bubbling chamber which is connected to a supply path while a main surface of an element substrate is a bottom surface and in which bubbles are generated in ink by a heater; and a second bubbling chamber connected to the first bubbling chamber. Moreover, a nozzle has a discharge port portion including a discharge port connected to the second bubbling chamber. Assuming that an average sectional area of the first bubbling chamber is S1, an average sectional area of the second bubbling chamber is S2, and an average sectional area of the discharge port portion is S3 in a section parallel to the main surface of the element substrate, the nozzle satisfies a relation of S2>S1>S3.

摘要翻译： 根据本发明，液滴的排出速度增加，液滴的排出量稳定，液滴的排出效率提高。 鼓泡室具有：第一鼓泡室，其连接到供应路径，而元件基板的主表面是底表面，并且其中通过加热器在油墨中产生气泡; 以及连接到第一鼓泡室的第二鼓泡室。 此外，喷嘴具有包括连接到第二鼓泡室的排出口的排出口部分。 假设第一鼓泡室的平均截面积为S 1，则第二鼓泡室的平均截面积为S 2，排出口部分的平均截面积为与主表面平行的截面的S 3 元件基板，喷嘴满足S 2> S 1> S 3的关系。

公开(公告)号：US08518725B2

公开(公告)日：2013-08-27

申请号：US13521694

申请日：2011-01-13

申请人： Atsunori Terasaki ,  Masahiko Kubota ,  Ryoji Kanri ,  Yoshiyuki Fukumoto

发明人： Atsunori Terasaki ,  Masahiko Kubota ,  Ryoji Kanri ,  Yoshiyuki Fukumoto

IPC分类号： H01L21/00 ,  H01L21/30 ,  H01L21/46 ,  B21D53/76 ,  B23P17/00 ,  G01D15/00 ,  G11B5/127 ,  B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00

CPC分类号： B41J2/1603 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1639 ,  B41J2/1642

摘要： A method for processing a silicon substrate includes providing a combination of a first silicon substrate, a second silicon substrate, and an intermediate layer including a plurality of recessed portions, which is provided between the first silicon substrate and the second silicon substrate, forming a first through hole that goes through the first silicon substrate by executing etching of the first silicon substrate on a surface of the first silicon substrate opposite to a bonding surface with the intermediate layer by using a first mask, and exposing a portion of the intermediate layer corresponding to the plurality of recessed portions of the intermediate layer, forming a plurality of openings on the intermediate layer by removing a portion constituting a bottom of the plurality of recessed portions, and forming a second through hole that goes through the second silicon substrate by executing second etching of the second silicon substrate by using the intermediate layer on which the plurality of openings are formed as a mask.

摘要翻译： 一种处理硅衬底的方法，包括提供第一硅衬底，第二硅衬底和包括多个凹陷部分的中间层的组合，其设置在第一硅衬底和第二硅衬底之间，形成第一衬底 通过使用第一掩模在所述第一硅衬底的与所述中间层的接合表面相对的表面上执行所述第一硅衬底的表面的蚀刻来穿过所述第一硅衬底的通孔，以及将与所述第一硅衬底相对应的所述中间层的一部分 中间层的多个凹部，通过除去构成多个凹部的底部的部分，在中间层上形成多个开口，并且通过执行第二蚀刻形成穿过第二硅衬底的第二通孔 的第二硅衬底通过使用其上的中间层 形成多个开口作为掩模。

公开(公告)号：US20110070667A1

公开(公告)日：2011-03-24

申请号：US12885257

申请日：2010-09-17

申请人： Hiroyuki Morimoto ,  Masahiko Kubota

发明人： Hiroyuki Morimoto ,  Masahiko Kubota

IPC分类号： H01L21/66

CPC分类号： B41J2/1603 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1639 ,  B41J2/1645 ,  Y10S438/94

摘要： A substrate processing method includes preparing a substrate, a first mask adjacent to a first surface of the substrate and including a first light transmitting portion allowing light to be transmitted therethrough, a condenser adjacent to the first surface, a second mask including a second light transmitting portion, and a photo detecting member including a photo detecting portion detecting light having passed through the second light transmitting portion, the condenser condensing light having passed through the first light transmitting portion toward the second light transmitting portion, the second light transmitting portion allowing the light condensed by the condenser to be transmitted therethrough, and forming a recess in the substrate by laser beam irradiation from a direction opposite to the first surface. When an intensity of the laser beam detected by the photo detecting portion is at or above a specific intensity, the irradiation of the laser beam is stopped.

摘要翻译： 衬底处理方法包括：准备衬底，与衬底的第一表面相邻的第一掩模，并且包括允许光透射的第一透光部分，与第一表面相邻的电容器;第二掩模，包括第二透光 以及光检测部件，其包括检测通过第二透光部的光的光检测部，通过第一透光部朝向第二透光部的聚光灯，第二透光部，允许光 通过冷凝器冷凝以透过其中，并且通过从与第一表面相反的方向的激光束照射在基板中形成凹部。 当由光电检测部分检测的激光束的强度处于或高于特定强度时，停止激光束的照射。

公开(公告)号：US07219971B1

公开(公告)日：2007-05-22

申请号：US09677867

申请日：2000-10-03

申请人： Koromo Shirota ,  Teruo Ozaki ,  Masahiko Kubota ,  Ryuji Katsuragi ,  Hidehiko Kanda

发明人： Koromo Shirota ,  Teruo Ozaki ,  Masahiko Kubota ,  Ryuji Katsuragi ,  Hidehiko Kanda

IPC分类号： B41J29/38

CPC分类号： B41J2/04528 ,  B41J2/04563 ,  B41J2/0458 ,  B41J2/04588 ,  B41J2/04598 ,  B41J2/14129 ,  B41J2202/03 ,  B41J2202/13 ,  C09D11/38

摘要： An ink jet recording method for ejecting ink using an ink jet head substrate provided with a heat generating resistor, which is coated with a protection film, wherein the ink is ejected by a pressure produced by generation of a bubble, the bubble being created by film boiling of the ink caused by the application of thermal energy to the ink through the protection film, the thermal energy being generated by driving of the heat generating resistor, the improvement residing in that: there is provided a recording mode in which the ink is ejected with a maximum temperature at the surface of the protection film, which is contacted to the ink, not higher than 560° C.

摘要翻译： 一种喷墨记录方法，其使用具有发热电阻器的喷墨头基板喷射油墨，所述喷墨头基板涂覆有保护膜，其中通过产生气泡产生的压力喷射油墨，由膜形成的气泡 由于通过保护膜向油墨施加热能引起的油墨的沸腾，热能是通过驱动发热电阻产生的，其改进在于：提供了一种记录模式，其中喷墨 在与油墨接触的保护膜表面的最高温度不高于560℃。