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公开(公告)号：US20120208437A1
公开(公告)日：2012-08-16
申请号：US13459421
申请日：2012-04-30
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
摘要翻译： 抛光装置抛光基板的周边。 该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带 以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。 胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。
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32.发明申请公开(公告)号：US20120135668A1
公开(公告)日：2012-05-31
申请号：US13303485
申请日：2011-11-23
申请人： Masayuki Nakanishi , Masaya Seki , Kenji Kodera
发明人： Masayuki Nakanishi , Masaya Seki , Kenji Kodera
IPC分类号： B24B1/00
CPC分类号： B24B9/065 , B24B21/002 , B24B37/02
摘要： A method of polishing a peripheral portion of a substrate is provided. This method includes: causing sliding contact between the peripheral portion of the substrate and a polishing tape; and supplying a polishing liquid onto the polishing tape contacting the peripheral portion of the substrate. The polishing tape includes a base tape and a fixed abrasive formed on the base tape, and the polishing liquid is an alkaline polishing liquid containing an alkaline chemical and an additive including molecules that cause steric hindrance.
摘要翻译： 提供了研磨基板周边部分的方法。 该方法包括：引起基板的周边部分与研磨带之间的滑动接触; 以及将研磨液供给到与基板的周边部分接触的研磨带上。 抛光带包括形成在基带上的基带和固定磨料，抛光液是含有碱性化学物质和包含引起空间位阻的分子的添加剂的碱性抛光液。
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公开(公告)号：US20090142992A1
公开(公告)日：2009-06-04
申请号：US12292662
申请日：2008-11-24
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/008 , B24B21/20 , B24B27/0076 , B24B37/042 , B24B37/30 , B24B41/068 , B24B49/00 , Y10T428/24777
摘要： The present invention provides a polishing apparatus for polishing a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
摘要翻译： 本发明提供一种用于抛光基板周边的抛光装置。 该抛光装置包括：旋转保持机构，被配置为水平地保持基板并旋转基板;设置在基板周围的多个抛光头组件;多个胶带供给和恢复机构，被配置为向多个抛光头组件提供研磨带，并回收抛光带 以及多个移动机构，其构造成沿着由旋转保持机构保持的基板的径向方向移动多个研磨头组件。 胶带供给和回收机构在基板的径向方向上位于多个研磨头组件的外侧，并且胶带供给和回收机构被固定就位。
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公开(公告)号：US06824613B2
公开(公告)日：2004-11-30
申请号：US10156791
申请日：2002-05-30
申请人： Naoki Dai , Masaya Seki , Akihiro Yazawa , Toshio Yokoyama , Akira Owatari
发明人： Naoki Dai , Masaya Seki , Akihiro Yazawa , Toshio Yokoyama , Akira Owatari
IPC分类号： B05C1102
CPC分类号： H01L21/67051 , C23C18/1632 , H01L21/67046 , H01L21/67742 , Y10S134/902 , Y10S414/137 , Y10S414/141
摘要： A substrate processing apparatus can efficiently form, e.g. by electroless plating, an interconnects-protective layer on the surface of a substrate at a low initial cost for the apparatus and a low running cost without the need for a wide installation space. The substrate processing apparatus includes a loading/unloading and cleaning area accommodating a first transfer robot which has a hand adapted for handling a dry substrate and a hand adapted for handling a wet substrate, a loading port which loads a substrate cassette that houses a substrate, and a cleaning unit for cleaning a substrate. A plating treatment area accommodates a second transfer robot which has a back surface-attracting type of hand provided with a reversing mechanism, a pretreatment unit for carrying out pretreatment of a substrate before plating, and a plating treatment unit for carrying out plating treatment of the substrate.
摘要翻译： 基板处理装置可以有效地形成，例如， 通过化学镀，在基板的表面上以设备的初始成本低的布线保护层和低的运行成本，而不需要宽的安装空间。 基板处理装置包括容纳第一传送机器人的装载/卸载和清洁区域，第一传送机器人具有适于处理干燥基板的手和适于处理湿基板的手，装载容纳基板的基板盒的装载口， 以及用于清洁基板的清洁单元。 电镀处理区域容纳具有设置有反转机构的背面吸引型手的第二传送机器人，用于在电镀之前进行基板的预处理的预处理单元和用于对电镀处理进行电镀处理的电镀处理单元 基质。
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公开(公告)号：US09138854B2
公开(公告)日：2015-09-22
申请号：US12379983
申请日：2009-03-05
申请人： Kazuaki Maeda , Tamami Takahashi , Masaya Seki , Hiroaki Kusa
发明人： Kazuaki Maeda , Tamami Takahashi , Masaya Seki , Hiroaki Kusa
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/06 , B24B21/08 , B24B37/04 , B24B41/06
摘要： A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.
