Abstract:
An organic optoelectronic component is disclosed. In an embodiment, an organic optoelectronic component includes an organic layer sequence having an active layer for emitting or absorbing electromagnetic radiation, a thin-film encapsulation on the organic layer sequence, an absorption layer on the organic layer sequence, the absorption layer configured to absorb and store a substance which is harmful to the organic layer sequence and a transport layer directly adjacent to the absorption layer, the transport layer configured to transport the harmful substance, wherein the transport layer has a greater diffusion coefficient and/or a higher transmission rate for the harmful substance than the absorption layer, and wherein the absorption layer has a higher storage capacity for the harmful substance than the transport layer so that the harmful substance, upon contact with the transport layer, is distributed within the transport layer and is subsequently absorbed by the absorption layer.
Abstract:
In various embodiments, an optoelectronic component is provided. The optoelectronic component includes a carrier body. An optoelectronic layer structure is formed above the carrier body and has at least one contact region for electrically contacting the optoelectronic layer structure. A covering body is arranged above the optoelectronic layer structure. At least one contact cutout in which at least one part of the contact region is exposed extends through the carrier body and/or the covering body. At least one plug element for electrically contacting the optoelectronic component is arranged at least partly in the contact cutout and tightly closes the contact cutout. A contact medium, via which the plug element is electrically coupled to the contact region, is arranged in the contact cutout.
Abstract:
An electronic component includes a connection carrier having a cover surface, a first electric connection point and a second electric connection point, and an organic active area. A first electrode interconnects in an electrically conductive manner the active area and the first electric connection point. An encapsulation layer protects the active area against humidity and atmospheric gases. The electronic component can be contacted from the outside by the electric connection points and the encapsulation layer is in direct contact, in places, with the connection carrier.
Abstract:
A double-sided emissive organic display device includes a carrier, a control element layer structure above the carrier, a plurality of first organic light emitting components, which are formed above the carrier, which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit first light substantially in a direction toward the carrier, and a plurality of second organic light emitting components, which are formed above the control element layer structure and which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit second light substantially in a direction away from the carrier.
Abstract:
Various embodiments may relate to a method for processing an electronic component. The method includes applying a planar structure provided with predetermined separation locations to the electronic component, and removing a part of the applied planar structure, wherein removing includes separating the planar structure at the predetermined separation locations.
Abstract:
Various embodiments relate to a method for closely connecting an organic optoelectronic component to a connection piece, including forming a first cavity in the organic optoelectronic component, wherein the first cavity has at least a first opening, introducing a connecting structure through the first opening into the first cavity, wherein the connecting structure has a first fixing area, wherein the first fixing area is configured partially complementarily to the form of the first cavity, forming a second cavity in a connection piece, wherein the second cavity has at least a second opening, wherein the second cavity is configured partially complementarily to the form of the second fixing area, and introducing a second fixing area through the second opening into the second cavity, and forming a friction-fitting connection of the organic optoelectronic component with the connecting piece once the connecting structure has been introduced into the first and the second cavity.
Abstract:
An electronic component may include an electrically active region, having a first contact pad, a second contact pad, an organic functional layer structure between the first contact pad and the second contact pad, at least one electrical terminal which is coupled to the first contact pad or to the second contact pad. The first contact pad and/or the second contact pad may include an encapsulation and an electrically conductive region. The encapsulation partly covers the electrically conductive region in such a way that a part of the first contact pad or of the second contact pad is exposed. The exposed region is completely laterally surrounded by encapsulation.
Abstract:
According to the disclosure, a method for producing an organic component is provided. The method includes providing a carrier substrate; forming an electrically conductive layer on or above the carrier substrate; applying an electrical potential to the electrically conductive layer; and forming at least one organic, functional layer for forming the organic component on or above the electrically conductive layer at least partly during the process of applying the electrical potential to the electrically conductive layer.
Abstract:
According to the present disclosure, an organic optoelectronic component provides with a first electrode, an organic functional layer structure above the first electrode, a second electrode above the organic functional layer structure, at least one contact section for electrically contacting the organic optoelectronic component, and an electrically conductive elastomer connector which is arranged above the contact section and is electrically connected to the contact section. The contact section is electrically connected to one of the electrodes.
Abstract:
According to the disclosure, a method for producing an organic component is provided. The method includes providing a carrier substrate; forming an electrically conductive layer on or above the carrier substrate; applying an electrical potential to the electrically conductive layer; and forming at least one organic, functional layer for forming the organic component on or above the electrically conductive layer at least partly during the process of applying the electrical potential to the electrically conductive layer.