公开(公告)号：US20050184829A1

公开(公告)日：2005-08-25

申请号：US11062698

申请日：2005-02-23

申请人： Masahiro Yoshimoto ,  Hiroshi Fujita ,  Nobuaki Nagai ,  Tokuji Nishino ,  Shinichirou Kaneko

发明人： Masahiro Yoshimoto ,  Hiroshi Fujita ,  Nobuaki Nagai ,  Tokuji Nishino ,  Shinichirou Kaneko

IPC分类号： H01F27/00 ,  H01G4/40 ,  H03H3/00 ,  H03H7/01 ,  H03H7/075 ,  H03H7/12

CPC分类号： H03H3/00 ,  H01F17/03 ,  H03H7/0123 ,  H03H7/1775 ,  H03H2001/0085 ,  H03H2001/0092

摘要： The LC composite component of the present invention comprises a base, a first to third terminals provided on the base, a helical conductor provided on the base, and an internal layer conductor inside the base, the internal layer conductor being opposed to the helical conductor provided on the base, each of the first to third terminals being mutually and electrically noncontinuous, the helical conductor being provided in either position between the first to third terminals. A high-pass filter is thus realized. The component can be used for various devices that require a reduction in size and cost of the electronic device while ensuring the filter performance.

摘要翻译： 本发明的LC复合元件包括基座，设置在基座上的第一至第三端子，设置在基座上的螺旋导体和基座内部的内层导体，内层导体与螺旋导体相对设置 在基座上，第一至第三端子中的每一个相互和电气不连续，螺旋导体设置在第一至第三端子之间的任一位置。 从而实现高通滤波器。 该部件可用于需要在确保过滤器性能的同时减小电子设备的尺寸和成本的各种装置。

公开(公告)号：US5879216A

公开(公告)日：1999-03-09

申请号：US812403

申请日：1997-03-05

申请人： Yasuto Yoshii ,  Ikuhiro Okuno ,  Shozo Miyamoto ,  Masayuki Tanaka ,  Masahiro Yoshimoto ,  Masao Kubo ,  Tooru Watanabe ,  Tsuyosi Yokogawa

发明人： Yasuto Yoshii ,  Ikuhiro Okuno ,  Shozo Miyamoto ,  Masayuki Tanaka ,  Masahiro Yoshimoto ,  Masao Kubo ,  Tooru Watanabe ,  Tsuyosi Yokogawa

IPC分类号： H01J9/385 ,  H01J61/28 ,  H01J9/395

CPC分类号： H01J9/385 ,  H01J61/28

摘要： By applying radiation beam energy to a contact portion between an end portion 7 of a glass tube 1 and a zinc-mercury alloy drop 6 and the vicinity thereof by means of an optical fiber 5, the alloy drop 6 is directly heated so as to be caused to partly melt at a bottom portion thereof and fixed firmly to an inner wall surface of the end portion 7 of the glass tube without causing variations.

摘要翻译： 通过将光束能量通过光纤5向玻璃管1的端部7与锌 - 汞合金滴6及其附近的接触部分施加，将合金滴6直接加热至 导致其底部部分熔化并且牢固地固定在玻璃管的端部7的内壁表面上而不引起变化。

公开(公告)号：US5495395A

公开(公告)日：1996-02-27

申请号：US949977

申请日：1992-09-24

申请人： Takehiko Yoneda ,  Masahiro Yoshimoto ,  Yoshihiko Takayama ,  Tetsjhi Tsujhi ,  Hiromitsu Taki

发明人： Takehiko Yoneda ,  Masahiro Yoshimoto ,  Yoshihiko Takayama ,  Tetsjhi Tsujhi ,  Hiromitsu Taki

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/12 ,  H01R9/09 ,  H01R23/72

CPC分类号： H05K3/3436 ,  H05K1/141 ,  H05K3/3426 ,  H05K1/0243 ,  H05K1/0271 ,  H05K1/0306 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/4038 ,  Y02P70/613

摘要： A module substrate consists of a substrate mounting electronic parts on one surface thereof, a conductor for electrically conducting the electronic parts mounted on the substrate to the other surface of the substrate, a conductive solder for attaching the conductor to a base substrate movably contacting the other surface of the substrate to electrically connect the electronic parts with the base substrate, and a deformable bushing for holding the conductor to maintain the attachment of the conductor to the base substrate regardless of whether the base substrate is moved.

摘要翻译： 模块基板由在其一个表面上安装电子部件的基板，用于将安装在基板上的电子部件导电到基板的另一个表面的导体，用于将导体附接到可移动地接触另一个的基板的导电焊料 基板的表面电连接基底基板，以及可变形衬套，用于保持导体，以保持导体与基底基板的连接，而不管基底基板是否移动。