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公开(公告)号：US08506363B2
公开(公告)日：2013-08-13
申请号：US12654561
申请日：2009-12-23
申请人： Tamami Takahashi , Hiroaki Kusa , Masaya Seki
发明人： Tamami Takahashi , Hiroaki Kusa , Masaya Seki
IPC分类号： B24B29/02
CPC分类号： H01L21/68792 , B23Q3/088 , B24B37/30 , B24B41/068 , H01L21/6838 , H01L21/6875
摘要： A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid supply source. The suction surface has a plurality of closed sections surrounded by convexities, and the fluid passage includes a plurality of communication passages which are in fluid communication with the plurality of closed segments respectively and independently.
摘要翻译： 衬底保持器是用于通过真空抽吸来保持待抛光的衬底的机构。 衬底保持器包括具有用于衬底的吸入表面的衬底保持台和选择性地耦合到真空源和流体供应源的流体通道。 抽吸面具有由凸部包围的多个封闭部分，并且流体通道包括分别和独立地与多个封闭部分流体连通的多个连通通道。
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公开(公告)号：US06719300B2
公开(公告)日：2004-04-13
申请号：US09771786
申请日：2001-01-29
申请人： Michio Fujino , Katsunori Ueda , Toshihiko Kumasaka , Masaya Seki
发明人： Michio Fujino , Katsunori Ueda , Toshihiko Kumasaka , Masaya Seki
IPC分类号： F02F1100
CPC分类号： F16J15/123 , F16J15/0818 , F16J15/14 , F16J2015/0856
摘要： A metal gasket for sealing a region whereat there exists three pairs of sets of opposing surfaces between a cylinder block, a chain case and a cylinder head of a chain driving engine. The metal gasket includes an elastic seal member provided on an inner rim of a chain opening formed in said metal gasket, and a storing structure for liquid gasket material used for sealing. The storing structure defined is an enlargement of the chain opening oriented to coincide with a juncture of the region whereat three pairs of opposing surface areas exist, the enlargement defining a cavity in which is housed liquid gasket material and a through hole is provided externally of the cavity.
摘要翻译： 一种用于密封在链轮驱动发动机的气缸体，链条壳体和气缸盖之间存在三对相对表面的区域的金属衬垫。 金属垫圈包括设置在形成在所述金属垫圈中的链条开口的内缘上的弹性密封件，以及用于密封的液体垫圈材料的储存结构。 定义的存储结构是链开口的放大，其定向为与存在三对相对表面区域的区域的接合部重合，限定其中容纳有液体垫圈材料的空腔的扩大部和通孔设置在通孔的外部 腔。
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公开(公告)号：US20090227189A1
公开(公告)日：2009-09-10
申请号：US12379983
申请日：2009-03-05
申请人： Kazuaki Maeda , Tamami Takahashi , Masaya Seki , Hiroaki Kusa
发明人： Kazuaki Maeda , Tamami Takahashi , Masaya Seki , Hiroaki Kusa
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/06 , B24B21/08 , B24B37/04 , B24B41/06
摘要： A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.
摘要翻译： 抛光装置通过使抛光工具与基板滑动接触来抛光基板的周边。 抛光装置包括：基板保持机构，其构造成保持基板并使基板旋转;抛光机构，其构造成将抛光工具抵靠基板的周边按压以周边抛光;以及周边支撑机构，其构造成支撑 通过流体的衬底的周边。 周边支撑机构构造成从基板的周边的相对侧或同一侧支撑基板的表面。
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公开(公告)号：US20100267317A1
公开(公告)日：2010-10-21
申请号：US12654561
申请日：2009-12-23
申请人： Tamami Takahashi , Hiroaki Kusa , Masaya Seki
发明人： Tamami Takahashi , Hiroaki Kusa , Masaya Seki
IPC分类号： B24B41/06
CPC分类号： H01L21/68792 , B23Q3/088 , B24B37/30 , B24B41/068 , H01L21/6838 , H01L21/6875
摘要： A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid supply source. The suction surface has a plurality of closed sections surrounded by convexities, and the fluid passage includes a plurality of communication passages which are in fluid communication with the plurality of closed segments respectively and independently.
摘要翻译： 衬底保持器是用于通过真空抽吸来保持待抛光的衬底的机构。 衬底保持器包括具有用于衬底的吸入表面的衬底保持台和选择性地耦合到真空源和流体供应源的流体通道。 抽吸面具有由凸部包围的多个封闭部分，并且流体通道包括分别和独立地与多个封闭部分流体连通的多个连通通道。
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