公开(公告)号：US20050054218A1

公开(公告)日：2005-03-10

申请号：US10969382

申请日：2004-10-19

申请人： Fang-Jwu Liao ,  Ming-Lun Szu ,  Genn-Sheng Lee

发明人： Fang-Jwu Liao ,  Ming-Lun Szu ,  Genn-Sheng Lee

IPC分类号： H01R13/24 ,  H01R13/432

CPC分类号： H01R13/2442 ,  H01R12/52

摘要： A land grid array socket is provided which includes an insulative housing (22) having a plurality of passageways (24) each accommodating an electrical terminal (1) therein. Contacting ends (134) of the terminal in a same row of the passageways all extend along a predetermined lateral direction, and because of bend of a bending portion (132) in the terminal, the contacting end of the terminal in one passageway does not overlap with another terminal in an adjacent passageway along a vertical direction so as to avoid short circuit risk therebetween.

摘要翻译： 提供了一种平面格栅阵列插座，其包括具有多个通道（24）的绝缘壳体（22），每个通道在其中容纳电气端子（1）。 端子在同一排通道中的接触端（134）全部沿着预定的横向方向延伸，并且由于端子中的弯曲部分（132）的弯曲，一个通道中的端子的接触端不重叠 沿着垂直方向在相邻通道中的另一个端子，以避免它们之间的短路风险。

公开(公告)号：US20050032408A1

公开(公告)日：2005-02-10

申请号：US10914804

申请日：2004-08-09

申请人： Fang-Jwu Liao ,  Wen-Chun Chen

发明人： Fang-Jwu Liao ,  Wen-Chun Chen

IPC分类号： H05K7/10 ,  H01R13/62

CPC分类号： H05K7/1053

摘要： A land grid array connector (1) for electrically connecting a CPU package (3) to a printed circuit board includes a housing (2) and a number of contacts received in passageways (284) of the housing. The housing has a bottom wall (28) and sidewalls (22,24,26). The bottom wall and the sidewalls cooperatively define a receiving space (20) for accommodating the package therein. Protrusion member (228) is formed on the sidewalls and extends inwardly into the receiving space. A through hole (280) below the protrusion member is defined in the bottom wall for facilitating molding the protrusion member. The protrusion member is configured with a vertical abutting surface (2280) formed at a lateral end toward the receiving space thereof. The bottom wall forms a mounting surface (2820) for sustaining the CPU chip thereon. A vertical shortest distance is formed between a lowest end of the abutting surface of the protrusion member and the mounting surface of the bottom wall. This configuration can protect the sidewalls of the housing from being scraped during insertion of the package into the housing. Reliable electrical connection between the package and contacts of the land grid array connector is secured.

摘要翻译： 用于将CPU封装（3）电连接到印刷电路板的焊盘格栅阵列连接器（1）包括壳体（2）和容纳在壳体的通道（284）中的多个触点。 壳体具有底壁（28）和侧壁（22,24,26）。 底壁和侧壁协同地限定用于在其中容纳包装物的容纳空间（20）。 突起构件（228）形成在侧壁上并向内延伸到接纳空间中。 突出部件下方的通孔（280）限定在底壁中，以便于突出部件的模制。 突出部件具有形成在朝向其接收空间的横向端部的垂直抵接面（2280）。 底壁形成用于在其上维持CPU芯片的安装表面（2820）。 在突出部件的抵接面的最下端与底壁的安装面之间形成垂直的最短距离。 这种构造可以保护壳体的侧壁在将包装插入壳体期间被刮擦。 封装和焊盘栅格阵列连接器的触点之间的可靠电连接得到保证。

