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公开(公告)号：US20230261393A1
公开(公告)日：2023-08-17
申请号：US18138542
申请日：2023-04-24
Applicant: QUALCOMM Incorporated
Inventor： Taesik YANG , Jorge FABREGA SANCHEZ , Mohammad Ali TASSOUDJI , Kevin Hsi-Huai WANG , Jeongil Jay KIM
CPC classification number: H01Q21/065 , H01Q1/2283 , H01Q5/364 , H01Q5/385
Abstract: Methods, systems, and devices for wireless communication are described. According to one or more aspects, the described apparatus includes one or more stacks of patch radiators (such as patch antennas) comprising at least a first patch radiator and a second patch radiator. The first patch radiator is associated with a low-band frequency; the second patch radiator is associated with a high-band frequency. The first patch radiator and the second patch radiator may overlap a ground plane, which may be asymmetric. Some or all patch radiators in a stack may be rotated relative to the ground plane, such that some or all edge of a patch radiator may be nonparallel with one or more edges of the ground plane. Further, each patch radiator stack may include separate feeds for each of at least two frequencies and two polarizations, and thus at least four feeds (one for each frequency/polarization combination) in total.
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32.发明公开公开(公告)号：US20230155273A1
公开(公告)日：2023-05-18
申请号：US17981176
申请日：2022-11-04
Applicant: QUALCOMM Incorporated
Inventor： Jeahyeong HAN , Rajneesh KUMAR , Suhyung HWANG , Jaehyun YEON , Mohammad Ali TASSOUDJI , Darryl Sheldon JESSIE , Ameya GALINDE
IPC: H01Q1/22 , H01L21/56 , H01L23/31 , H01L23/538 , H01L23/552 , H01L23/66 , H01Q1/36 , H01Q1/52 , H05K1/18 , H05K9/00
CPC classification number: H01Q1/2283 , H01L21/565 , H01L23/66 , H01L23/552 , H01L23/3121 , H01L23/5383 , H01L23/5386 , H01L23/5387 , H01Q1/36 , H01Q1/526 , H05K1/185 , H05K9/0081 , H01L21/4857
Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.
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公开(公告)号：US20220224013A1
公开(公告)日：2022-07-14
申请号：US17685670
申请日：2022-03-03
Applicant: QUALCOMM Incorporated
Inventor： Jorge FABREGA SANCHEZ , Alireza MOHAMMADIAN , Mohammad Ali TASSOUDJI , Assaf HAVIV
Abstract: An antenna system includes: a patch radiator being electrically conductive and configured to radiate energy in a first frequency band and a second frequency band, different from the first frequency band; a parasitic patch radiator overlapping with the patch radiator, the parasitic patch radiator being electrically conductive and being configured to radiate energy in the first frequency band; and at least one parasitic element including a conductor sized and disposed relative to the parasitic patch radiator such that a combination of the parasitic patch radiator and the at least one parasitic element will radiate energy in the second frequency band.
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公开(公告)号：US20220190485A1
公开(公告)日：2022-06-16
申请号：US17119638
申请日：2020-12-11
Applicant: QUALCOMM Incorporated
Inventor： Taesik YANG , Mohammad Ali TASSOUDJI , Jeongil Jay KIM , Darryl Sheldon JESSIE , Kevin Hsi-Huai WANG
Abstract: Techniques are provided for improving the performance of a multi-band antenna in a wireless device. An example wireless device includes at least one radio frequency integrated circuit, and at least one patch antenna operably coupled to the at least one radio frequency integrated circuit, including a first patch operably coupled to the at least one radio frequency integrated circuit, a ground plane disposed below the first patch, and a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane.
