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    METHOD AND DEVICE FOR SELECTIVE ADJUSTMENT OF HYSTERESIS WINDOW
    31.
    发明申请
    METHOD AND DEVICE FOR SELECTIVE ADJUSTMENT OF HYSTERESIS WINDOW 有权
    用于选择性调整HYSTERESIS窗口的方法和装置

    公开(公告)号：US20090267934A1

    公开(公告)日：2009-10-29

    申请号：US12499004

    申请日：2009-07-07

    Applicant: Clarence Chui ,  Manish Kothari

    Inventor： Clarence Chui ,  Manish Kothari

    IPC: G06F3/038

    CPC classification number: G02B26/001

    Abstract: The width and location of a hysteresis window of an interferometric modulator may be altered by adjusting various physical characteristics of the interferometric modulator. Thus, depending on the particular application for which the interferometric modulators are manufactured, the width and location of the hysteresis window may be altered. For example, in some applications, reducing the power required to operate an array of interferometric modulators may be an important consideration. In other applications, the speed of the interferometric modulators may be of more importance, where the speed of an interferometric modulator, as used herein, refers to the speed of actuating and relaxing the moveable mirror. In other applications, the cost and ease of manufacturing may be of most importance. Systems and methods are introduced that allow selection of a width and location of a hysteresis window by adjusting various physical characteristics.

    Abstract translation: 可以通过调整干涉式调制器的各种物理特性来改变干涉式调制器的滞后窗的宽度和位置。 因此，根据制造干涉式调制器的特定应用，可以改变滞后窗口的宽度和位置。 例如，在某些应用中，降低操作干涉式调制器阵列所需的功率可能是重要的考虑因素。 在其他应用中，干涉式调制器的速度可能更为重要，其中如本文所使用的干涉式调制器的速度是指致动和放松可移动反射镜的速度。 在其他应用中，制造的成本和易用性可能是最重要的。 引入了通过调整各种物理特性来选择滞后窗口的宽度和位置的系统和方法。

    Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer
    32.
    发明授权
    Micromechanical systems device comprising a displaceable electrode and a charge-trapping layer 有权
    微机械系统装置包括位移电极和电荷捕获层

    公开(公告)号：US07550794B2

    公开(公告)日：2009-06-23

    申请号：US10251196

    申请日：2002-09-20

    Applicant: Mark W. Miles ,  John Batey ,  Clarence Chui ,  Manish Kothari

    Inventor： Mark W. Miles ,  John Batey ,  Clarence Chui ,  Manish Kothari

    IPC: H01L27/20 ,  H01L29/84

    CPC classification number: G02B26/001 ,  B81B3/0035

    Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device.

    Abstract translation: 在一个实施例中，本发明提供一种用于制造微机电系统装置的方法。 该方法包括制造包括具有特征机电响应的膜的第一层和特征光学响应，其中特征光学响应是期望的，并且特征机电响应是不期望的; 以及通过在所述微机电系统装置的启动期间至少减少其上的电荷积累来修改所述第一层的特征机电响应。

    METHOD AND DEVICE FOR SELECTIVE ADJUSTMENT OF HYSTERESIS WINDOW
    34.
    发明申请
    METHOD AND DEVICE FOR SELECTIVE ADJUSTMENT OF HYSTERESIS WINDOW 失效
    用于选择性调整HYSTERESIS窗口的方法和装置

    公开(公告)号：US20080106784A1

    公开(公告)日：2008-05-08

    申请号：US11958316

    申请日：2007-12-17

    Applicant: Clarence Chui ,  Manish Kothari

    Inventor： Clarence Chui ,  Manish Kothari

    IPC: G02B26/00

    CPC classification number: G02B26/001

    Abstract: The width and location of a hysteresis window of an interferometric modulator may be altered by adjusting various physical characteristics of the interferometric modulator. Thus, depending on the particular application for which the interferometric modulators are manufactured, the width and location of the hysteresis window may be altered. For example, in some applications, reducing the power required to operate an array of interferometric modulators may be an important consideration. In other applications, the speed of the interferometric modulators may be of more importance, where the speed of an interferometric modulator, as used herein, refers to the speed of actuating and relaxing the moveable mirror. In other applications, the cost and ease of manufacturing may be of most importance. Systems and methods are introduced that allow selection of a width and location of a hysteresis window by adjusting various physical characteristics.

    Abstract translation: 可以通过调整干涉式调制器的各种物理特性来改变干涉式调制器的滞后窗的宽度和位置。 因此，根据制造干涉式调制器的特定应用，可以改变滞后窗口的宽度和位置。 例如，在某些应用中，降低操作干涉式调制器阵列所需的功率可能是重要的考虑因素。 在其他应用中，干涉式调制器的速度可能更为重要，其中如本文所使用的干涉式调制器的速度是指致动和放松可移动反射镜的速度。 在其他应用中，制造的成本和易用性可能是最重要的。 引入了通过调整各种物理特性来选择滞后窗口的宽度和位置的系统和方法。

    Method and device for selective adjustment of hysteresis window
    35.
    发明授权
    Method and device for selective adjustment of hysteresis window 失效
    用于选择性调整滞后窗的方法和装置

    公开(公告)号：US07310179B2

    公开(公告)日：2007-12-18

    申请号：US11193012

    申请日：2005-07-29

    Applicant: Clarence Chui ,  Manish Kothari

    Inventor： Clarence Chui ,  Manish Kothari

    IPC: G02B26/00 ,  H01L29/84

    CPC classification number: G02B26/001

    Abstract: The width and location of a hysteresis window of an interferometric modulator may be altered by adjusting various physical characteristics of the interferometric modulator. Thus, depending on the particular application for which the interferometric modulators are manufactured, the width and location of the hysteresis window may be altered. For example, in some applications, reducing the power required to operate an array of interferometric modulators may be an important consideration. In other applications, the speed of the interferometric modulators may be of more importance, where the speed of an interferometric modulator, as used herein, refers to the speed of actuating and relaxing the moveable mirror. In other applications, the cost and ease of manufacturing may be of most importance. Systems and methods are introduced that allow selection of a width and location of a hysteresis window by adjusting various physical characteristics.

