公开(公告)号：US20090111961A1

公开(公告)日：2009-04-30

申请号：US11921432

申请日：2006-06-13

申请人： Hideo Kubo ,  Hitoshi Matsumoto ,  Takeshi Shimotori ,  Tooru Kawabe

发明人： Hideo Kubo ,  Hitoshi Matsumoto ,  Takeshi Shimotori ,  Tooru Kawabe

IPC分类号： C08F124/00 ,  C08F120/06

CPC分类号： C08F220/28 ,  C08F293/005 ,  C08F297/02 ,  C08F297/026

摘要： Disclosed are an acrylic acid-based polymer which is a star polymer containing a repeating unit derived from an (α-lower alkyl)acrylic ester represented by formula (I): (wherein R1 represents a hydrogen atom or a lower alkyl group, and R2 represents an organic group having a polar group) in an arm portion; an acrylic acid-based polymer containing a repeating unit derived from an poly(α-lower alkyl)acrylic ester and a repeating unit derived from an (α-lower alkyl)acrylic ester represented by formula (I), and a method for producing a polymer through living polymerization, comprising forming an oligomer having a polymerization active end, which is an oligomer higher than an average 1.0-mer and lower than an average 4.0-mer or an average 4.0-mer, and polymerizing using the oligomer having a polymerization active end as an initiating species.

摘要翻译： 公开了一种基于丙烯酸的聚合物，其是含有由式（I）表示的（α-低级烷基）丙烯酸酯衍生的重复单元的星形聚合物：其中R1表示氢原子或低级烷基，R2表示 表示具有极性基团的有机基团） 含有源自聚（α-低级烷基）丙烯酸酯的重复单元的丙烯酸类聚合物和由式（I）表示的（α-低级烷基）丙烯酸酯衍生的重复单元，以及制备 聚合物通过活性聚合反应，包括形成具有聚合活性末端的低聚物，其是高于平均1.0聚体且低于平均4.0聚体或平均4.0聚物的低聚物，并且使用具有聚合活性的低聚物 结束作为起始物种。

公开(公告)号：US20080296755A1

公开(公告)日：2008-12-04

申请号：US12222233

申请日：2008-08-05

申请人： Tsuyoshi So ,  Hideo Kubo

发明人： Tsuyoshi So ,  Hideo Kubo

IPC分类号： H01L23/36

CPC分类号： H01L23/36 ,  H01L21/4871 ,  H01L23/42 ,  H01L23/642 ,  H01L25/165 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2224/0401

摘要： A semiconductor includes a board, a semiconductor element mounted on the board, an electronic component, with the semiconductor element, mounted on the board, a heat radiation member provided so as to face the board, the heat radiation member configured to radiate heat of the semiconductor element, and a thermal connecting member being configured to thermally connect the heat radiation member and the semiconductor element. A metal material is used as the thermal connecting member, and an adhesion preventing member is provided so as to be separated from the electronic component, the adhesion preventing member being configured to prevent the metal material molten and flowing at a heating time being adhered to the electronic component.

摘要翻译： 半导体包括板，安装在板上的半导体元件，安装在板上的半导体元件的电子部件，设置成面向板的散热构件，该散热构件被配置为辐射热 半导体元件和热连接构件，其被配置为热连接所述散热构件和所述半导体元件。 使用金属材料作为热连接构件，并且设置防粘接构件以与电子部件分离，防粘接构件用于防止金属材料在加热时熔化和流动粘附到 电子元件

公开(公告)号：US20060113105A1

公开(公告)日：2006-06-01

申请号：US11332287

申请日：2006-01-17

申请人： Hideo Kubo

发明人： Hideo Kubo

IPC分类号： H01B9/02

CPC分类号： H01L23/3675 ,  H01L23/42 ,  H01L23/433 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012

摘要： A package unit to be mounted on an external printed board includes a package board mounted with an exoergic circuit element, a heat spreader that transmits heat from the exoergic circuit element to a heat sink that radiates the heat, a joining member that seals between the exoergic circuit element and the heat spreader, and forms a sealing space in cooperation with the exoergic circuit element and the heat spreader, and a liquid metal sealed in the sealing space.

摘要翻译： 要安装在外部印刷电路板上的封装单元包括安装有散热电路元件的封装板，将散热电路元件的热量散发到辐射热量的散热片的散热器，密封在散热元件 电路元件和散热器，并与散热电路元件和散热器配合形成密封空间，以及密封在密封空间中的液态金属。

公开(公告)号：US5418232A

公开(公告)日：1995-05-23

申请号：US059606

申请日：1993-05-12

申请人： Tetsuya Mimura ,  Hideo Kubo

发明人： Tetsuya Mimura ,  Hideo Kubo

IPC分类号： A61K31/50 ,  A61K31/502 ,  A61P9/08 ,  A61P9/10 ,  A61P9/12 ,  A61P11/08 ,  C07D237/04 ,  C07D401/04 ,  C07D405/12 ,  C07D405/14 ,  C07D491/04 ,  C07D491/052 ,  A61K31/53 ,  C07D471/04

CPC分类号： C07D405/12 ,  C07D491/04

摘要： A compound of formula (I) possesses excellent potassium channel opening activity and is effective on various diseases arising from contractions of blood vessels, bronchial smooth muscles, etc., for example, ischemic heart diseases exemplified by angina pectoris, asthma, pollakisuria, sequela of subarachnoid hemorrhage, peripheral arterioinfarct, and so on. The compound has potent and long-lasting antihypertensive activity, with the onset of the action being slow, excellent activity in increasing renal blood flow, and high safety, and is therefore particularly useful as an antihypertensive. ##STR1## The substituents are as defined in the specification.

摘要翻译： 式（I）化合物具有优异的钾通道开放活性，并且对由血管收缩，支气管平滑肌等引起的各种疾病有效，例如心绞痛，哮喘，花粉症等的缺血性心脏病 蛛网膜下腔出血，外周动脉粥样硬化等。 该化合物具有有效和持久的抗高血压活性，起效缓慢，增加肾血流量的优异活性和高安全性，因此特别适用于抗高血压药物。 （I）取代基如说明书中所定义。