Abstract:
Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.
Abstract:
A method and system are presented for use in optical processing of an article by VUV radiation. The method comprises: localizing incident VUV radiation propagation from an optical head assembly towards a processing site on the article outside the optical head assembly and localizing reflected VUV radiation propagation from said processing site towards the optical head assembly by localizing a medium, non-absorbing with respect to VUV radiation, in within the light propagation path in the vicinity of said site outside the optical head assembly. The level of the medium is controlled by measuring the reflected VUV radiation.
Abstract:
A method and system are presented for determining a line profile in a patterned structure, aimed at controlling a process of manufacture of the structure. The patterned structure comprises a plurality of different layers, the pattern in the structure being formed by patterned regions and un-patterned regions. At least first and second measurements are carried out, each utilizing illumination of the structure with a broad wavelengths band of incident light directed on the structure at a certain angle of incidence, detection of spectral characteristics of light returned from the structure, and generation of measured data representative thereof. The measured data obtained with the first measurement is analyzed, and at least one parameter of the structure is thereby determined. Then, this determined parameter is utilized, while analyzing the measured data obtained with the second measurements enabling the determination of the profile of the structure.
Abstract:
A method and system are presented for determining a line profile in a patterned structure, aimed at controlling a process of manufacture of the structure. The patterned structure comprises a plurality of different layers, the pattern in the structure being formed by patterned regions and un-patterned regions. At least first and second measurements are carried out, each utilizing illumination of the structure with a broad wavelengths band of incident light directed on the structure at a certain angle of incidence, detection of spectral characteristics of light returned from the structure, and generation of measured data representative thereof. The measured data obtained with the first measurement is analyzed, and at least one parameter of the structure is thereby determined. Then, this determined parameter is utilized, while analyzing the measured data obtained with the second measurements enabling the determination of the profile of the structure.
Abstract:
A method and system are presented for use in measuring/inspecting a patterned article. Optical measurements are applied to a measurement site on the article by illuminating the measurement site with a plurality of wavelengths at substantially normal incidence of the illuminating light, detecting light returned from the illuminated site, and generating measured data indicative thereof. The measurements are applied to the measurement site through a polarizer rotatable between its different orientations selected from a number of pre-calibrated orientations.
Abstract:
The present invention is aimed to provide a measurement system installable within a processing equipment and more specifically within the exit station of a polishing machine. The optical scheme of this system includes a spectrophotometric channel, an imaging channel and also means for holding the wafer under measurement.
Abstract:
A system and method are presented for measurement on an article. The system comprises an illuminator for producing light of at least one predetermined wavelength range; an optical system; a displacement arrangement; and a control system. The optical system is configured to define at least a measurement channel, and comprises a light directing assembly for directing an input light beam, propagating along an input light path from the illuminator, onto the article and directing a light beam returned from the illuminated region of the article to at least one light detector. The displacement arrangement is associated with at least the light directing assembly of the optical system, and is configured and operable by the control system to rotate said at least light directing assembly of the optical system with respect to a stage supporting the article about a rotational axis substantially normal to the stage.
Abstract:
A method and system are presented for use in measuring/inspecting a patterned article. Optical measurements are applied to a measurement site on the article by illuminating the measurement site with a plurality of wavelengths at substantially normal incidence of the illuminating light, detecting light returned from the illuminated site, and generating measured data indicative thereof. The measurements are applied to the measurement site through a polarizer rotatable between its different orientations selected from a number of pre-calibrated orientations.
Abstract:
Abstract of the DisclosureAn optical system is disclosed for the inspection of wafers during polishing which also includes a measurement system for measuring the thickness of the wafers top layer. The optical system views the wafer through a window and includes a gripping system, which places the wafer in a predetermined viewing location while maintaining the patterned surface completely under water. The optical system also includes a pull-down unit for pulling the measurement system slightly below the horizontal prior to the measurement and returns the measuring system to the horizontal afterwards
Abstract:
The present invention is aimed to provide a measurement system installable within a processing equipment and more specifically within the exit station of a polishing machine. The optical scheme of this system includes a spectrophotometric channel, an imaging channel and also means for holding the wafer under measurement.