    Abstract translation: 可以通过调整干涉式调制器的各种物理特性来改变干涉式调制器的滞后窗的宽度和位置。 因此，根据制造干涉式调制器的特定应用，可以改变滞后窗口的宽度和位置。 例如，在某些应用中，降低操作干涉式调制器阵列所需的功率可能是重要的考虑因素。 在其他应用中，干涉式调制器的速度可能更为重要，其中如本文所使用的干涉式调制器的速度是指致动和放松可移动反射镜的速度。 在其他应用中，制造的成本和易用性可能是最重要的。 引入了通过调整各种物理特性来选择滞后窗口的宽度和位置的系统和方法。

    Packaging for an interferometric modulator
    36.
    发明申请
    Packaging for an interferometric modulator 有权
    用于干涉式调制器的包装

    公开(公告)号：US20070170568A1

    公开(公告)日：2007-07-26

    申请号：US11653088

    申请日：2007-01-12

    Applicant: Lauren Palmateer ,  Brian Gally ,  William Cummings ,  Manish Kothari ,  Clarence Chui

    Inventor： Lauren Palmateer ,  Brian Gally ,  William Cummings ,  Manish Kothari ,  Clarence Chui

    IPC: H01L23/02

    CPC classification number: G02B26/001

    Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.

    Abstract translation: 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 设置背板，并将干燥剂施加到背板上。 背板在环境条件下用背密封件密封到基板的背面，由此形成封装。

    Drive method for MEMS devices
    37.
    发明申请
    Drive method for MEMS devices 有权
    MEMS器件的驱动方法

    公开(公告)号：US20070024550A1

    公开(公告)日：2007-02-01

    申请号：US11511908

    申请日：2006-08-28

    Applicant: Clarence Chui ,  Manish Kothari ,  Marc Mignard ,  Mithran Mathew ,  Jeffrey Sampsell

    Inventor： Clarence Chui ,  Manish Kothari ,  Marc Mignard ,  Mithran Mathew ,  Jeffrey Sampsell

    IPC: G09G3/34

    CPC classification number: G09G3/3466 ,  G02B26/001 ,  G09G3/3618 ,  G09G2300/0473 ,  G09G2300/06 ,  G09G2310/0254 ,  G09G2310/0267 ,  G09G2310/0275 ,  G09G2310/0278 ,  G09G2310/06 ,  G09G2320/029 ,  G09G2330/021 ,  G09G2330/12

    Abstract: Embodiments of exemplary MEMS interferometric modulators are arranged at intersections of rows and columns of electrodes. In certain embodiments, the column electrode has a lower electrical resistance than the row electrode. A driving circuit applies a potential difference of a first polarity across electrodes during a first phase and then quickly transition to applying a bias voltage having a polarity opposite to the first polarity during a second phase. In certain embodiments, an absolute value of the difference between the voltages applied to the row electrode is less than an absolute value of the difference between the voltages applied to the column electrode during the first and second phases.

    Abstract translation: 示例性MEMS干涉式调制器的实施例布置在电极的行和列的交叉处。 在某些实施例中，列电极具有比行电极更低的电阻。 驱动电路在第一阶段期间在电极之间施加第一极性的电位差，然后在第二阶段期间快速转换到施加极性与第一极性相反的偏置电压。 在某些实施例中，施加到行电极的电压之差的绝对值小于在第一和第二相期间施加到列电极的​​电压之差的绝对值。

    Packaging for an interferometric modulator
    38.
    发明授权
    Packaging for an interferometric modulator 有权
    用于干涉式调制器的包装

    公开(公告)号：US07164520B2

    公开(公告)日：2007-01-16

    申请号：US10844819

    申请日：2004-05-12

    Applicant: Lauren Fay Palmateer ,  Brian James Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

    Inventor： Lauren Fay Palmateer ,  Brian James Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

    IPC: G02F1/03

    CPC classification number: G02B26/001

    Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package

    Abstract translation: 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 设置背板，并将干燥剂施加到背板上。 背板在环境条件下用背密封件密封到基板的背面，从而形成封装

    Modifying the electro-mechanical behavior of devices
    39.
    发明授权
    Modifying the electro-mechanical behavior of devices 有权
    修改设备的机电性能

    公开(公告)号：US07161094B2

    公开(公告)日：2007-01-09

    申请号：US11436345

    申请日：2006-05-18

    Applicant: Manish Kothari ,  Clarence Chui ,  Lauren Palmateer

    Inventor： Manish Kothari ,  Clarence Chui ,  Lauren Palmateer

    IPC: H01L23/18

    CPC classification number: G02B26/001 ,  B81B7/0038

    Abstract: A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanical affects including damping and stiffness, lifetime of the device, optical properties, thermal affects and corrosion. The control material may be inserted into the package as part of any of several structural components of the package or the MEMS device.

    Abstract translation: MEMS装置与包含在包装中的控制材料一起被包装以影响装置的可移动元件的操作。 控制材料可能影响操作特性，包括致动和释放电压和电流，机械影响包括阻尼和刚度，器件寿命，光学性能，热影响和腐蚀。 控制材料可以作为封装或MEMS器件的几个结构部件中的任何一个插入到封装中。

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