公开(公告)号：US10121503B2

公开(公告)日：2018-11-06

申请号：US15689695

申请日：2017-08-29

Applicant: NITTO DENKO CORPORATION

Inventor： Yuu Sugimoto ,  Hiroyuki Tanabe

IPC: G11B5/48 ,  H05K1/05 ,  H05K3/00 ,  H05K3/06 ,  H05K3/40 ,  H05K1/11 ,  H05K1/18 ,  G11B5/00 ,  G11B5/31 ,  H05K3/34

Abstract: A suspension board with circuit having an opening with an electronic element inserted therein includes an insulating layer disposed at the edge of the opening, a first terminal disposed at one surface of the insulating layer and connected to a magnetic head, and a second terminal disposed at the other surface thereof and connected to the electronic element. The insulating layer includes a first portion in which the first terminal is disposed and a second portion that extends from the first portion toward the opening and is overlapped with a slider. The second portion is thinner than the first portion and is overlapped with the second terminal. The slider has a first surface facing the second portion. The first surface is disposed between the first terminal and the second terminal.

公开(公告)号：US09955579B2

公开(公告)日：2018-04-24

申请号：US15057518

申请日：2016-03-01

Applicant: Nitto Denko Corporation

Inventor： Hiroyuki Tanabe ,  Daisuke Yamauchi

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/18 ,  H05K3/40 ,  H05K1/02 ,  H05K3/38 ,  G11B5/48 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K1/11 ,  G11B5/484 ,  H05K1/0242 ,  H05K1/09 ,  H05K1/111 ,  H05K3/0061 ,  H05K3/181 ,  H05K3/285 ,  H05K3/384 ,  H05K3/40 ,  H05K2201/0154 ,  H05K2201/09081 ,  H05K2201/10931 ,  H05K2203/072

Abstract: A printed circuit board includes first and second insulating layers, a wiring trace, a metal thin film, and a connection terminal. The wiring trace is formed on the first insulating layer. The metal thin film is formed on the wiring trace, and has a thickness larger than 0 nm and not more than 150 nm. The second insulating layer is formed on the first insulating layer to cover the metal thin film. The connection terminal is formed on the first insulating layer to be electrically connected to the wiring trace and exposed from the second insulating layer.

公开(公告)号：US09865288B2

公开(公告)日：2018-01-09

申请号：US15040199

申请日：2016-02-10

Applicant: NITTO DENKO CORPORATION

Inventor： Naohiro Terada ,  Saori Kanezaki ,  Hiroyuki Tanabe ,  Yoshito Fujimura

IPC: G11B15/48 ,  H05K1/05 ,  G11B5/48 ,  H05K3/30

CPC classification number: G11B5/4853 ,  G06F1/184 ,  G11B5/4826 ,  G11B5/4873 ,  H05K1/056 ,  H05K3/305 ,  Y02P70/613

Abstract: A suspension board with circuit includes one pair of pedestals. A pedestal conductive layer of one pedestal has a fan portion and a continuous portion. The pedestal conductive layer of the other pedestal has at least the fan portion. When the pedestal conductive layer of the other pedestal has only the fan portion, the pedestal supporting layer is disposed so as to be overlapped with the fan portion in the thickness direction in each of the pedestals and so as not to be overlapped with the continuous portion in the one pedestal and when the pedestal conductive layer of the other pedestal has the continuous portion, the pedestal supporting layer is disposed so as to be overlapped with the continuous portion or is disposed so as to be overlapped with the fan portion and so as not to be overlapped with the continuous portion in each of the pedestals.

公开(公告)号：US09865287B2

公开(公告)日：2018-01-09

申请号：US15059850

申请日：2016-03-03

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki Tanabe ,  Yuu Sugimoto ,  Yoshito Fujimura

IPC: G11B5/48 ,  H05K1/18 ,  H05K1/05

CPC classification number: G11B5/4833 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/056 ,  H05K1/184

Abstract: A suspension board with circuit includes a first layer made of a metal supporting board, a second layer having insulating properties and provided at one side in a thickness direction of the first layer, and a third layer provided at one side in the thickness direction of the second layer and made of copper or a copper alloy. The first layer includes a first opening portion passing through in the thickness direction. The first opening portion is provided with a conductor layer that is, when projected in a direction orthogonal to the thickness direction, overlapped with the first layer. The conductor layer includes a first conductor circuit having a first electronic component-connecting terminal for being electrically connected to a first electronic component and made of copper or a copper alloy. The third layer includes a second conductor circuit having a second electronic component-connecting terminal for being electrically connected to a second electronic component.

公开(公告)号：US08872036B2

公开(公告)日：2014-10-28

申请号：US13763232

申请日：2013-02-08

Applicant: Nitto Denko Corporation

Inventor： Yasushi Tamura ,  Ryouji Suezaki ,  Tetsuya Ohsawa ,  Hiroyuki Tanabe ,  Hitoki Kanagawa

IPC: H05K1/00 ,  H05K3/28 ,  G11B5/48 ,  G03F7/20 ,  G03F1/00 ,  H05K3/00 ,  H05K1/05

Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.