公开(公告)号：US20050014400A1

公开(公告)日：2005-01-20

申请号：US10894739

申请日：2004-07-19

申请人： Fang-Jwu Liao ,  Ming-Lun Szu

发明人： Fang-Jwu Liao ,  Ming-Lun Szu

IPC分类号： H01R12/00 ,  H01R12/51 ,  H05K7/10

CPC分类号： H05K7/1053

摘要： A land grid array socket includes an insulative housing (2), a stiffener (4) partly covering and reinforcing the housing, a metal clip (5) pivotably engaged on one end of the stiffener, and a lever (6) mounted on two opposite ends of the stiffener for fastening the clip onto the housing. The housing includes a floor (20), a number of sidewalls (24, 26) extending upwardly from the floor and a receiving space defined between the bottom wall and the sidewalls. A pair of step (263) is formed on the floor, for sustaining the LGA package (3) thereon. The sidewall that is far from the clip defines a plurality of rigid blocks (2683) in an inner side for resisting scrape between the sidewall and the LGA package. Therefore, the sidewall of the housing can be protected from scraping damage during insertion of the LGA package into the housing.

摘要翻译： 地面格栅阵列插座包括绝缘壳体（2），部分地覆盖和加强壳体的加强件（4），可枢转地接合在加强件的一端的金属夹子（5）和安装在两个相对的壳体 用于将夹子紧固到壳体上的加强件的端部。 壳体包括地板（20），从地板向上延伸的多个侧壁（24,26）和限定在底壁和侧壁之间的接收空间。 在地板上形成一对台阶（263），用于在其上维持LGA封装（3）。 远离夹子的侧壁在内侧限定多个刚性块（2683），用于抵抗侧壁和LGA封装之间的刮擦。 因此，在将LGA封装插入外壳期间，能够保护外壳的侧壁免受刮擦损坏。

公开(公告)号：US20050014398A1

公开(公告)日：2005-01-20

申请号：US10894735

申请日：2004-07-19

申请人： Fang-Jwu Liao ,  Ming-Lun Szu

发明人： Fang-Jwu Liao ,  Ming-Lun Szu

IPC分类号： H01R12/16 ,  H01R13/24 ,  H01R12/00

CPC分类号： H01R13/2442 ,  H01R12/7076

摘要： An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (104) of the housing. The housing defines a base (100) and sidewalls (12, 14), the base and the sidewalls cooperatively defining a space therebetween for receiving the LGA chip. The base has a multiplicity of walls respectively between every two adjacent passageways along a length thereof, and four peripheral raised portions (102) extending upwardly and adjoining the sidewalls respectively. A multiplicity of protrusions (106) extends upwardly from the walls respectively. A height of the raised portions is the same as that of the protrusions. When a force is exerted down on the LGA chip to make the LGA chip engege with the terminals, a proportion of the force is borne by the protrusions and the raised portions.

摘要翻译： 用于将平台栅格阵列（LGA）芯片与印刷电路板（PCB）连接的电连接器（1）包括壳体（10）和容纳在壳体的通道（104）中的端子（11）。 壳体限定了基部（100）和侧壁​​（12,14），所述基部和侧壁协作地在其间限定了用于接纳LGA芯片的空间。 基座沿着其长度分别在每两个相邻通道之间分别具有多个壁，以及分别向上延伸并邻接侧壁的四个周边凸起部分（102）。 多个突起（106）分别从壁向上延伸。 凸部的高度与突起的高度相同。 当在LGA芯片上施加力以使LGA芯片与端子一起形成时，力的一部分由突起和凸起部分承受。

公开(公告)号：US20050003683A1

公开(公告)日：2005-01-06

申请号：US10886113

申请日：2004-07-06

申请人： Fang-Jwu Liao

发明人： Fang-Jwu Liao

IPC分类号： H01R12/16 ,  H01R43/20 ,  H05K3/30 ,  H05K3/34 ,  H01R13/60

CPC分类号： H01R43/205 ,  H01R12/7076 ,  H05K3/303 ,  H05K3/3494 ,  H05K2201/09127 ,  H05K2201/10189 ,  H05K2203/081 ,  H05K2203/082 ,  Y02P70/613 ,  Y10S439/94

摘要： An electrical connector assembly (b 1) includes an LGA connector (2) having a metal clip (25) and a pick up cap (3). The pick up cap has a planar body (30) forming a plane top surface (300). Several holes (302, 303, 309) are defined in the planar body. When the pick up cap is engagingly mounted onto a top portion of the connector, the holes are in communication with a window (258) of the clip. A vacuum suction device can engage the top surface of the pick up cap to move the connector assembly to a desired location on a PCB. When curing adhesive film at high temperature, heated air can flow through the holes to a bottom portion of the connector. Reliable electrical connection between the contacts of the connector and the metal contact pads of the PCB is subsequently produced in a wave solder machine or drag soldering equipment.

