Organic Optoelectronic Component
    31.
    发明申请

    公开(公告)号:US20180342701A1

    公开(公告)日:2018-11-29

    申请号:US15967120

    申请日:2018-04-30

    CPC classification number: H01L51/5259 H01L51/448 H01L51/524 H01L51/5253

    Abstract: An organic optoelectronic component is disclosed. In an embodiment, an organic optoelectronic component includes an organic layer sequence having an active layer for emitting or absorbing electromagnetic radiation, a thin-film encapsulation on the organic layer sequence, an absorption layer on the organic layer sequence, the absorption layer configured to absorb and store a substance which is harmful to the organic layer sequence and a transport layer directly adjacent to the absorption layer, the transport layer configured to transport the harmful substance, wherein the transport layer has a greater diffusion coefficient and/or a higher transmission rate for the harmful substance than the absorption layer, and wherein the absorption layer has a higher storage capacity for the harmful substance than the transport layer so that the harmful substance, upon contact with the transport layer, is distributed within the transport layer and is subsequently absorbed by the absorption layer.

    Electronic Device
    33.
    发明申请
    Electronic Device 审中-公开
    电子设备

    公开(公告)号:US20160285031A1

    公开(公告)日:2016-09-29

    申请号:US15032879

    申请日:2014-11-26

    Abstract: An electronic component includes a connection carrier having a cover surface, a first electric connection point and a second electric connection point, and an organic active area. A first electrode interconnects in an electrically conductive manner the active area and the first electric connection point. An encapsulation layer protects the active area against humidity and atmospheric gases. The electronic component can be contacted from the outside by the electric connection points and the encapsulation layer is in direct contact, in places, with the connection carrier.

    Abstract translation: 电子部件包括具有盖表面,第一电连接点和第二电连接点以及有机有源区的连接载体。 第一电极以导电方式互连有源区和第一电连接点。 封装层保护有源区域免受湿度和大气气体的影响。 电子部件可以通过电连接点从外部接触,并且封装层与连接托架直接接触。

    DOUBLE-SIDED EMISSIVE ORGANIC DISPLAY DEVICE AND METHOD FOR PRODUCING A DOUBLE-SIDED EMISSIVE ORGANIC DISPLAY DEVICE
    34.
    发明申请
    DOUBLE-SIDED EMISSIVE ORGANIC DISPLAY DEVICE AND METHOD FOR PRODUCING A DOUBLE-SIDED EMISSIVE ORGANIC DISPLAY DEVICE 审中-公开
    双面有机有机显示装置及其生产双面有机有机显示装置的方法

    公开(公告)号:US20160260791A1

    公开(公告)日:2016-09-08

    申请号:US15060635

    申请日:2016-03-04

    Abstract: A double-sided emissive organic display device includes a carrier, a control element layer structure above the carrier, a plurality of first organic light emitting components, which are formed above the carrier, which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit first light substantially in a direction toward the carrier, and a plurality of second organic light emitting components, which are formed above the control element layer structure and which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit second light substantially in a direction away from the carrier.

    Abstract translation: 双面发射有机显示装置包括载体,载体上方的控制元件层结构,形成在载体上方的多个第一有机发光部件,其电连接到控制元件层结构, 在双面发射有机显示装置的操作期间通过控制元件层结构驱动并且基本上沿着朝向载体的方向发射第一光,以及形成在控制元件上方的多个第二有机发光部件 并且它们电连接到控制元件层结构,并且在双面发射有机显示装置的操作期间通过控制元件层结构驱动,并且基本上沿远离载体的方向发射第二光。

    METHOD FOR CLOSELY CONNECTING AN ORGANIC OPTOELECTRONIC COMPONENT TO A CONNECTION PIECE, CONNECTION STRUCTURE FOR FORCE-LOCKING CONNECTING, AND OPTOELECTRONIC COMPONENT DEVICE
    36.
    发明申请
    METHOD FOR CLOSELY CONNECTING AN ORGANIC OPTOELECTRONIC COMPONENT TO A CONNECTION PIECE, CONNECTION STRUCTURE FOR FORCE-LOCKING CONNECTING, AND OPTOELECTRONIC COMPONENT DEVICE 有权
    将有机光电组件连接到连接件的方法,用于强制连接的连接结构和光电元件装置

    公开(公告)号:US20150263284A1

    公开(公告)日:2015-09-17

    申请号:US14408962

    申请日:2013-06-20

    Inventor: Simon Schicktanz

    Abstract: Various embodiments relate to a method for closely connecting an organic optoelectronic component to a connection piece, including forming a first cavity in the organic optoelectronic component, wherein the first cavity has at least a first opening, introducing a connecting structure through the first opening into the first cavity, wherein the connecting structure has a first fixing area, wherein the first fixing area is configured partially complementarily to the form of the first cavity, forming a second cavity in a connection piece, wherein the second cavity has at least a second opening, wherein the second cavity is configured partially complementarily to the form of the second fixing area, and introducing a second fixing area through the second opening into the second cavity, and forming a friction-fitting connection of the organic optoelectronic component with the connecting piece once the connecting structure has been introduced into the first and the second cavity.

    Abstract translation: 各种实施例涉及用于将有机光电子部件紧密连接到连接件的方法,包括在有机光电子部件中形成第一空腔,其中第一腔具有至少第一开口,将连接结构通过第一开口引入到 第一空腔,其中所述连接结构具有第一固定区域,其中所述第一固定区域被部分地配置成与所述第一腔体的形式配合,在连接件中形成第二空腔,其中所述第二空腔具有至少第二开口, 其特征在于,所述第二腔与所述第二固定区域的形式部分地互补配置,并且通过所述第二开口将第二固定区域引入到所述第二空腔中,并且在所述第二空腔中形成所述有机光电子部件与所述连接件的摩擦配合连接, 连接结构已经被引入第一和第二腔。

    ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
    37.
    发明申请
    ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT 审中-公开
    用于生产电子元件的电子元件和方法

    公开(公告)号:US20150108445A1

    公开(公告)日:2015-04-23

    申请号:US14398145

    申请日:2013-04-22

    Inventor: Simon Schicktanz

    Abstract: An electronic component may include an electrically active region, having a first contact pad, a second contact pad, an organic functional layer structure between the first contact pad and the second contact pad, at least one electrical terminal which is coupled to the first contact pad or to the second contact pad. The first contact pad and/or the second contact pad may include an encapsulation and an electrically conductive region. The encapsulation partly covers the electrically conductive region in such a way that a part of the first contact pad or of the second contact pad is exposed. The exposed region is completely laterally surrounded by encapsulation.

    Abstract translation: 电子部件可以包括电活性区域,其具有第一接触焊盘,第二接触焊盘,在第一接触焊盘和第二接触焊盘之间的有机功能层结构,至少一个电端子,其耦合到第一接触焊盘 或者到第二接触垫。 第一接触焊盘和/或第二接触焊盘可以包括封装和导电区域。 封装部分地覆盖导电区域,使得第一接触焊盘或第二接触焊盘的一部分露出。 曝光区域被封装完全横向包围。

    Method for producing an organic component

    公开(公告)号:US10600999B2

    公开(公告)日:2020-03-24

    申请号:US15558576

    申请日:2016-03-15

    Abstract: According to the disclosure, a method for producing an organic component is provided. The method includes providing a carrier substrate; forming an electrically conductive layer on or above the carrier substrate; applying an electrical potential to the electrically conductive layer; and forming at least one organic, functional layer for forming the organic component on or above the electrically conductive layer at least partly during the process of applying the electrical potential to the electrically conductive layer.

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