公开(公告)号：US20100160997A1

公开(公告)日：2010-06-24

申请号：US12686137

申请日：2010-01-12

Applicant: Robert Shawn Johnson ,  Warren S. Dabney ,  Robert A. Stevenson ,  Christopher Michael Williams ,  Holly Noelle Moschiano ,  Scott Brainard ,  Daniel Robert Kaiser ,  Henry R. Halperin ,  Albert C. Lardo

Inventor： Robert Shawn Johnson ,  Warren S. Dabney ,  Robert A. Stevenson ,  Christopher Michael Williams ,  Holly Noelle Moschiano ,  Scott Brainard ,  Daniel Robert Kaiser ,  Henry R. Halperin ,  Albert C. Lardo

IPC: A61N1/375 ,  A61N1/05 ,  A61B18/14

CPC classification number: G01R33/285 ,  A61B5/042 ,  A61B5/055 ,  A61B5/7203 ,  A61B2018/00839 ,  A61B2090/374 ,  A61N1/05 ,  A61N1/086 ,  A61N1/3718 ,  B82Y30/00

Abstract: An energy management system facilitates the transfer of high frequency energy coupled into an implanted lead at a selected RF frequency or frequency band, to an energy dissipating surface. This is accomplished by conductively coupling the implanted lead to the energy dissipating surface through an energy diversion circuit including one or more passive electronic network components whose impedance characteristics are at least partially tuned to the implanted lead's impedance characteristics.

Abstract translation: 能量管理系统有助于以选定的RF频率或频带将耦合到植入引线中的高频能量传输到能量消散表面。 这是通过将植入的导线导电地耦合到能量消散表面来实现的，该能量分流电路包括一个或多个无源电子网络部件，其阻抗特性至少部分地被调整到植入引线的阻抗特性。

公开(公告)号：US20100134951A1

公开(公告)日：2010-06-03

申请号：US12563919

申请日：2009-09-21

Applicant: Richard L. Brendel ,  Robert A. Stevenson ,  Jason Woods

Inventor： Richard L. Brendel ,  Robert A. Stevenson ,  Jason Woods

IPC: H01G4/35 ,  H01G13/00 ,  H01R43/16

CPC classification number: H01G4/228 ,  A61N1/3718 ,  A61N1/3754 ,  H01G4/35 ,  Y10T29/435 ,  Y10T29/49204

Abstract: A discoidal feedthrough capacitor has its active electrode plates disposed within a dielectric body so that an edge of the active electrode plates is exposed at a surface of a through-hole for a conductive lead. The conductive lead is conductively coupled to the exposed edge of the electrode plates without an intervening conductive termination surface. Similarly, a ground electrode plate set of the feedthrough capacitor may have an edge exposed at the outer periphery of the capacitor for conductively coupling the exposed edge of the ground electrode plate to a conductive ferrule without an intervening conductive termination surface.

Abstract translation: 盘状馈通电容器的有源电极板设置在电介质体内，使得有源电极板的边缘暴露在用于导电引线的通孔的表面上。 导电引线导电地耦合到电极板的暴露边缘，而没有中间的导电端接表面。 类似地，旁路电容器的接地电极板组可以在电容器的外周具有暴露的边缘，用于将接地电极板的暴露边缘导电耦合到导电套圈，而没有中间的导电端接表面。

公开(公告)号：US20090312835A1

公开(公告)日：2009-12-17

申请号：US12477422

申请日：2009-06-03

Applicant: Robert A. Stevenson

Inventor： Robert A. Stevenson

IPC: A61M1/12 ,  H05K7/00 ,  A61N1/375 ,  A61N1/362 ,  A61N1/39 ,  A61M5/14 ,  B65B31/00

CPC classification number: A61N1/375 ,  A61M1/122 ,  A61M5/14276 ,  A61M2207/00 ,  A61M2209/045 ,  A61N1/08 ,  A61N1/37 ,  A61N1/3925

Abstract: Active implantable medical devices (AIMDs) are backfilled with a dielectric fluid to increase the volts per mil dielectric breakdown strength between internal circuit elements. In a method for backfilling the AIMD with dielectric fluid, substantially all air and moisture is evacuated from the AIMD housing prior to backfilling the AIMD housing with a dielectric fluid having a dielectric breakdown strength greater than air, nitrogen or helium. The AIMD is constructed to accommodate volumetric expansion or contraction of the dielectric fluid due to changes of pressure or temperature of the dielectric fluid to maintain integrity of the AIMD.