摘要翻译： 电连接器组件（b 1）包括具有金属夹（25）和拾取盖（3）的LGA连接器（2）。 拾取盖具有形成平面顶表面（300）的平面体（30）。 在平面体中限定了几个孔（302,303,309）。 当拾取盖被接合地安装到连接器的顶部时，孔与夹子的窗口（258）连通。 真空抽吸装置可以接合拾取盖的顶表面，以将连接器组件移动到PCB上的期望位置。 当在高温下固化粘合剂膜时，加热的空气可以通过孔流到连接器的底部。 连接器的触点和PCB的金属接触垫之间的可靠电连接随后在波峰焊机或拖曳焊接设备中产生。

公开(公告)号：US07950946B2

公开(公告)日：2011-05-31

申请号：US12607083

申请日：2009-10-28

申请人： Fang-Jwu Liao ,  Chun-Yi Chang

发明人： Fang-Jwu Liao ,  Chun-Yi Chang

IPC分类号： H01R13/62

CPC分类号： H05K7/1431

摘要： An electrical connector (1) for receiving a CPU (5) includes a rectangular planar receiving portion (10) having a top surface (14) for mating with the CPU. At least two posts (20) extend perpendicularly from corners of the planar receiving portion. At least two posts and the planar receiving portion together define a receiving space for receiving the CPU. The post includes a resilient portion (22) and a fixing portion (24). A gap (241) is defined between a resilient portion and a fixing portion, and the resilient portion forms a protrusion block (26) protruding into the receiving space.

摘要翻译： 用于接收CPU（5）的电连接器（1）包括具有用于与CPU配合的顶表面（14）的矩形平面接收部分（10）。 至少两个柱（20）从平面接收部分的角部垂直延伸。 至少两个柱和平面接收部一起限定用于接收CPU的接收空间。 该柱包括弹性部分（22）和固定部分（24）。 间隙（241）限定在弹性部分和固定部分之间，并且弹性部分形成突出到容纳空间中的突出块（26）。

公开(公告)号：US07922514B2

公开(公告)日：2011-04-12

申请号：US12626514

申请日：2009-11-25

申请人： Fang-Jwu Liao

发明人： Fang-Jwu Liao

IPC分类号： H01R13/64

CPC分类号： H01R13/629 ,  H01R13/22

摘要： An electrical connector (1) includes an insulative housing (2) defining a plate-like shape with at least one alignment hole (21) extending therethrough in a vertical direction, and a number of electrical contacts (3) secured in the insulative housing (2). A number of spring ribs (211) are integrally formed on the insulative housing (2) and extend into the alignment hole (21). The spring ribs (211) deform in radial direction and circumferential direction of the alignment hole for engaging with an alignment post (41).

摘要翻译： 电连接器（1）包括限定板状形状的绝缘壳体（2），其具有在垂直方向上延伸穿过其中的至少一个对准孔（21）和固定在绝缘壳体中的多个电触点（3） 2）。 多个弹簧肋（211）一体地形成在绝缘壳体（2）上并延伸到对准孔（21）中。 弹簧肋（211）在对准孔的径向和圆周方向上变形，以与定位柱（41）接合。

公开(公告)号：US07866990B2

公开(公告)日：2011-01-11

申请号：US12549405

申请日：2009-08-28

申请人： Fang-Jwu Liao

发明人： Fang-Jwu Liao

IPC分类号： H01R13/44

CPC分类号： H05K7/1061 ,  H01R12/57 ,  Y10S439/94

摘要： An socket assembly mounted on a printed circuit board for receiving a IC package, comprises an insulative housing defining a plurality of passageways, a plurality of contacts received in the passageways and a pick-up cap covering the insulative housing. The insulative housing has four sidewalls surrounding the passageways. The pick-up cap has three steps, a first step covering the passageways of the housing, a second step seated on top faces of the sidewalls, and a third step set against the printed circuit board. The three steps of the pick-up cap can efficiently protect the insulative housing and the contacts.