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35.发明申请公开(公告)号：US20210351816A1
公开(公告)日：2021-11-11
申请号：US17186580
申请日：2021-02-26
Applicant: QUALCOMM Incorporated
Inventor： Vasanthan RAGHAVAN , Tao LUO , Mohammad Ali TASSOUDJI , Yu-Chin OU , Kobi RAVID , Ozge KOYMEN , Junyi LI
IPC: H04B7/0413 , H04W16/28
Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may transmit, and a base station may receive, information related to multipath richness of a channel environment and information related to antenna module capabilities associated with the UE for at least a first frequency band and a second frequency band. The base station may transmit, and the UE may receive, information indicating a multiple input multiple output (MIMO) mode in which to operate one or more antenna modules of the UE based at least in part on the information related to the multipath richness of the channel environment, the antenna module capabilities associated with the UE, and respective cell loadings in the first frequency band and the second frequency band. Numerous other aspects are provided.
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Patent Agency Ranking
公开(公告)号：US20210351488A1
公开(公告)日：2021-11-11
申请号：US16871822
申请日：2020-05-11
Applicant: QUALCOMM Incorporated
Inventor： Chaoqi ZHANG , Suhyung HWANG , Jaehyun YEON , Taesik YANG , Jeongil Jay KIM , Darryl Sheldon JESSIE , Mohammad Ali TASSOUDJI
Abstract: A multi-core broadband printed circuit board (PCB) antenna and methods for fabricating such an antenna are provided. One example antenna implemented with a multi-core PCB generally includes a first core structure, a second core structure disposed above the first core structure, and one or more metal layers disposed above the second core structure or below the first core structure. The first core structure includes a first core layer, a first metal layer disposed below the first core layer, and a second metal layer disposed above the first core layer. The second core structure includes a second core layer, a third metal layer disposed below the second core layer, and a fourth metal layer disposed above the second core layer. The first core layer and the second core layer may have different thicknesses.
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37.发明申请公开(公告)号：US20210280959A1
公开(公告)日：2021-09-09
申请号：US16810621
申请日：2020-03-05
Applicant: QUALCOMM Incorporated
Inventor： Jeahyeong HAN , Rajneesh KUMAR , Suhyung HWANG , Jaehyun YEON , Mohammad Ali TASSOUDJI , Darryl Sheldon JESSIE , Ameya GALINDE
IPC: H01Q1/22 , H01Q1/52 , H01Q1/36 , H05K1/18 , H05K9/00 , H01L23/31 , H01L23/538 , H01L23/66 , H01L23/552 , H01L21/56
Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.
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公开(公告)号：US20200006846A1
公开(公告)日：2020-01-02
申请号：US16022851
申请日：2018-06-29
Applicant: QUALCOMM Incorporated
Inventor： Jon LASITER , Seong Heon JEONG , Ravindra Vaman SHENOY , Jeremy Darren DUNWORTH , Mohammad Ali TASSOUDJI
Abstract: Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.
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公开(公告)号：US20190260127A1
公开(公告)日：2019-08-22
申请号：US16276957
申请日：2019-02-15
Applicant: QUALCOMM Incorporated
Inventor： Guining SHI , Young Jun SONG , Allen Minh-Triet TRAN , Mohammad Ali TASSOUDJI , Elizabeth WYRWICH , Julio ZEGARRA , Clinton James WILBER , Neil BURNS , Jorge FABREGA SANCHEZ
Abstract: An antenna system for transducing radio-frequency energy includes: a first antenna sub-system comprising a plurality of radiators and a ground conductor, each of the plurality of radiators being sized and shaped to transduce millimeter-wave energy between first wireless signals and first electrical current signals; and a second antenna sub-system comprising a first radiator configured to transduce sub-6 GHz energy between second wireless signals and second electrical current signals, wherein the first radiator comprises the ground conductor.
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公开(公告)号：US20190067221A1
公开(公告)日：2019-02-28
申请号：US15839831
申请日：2017-12-12
Applicant: QUALCOMM Incorporated
Inventor： Jon Bradley LASITER , Ravindra Vaman SHENOY , Donald William KIDWELL, JR. , Mohammad Ali TASSOUDJI , Vladimir APARIN , Seong Heon JEONG , Jeremy DUNWORTH , Alireza MOHAMMADIAN , Mario Francisco VELEZ , Chin-Kwan KIM
IPC: H01L23/66 , H01L23/00 , H01L23/498 , H01L23/552 , H01L23/31 , H01L21/50 , H01Q1/22 , H01Q1/24
Abstract: In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.
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