Abstract translation: 有源植入式医疗设备（AIMD）用电介质流体回填，以增加内部电路元件之间的密度介电击穿强度。 在用介质流体回填AIMD的方法中，在用具有大于空气，氮或氦的介电击穿强度的介电流体回填AIMD外壳之前，基本上所有的空气和水分都从AIMD壳体中排出。 AIMD被构造成适应由于介电流体的压力或温度的变化而导致的介电流体的体积膨胀或收缩，以保持AIMD的完整性。

公开(公告)号：US07623335B2

公开(公告)日：2009-11-24

申请号：US11308662

申请日：2006-04-19

Applicant: Robert A. Stevenson ,  Richard L. Brendel ,  Christine A. Frysz ,  Haytham Hussein ,  Scott Knappen ,  Ryan A. Stevenson

Inventor： Robert A. Stevenson ,  Richard L. Brendel ,  Christine A. Frysz ,  Haytham Hussein ,  Scott Knappen ,  Ryan A. Stevenson

IPC: H01G4/35

CPC classification number: A61N1/3754 ,  H01G4/35

Abstract: A feedthrough terminal assembly for active implantable medical devices includes a structural wire bond pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. Direct attachment of wire bond pads to terminal pins enables thermal or ultrasonic bonding of lead wires, while shielding the capacitor or other delicate components from the forces applied to the assembly during attachment of the wires.

Abstract translation: 用于有源可植入医疗装置的馈通终端组件包括用于方便地从可植入医疗装置内部的电路或设备外部的电线连接电线的结构引线接合焊盘。 将引线接合焊盘直接连接到端子引脚可以实现导线的热连接或超声波焊接，同时屏蔽电容器或其他微妙部件与连接线时施加到组件上的力。

公开(公告)号：US20090163980A1

公开(公告)日：2009-06-25

申请号：US12337170

申请日：2008-12-17

Applicant: Robert A. Stevenson

Inventor： Robert A. Stevenson

IPC: A61N1/08

CPC classification number: A61N1/3718 ,  A61N1/086

Abstract: An MRI-compatible electronic medical therapy system is provided for temporarily preventing current flow through an implanted lead wire in the presence of an induced radio frequency, magnetic, or static field. One or more normally closed switches are disposed in series between the AIMD and the one or more distal electrodes. The switch may be incorporated in the AIMD, lead wire, or within or adjacent to the electrode. The switch remains closed during normal AIMD-related therapy, but temporarily opens in the presence of an induced radio frequency, magnetic, or static field so as to prevent current flow through the electrode and lead wire. The switches prevent current from circulating that could be induced by a medical therapeutic diagnostic device, which can cause overheating of lead wires, excessive currents or temperatures and tissue damage.

Abstract translation: 提供一种MRI兼容的电子医疗治疗系统，用于在感应的射频，磁场或静态场的存在下暂时防止流过植入的导线的电流。 一个或多个常闭开关串联设置在AIMD和一个或多个远端电极之间。 该开关可以结合在AIMD，引线中，或者在电极内部或附近。 在正常的AIMD相关治疗期间，开关保持关闭，但是在存在感应射频，磁场或静电场的情况下暂时打开，以防止电流流过电极和引线。 这些开关防止可能由医疗诊断装置引起的电流循环，这可导致引线过热，过度的电流或温度以及组织损伤。

公开(公告)号：US06999818B2

公开(公告)日：2006-02-14

申请号：US10825900

申请日：2004-04-15

Applicant: Robert A. Stevenson ,  Christine A. Frysz ,  Haytham Hussein ,  Richard L. Brendel

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Haytham Hussein ,  Richard L. Brendel

IPC: A61N1/375 ,  A61N1/16

CPC classification number: A61N1/3754 ,  H03H1/0007 ,  H03H2001/0042

Abstract: A feedthrough terminal assembly for an active implantable medical device includes a conductive ferrule conductively coupled to a housing of the medical device, a feedthrough capacitor conductively coupled to the ferrule, an inductor closely associated with the capacitor in non-conductive relation, and a conductive terminal pin extending through the capacitor and the inductor. The terminal pin extends through the inductor in non-conductive relation and is conductively coupled to active electrode plates of the capacitor. In one preferred form, the terminal pin is wound about the inductor. Additionally, the inductor may be maintained in close association with the capacitor without forming a direct physical attachment therebetween.