摘要翻译： 安装在用于接收IC封装的印刷电路板上的插座组件包括限定多个通道的绝缘壳体，容纳在通道中的多个触点和覆盖绝缘壳体的拾取盖。 绝缘壳体具有围绕通道的四个侧壁。 拾取帽具有三个步骤，第一步骤覆盖壳体的通道，第二台阶位于侧壁的顶面上，第三步骤设置在印刷电路板上。 拾取盖的三个步骤可以有效地保护绝缘外壳和触点。

公开(公告)号：US07775805B2

公开(公告)日：2010-08-17

申请号：US12431696

申请日：2009-04-28

申请人： Fang-Jwu Liao ,  Jia-Hau Liu

发明人： Fang-Jwu Liao ,  Jia-Hau Liu

IPC分类号： H01R12/00

CPC分类号： H01R12/7082 ,  H01R12/714 ,  H01R13/2435 ,  H01R13/2457 ,  H01R13/2492 ,  H01R13/41

摘要： An electrical terminal (30) received in an insulative housing (10), comprising: a main portion (31); a first contacting portion (32); a second contacting portion (33); wherein the first contacting portion comprises at least a flexible arm (321) and at least an inflexible arm (322), the flexible arm can be flexed along an up-to-down direction, and the inflexible arm hard to flex along the up-to-down direction, the flexible and inflexible arms defines a flexible contacting portion (3210) and inflexible contacting portion (3220), respectively. The flexible contacting portion is higher than the inflexible contacting portion along the up-to-down direction, the flexible contacting portion and the inflexible contacting portion are both contacted to a same corresponding electrical contacting portion; the insulative housing defining a plurality of holes, the main portion of the terminal been fixed in the hole, and the first and second contacting portion extending externally from the insulative housing.

摘要翻译： 一种容纳在绝缘壳体（10）中的电气端子（30），包括：主体部分（31）; 第一接触部分（32）; 第二接触部分（33）; 其中所述第一接触部分至少包括柔性臂（321）和至少一个不弯曲臂（322），所述柔性臂可沿着上下方向弯曲，并且所述不弯曲臂难以沿着所述上弯曲臂弯曲， 柔性和不弯曲的臂分别限定柔性接触部分（3210）和不弯曲接触部分（3220）。 柔性接触部分高于沿着上下方向的不弯曲接触部分，柔性接触部分和不弯曲接触部分都与相同的对应电接触部分接触; 所述绝缘壳体限定多个孔，所述端子的主要部分被固定在所述孔中，并且所述第一和第二接触部分从所述绝缘壳体向外延伸。

公开(公告)号：US20100167562A1

公开(公告)日：2010-07-01

申请号：US12317956

申请日：2008-12-31

申请人： Igor Polnyi ,  Fang-Jwu Liao ,  Chun-Yi Chang

发明人： Igor Polnyi ,  Fang-Jwu Liao ,  Chun-Yi Chang

IPC分类号： H01R12/00 ,  H05K5/00 ,  H05K7/20

CPC分类号： H05K7/1061 ,  H01R13/2435

摘要： An LGA socket includes an insulative housing and a plurality of electrical contacts secured on the insulative housing. The insulative housing defines a top face and a bottom face opposite to each other. The insulative housing has a number of alignment posts at corners and the alignment posts together form a receiving space. The alignment post is provided with two crash ribs for positioning an integral module received in the receiving space.