Abstract translation: 用于有源可植入医疗装置的馈通端子组件包括导电耦合到医疗装置的壳体的导电套圈，导电耦合到套圈的馈通电容器，与非导电关系的电容器紧密相关的电感器，以及导电端子 引脚延伸穿过电容器和电感器。 端子引脚以非导通关系延伸穿过电感器，并且与电容器的有源电极板导电耦合。 在一个优选形式中，端子引脚缠绕在电感器周围。 另外，电感器可以与电容器保持紧密关联，而不在其间形成直接的物理连接。

公开(公告)号：US06643903B2

公开(公告)日：2003-11-11

申请号：US09812371

申请日：2001-03-16

Applicant: Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel

Inventor： Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel

IPC: H01G700

CPC classification number: H01G4/35 ,  A61N1/3754 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49147

Abstract: A process for manufacturing an EMI filter feedthrough terminal assembly is provided for mating a feedthrough filter capacitor with an hermetic terminal assembly including a ferrule and one or more lead wires which extend through the ferrule in non-conductive relation. The process includes the steps of placing the hermetic terminal assembly, having a capture flange, into a holding fixture, and forming a seat of non-conductive thermal-setting material onto the terminal assembly within the capture flange. A feedthrough filter capacitor is loaded into the capture flange on top of the seat, and then the seat is cured. A conductive thermal-setting material is dispensed between an outer diameter of the feedthrough filter capacitor and the capture flange. The assembly is then centrifuged to pack the conductive thermal-setting material. The conductive thermal-setting material is then cured between the outer diameter of the feedthrough filter capacitor and the capture flange. Preferably, the height of the capture flange is one-quarter to three-quarters of an axial thickness of the capacitor.

Abstract translation: 提供了一种用于制造EMI滤波器馈通端子组件的方法，用于将馈通滤波电容器与包括套圈和一个或多个引线的密封端子组件配合，该导线以非导电关系延伸穿过套圈。 该方法包括以下步骤：将具有捕获凸缘的密封端子组件放置到保持夹具中，以及在捕获凸缘内的终端组件上形成非导电热固化材料座。 馈通滤波电容器装载到座椅顶部的捕获法兰中，然后固定座椅。 导通热固化材料分配在馈通滤波电容器的外径与捕获凸缘之间。 然后将组件离心以包装导电热定型材料。 导电热固化材料然后在馈通滤波电容器的外径和捕获凸缘之间固化。 优选地，捕获凸缘的高度是电容器的轴向厚度的四分之三到四分之三。

公开(公告)号：US06567259B2

公开(公告)日：2003-05-20

申请号：US10251672

申请日：2002-09-20

Applicant: Robert A. Stevenson ,  Donald K. Haskell ,  John E. Roberts

Inventor： Robert A. Stevenson ,  Donald K. Haskell ,  John E. Roberts

IPC: H01G435

CPC classification number: A61N1/3754 ,  H01G4/35

Abstract: A feedthrough filter capacitor assembly for use in active implantable medical devices and a related process for manufacturing a monolithic ceramic capacitor utilizing dielectric materials having a dielectric constant greater than 7000, and preferably in the range of 8500 to 22,000. In the manufacture of the monolithic ceramic capacitor, one or more Curie point shifters and/or other dopants are added to the dielectric material to optimize the dielectric constant at the human body temperature of 37° C. For manufacturing purposes, dopants may be added to the dielectric material to broaden the Curie point peak or point of maximum dielectric constant thereof. The effect is that when such capacitors and terminal assemblies are utilized in a high-voltage defibrillator circuit of an implantable medical device, the dielectric material is optimized so that during the delivery of high-voltage electrical energy, capacitance value of the capacitor drops substantially.

Abstract translation: 用于有源可植入医疗装置的馈通滤波电容器组件和利用介电常数大于7000，优选在8500至22,000范围内的介电材料制造单片陶瓷电容器的相关方法。 在制造叠层陶瓷电容器时，将一个或多个居里点移位器和/或其它掺杂剂添加到电介质材料中以使人体温度为37℃下的介电常数最优化。为了制造目的，可以将掺杂剂添加到 电介质材料以扩大居里点峰值或其最大介电常数点。 其效果在于，当将这种电容器和端子组件用于可植入医疗装置的高压除颤器电路时，电介质材料被优化，使得在高压电能传递期间，电容器的电容值基本上下降。

公开(公告)号：US06473291B1

公开(公告)日：2002-10-29

申请号：US09820998

申请日：2001-03-28

Applicant: Robert A. Stevenson

Inventor： Robert A. Stevenson

IPC: H01G4228

CPC classification number: H01G4/232 ,  H01G4/228 ,  H05K3/308 ,  H05K3/3426 ,  Y02P70/613

Abstract: A chip capacitor is conductively coupled to spaced-apart (i.e., non-conductively coupled) circuit traces of an integrated circuit to provide a four terminal network. The chip capacitor includes a casing of dielectric material having first and second sets of electrode plates disposed therein, a first conductive lead frame which is conductively coupled to the first set of electrode plates, and a second conductive lead frame which is conductively coupled to the second set of electrode plates. The first and second lead frames are, in turn, conductively coupled to the circuit traces so as to route the output (or input) current of an electronic device through the capacitor.

Abstract translation: 芯片电容器电导耦合到集成电路的间隔（即非导电耦合）电路迹线以提供四端子网络。 片状电容器包括介电材料的壳体，其具有设置在其中的第一和第二组电极板，第一导电引线框架，其导电地耦合到第一组电极板;以及第二导电引线框架，其导电地耦合到第二组电极板 电极板组。 第一引线框架和第二引线框架又与电路迹线电连接，以便通过电容器来布线电子器件的输出（或输入）电流。

公开(公告)号：US06456481B1

公开(公告)日：2002-09-24

申请号：US09872092

申请日：2001-05-31

Applicant: Robert A. Stevenson

Inventor： Robert A. Stevenson

IPC: H01G435

CPC classification number: H01G4/35 ,  A61N1/3754

Abstract: An integrated electromagnetic interference (EMI) filter capacitor and DC blocking capacitor is provided in a single monolithic casing of ceramic dielectric material. First and second sets of electrode plates are disposed within the monolithic casing to form the DC blocking capacitor, and ground electrode plates are disposed between selected portions of the first and second sets of electrode plates to form the EMI filter. In several of the embodiments, the first and second sets of electrode plates form a plurality of distinct DC blocking capacitors. The ground electrode plates cooperatively form, with the first and second sets of electrode plates, EMI filters for each of the distinct DC blocking capacitors. Discontinuous lead wires may be provided which extend at least partially into the casing, wherein a first segment of the lead wire is conductively coupled to the first set of electrode plates, and a second set of the lead wire is conductively coupled to the second set of electrode plates. Grounded shields also may be co-planarly disposed between adjacent components of the first and second sets of electrode plates to reduce cross-talk therebetween.

Abstract translation: 在陶瓷电介质材料的单块外壳中提供集成电磁干扰（EMI）滤波电容器和隔直流电容器。 第一和第二组电极板设置在整体壳体内以形成隔直电容器，并且接地电极板设置在第一组和第二组电极板的选定部分之间以形成EMI滤波器。 在几个实施例中，第一和第二组电极板形成多个不同的直流隔离电容器。 接地电极板与第一组和第二组电极板协同地形成用于每个不同的直流隔离电容器的EMI滤波器。 可以提供不连续的引线，其至少部分延伸到壳体中，其中引线的第一段导电地耦合到第一组电极板，并且第二组导线与第二组导线 电极板。 接地屏蔽也可以共面地设置在第一和第二组电极板的相邻部件之间，以减少它们之间的串扰。