Abstract:
A one-piece cylindrical bandstop filter for medical lead systems incorporates parallel capacitive and inductive elements in a compact cylindrical configuration. The compact cylindrical configuration of the bandstop filter does not add significantly to the size or weight of the medical lead system. Preferably, the bandstop filters are of biocompatible materials or hermetically sealed in biocompatible containers. The parallel capacitive and inductive elements are placed in series with the medical lead system, and are selected so as to resonate at one or more selected frequencies, typically MRI pulsed frequencies.
Abstract:
A bandstop filter having optimum component values is provided for a lead of an active implantable medical device (AIMD). The bandstop filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the implantable lead of the AIMD, wherein values of capacitance and inductance are selected such that the bandstop filter is resonant at a selected frequency. The Q of the inductor may be relatively maximized and the Q of the capacitor may be relatively minimized to reduce the overall Q of the bandstop filter to attenuate current flow through the implantable lead along a range of selected frequencies.
Abstract:
A feedthrough terminal assembly for an active implantable medical device (AIMD) includes a plurality of leadwires extending from electronic circuitry of the AIMD, and a lossy ferrite inductor through which the leadwires extend in non-conductive relation for increasing the impedance of the leadwires at selected RF frequencies and reducing magnetic flux core saturation of the lossy ferrite inductor through phase cancellation of signals carried by the leadwires. A process is also provided for filtering electromagnetic interference (EMI) in an implanted leadwire extending from an AIMD into body fluids or tissue, wherein the leadwire is subjected to occasional high-power electromagnetic fields such as those produced by medical diagnostic equipment including magnetic resonance imaging.
Abstract:
An energy management system facilitates the transfer of high frequency energy coupled into an implanted lead at a selected RF frequency or frequency band, to an energy dissipating surface. This is accomplished by conductively coupling the implanted lead to the energy dissipating surface through an energy diversion circuit including one or more passive electronic network components whose impedance characteristics are at least partially tuned to the implanted lead's impedance characteristics.
Abstract:
A discoidal feedthrough capacitor has its active electrode plates disposed within a dielectric body so that an edge of the active electrode plates is exposed at a surface of a through-hole for a conductive lead. The conductive lead is conductively coupled to the exposed edge of the electrode plates without an intervening conductive termination surface. Similarly, a ground electrode plate set of the feedthrough capacitor may have an edge exposed at the outer periphery of the capacitor for conductively coupling the exposed edge of the ground electrode plate to a conductive ferrule without an intervening conductive termination surface.
Abstract:
Active implantable medical devices (AIMDs) are backfilled with a dielectric fluid to increase the volts per mil dielectric breakdown strength between internal circuit elements. In a method for backfilling the AIMD with dielectric fluid, substantially all air and moisture is evacuated from the AIMD housing prior to backfilling the AIMD housing with a dielectric fluid having a dielectric breakdown strength greater than air, nitrogen or helium. The AIMD is constructed to accommodate volumetric expansion or contraction of the dielectric fluid due to changes of pressure or temperature of the dielectric fluid to maintain integrity of the AIMD.
Abstract:
A feedthrough terminal assembly for active implantable medical devices includes a structural wire bond pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. Direct attachment of wire bond pads to terminal pins enables thermal or ultrasonic bonding of lead wires, while shielding the capacitor or other delicate components from the forces applied to the assembly during attachment of the wires.
Abstract:
An MRI-compatible electronic medical therapy system is provided for temporarily preventing current flow through an implanted lead wire in the presence of an induced radio frequency, magnetic, or static field. One or more normally closed switches are disposed in series between the AIMD and the one or more distal electrodes. The switch may be incorporated in the AIMD, lead wire, or within or adjacent to the electrode. The switch remains closed during normal AIMD-related therapy, but temporarily opens in the presence of an induced radio frequency, magnetic, or static field so as to prevent current flow through the electrode and lead wire. The switches prevent current from circulating that could be induced by a medical therapeutic diagnostic device, which can cause overheating of lead wires, excessive currents or temperatures and tissue damage.
Abstract:
A feedthrough terminal assembly for an active implantable medical device includes a conductive ferrule conductively coupled to a housing of the medical device, a feedthrough capacitor conductively coupled to the ferrule, an inductor closely associated with the capacitor in non-conductive relation, and a conductive terminal pin extending through the capacitor and the inductor. The terminal pin extends through the inductor in non-conductive relation and is conductively coupled to active electrode plates of the capacitor. In one preferred form, the terminal pin is wound about the inductor. Additionally, the inductor may be maintained in close association with the capacitor without forming a direct physical attachment therebetween.
Abstract:
A process for manufacturing an EMI filter feedthrough terminal assembly is provided for mating a feedthrough filter capacitor with an hermetic terminal assembly including a ferrule and one or more lead wires which extend through the ferrule in non-conductive relation. The process includes the steps of placing the hermetic terminal assembly, having a capture flange, into a holding fixture, and forming a seat of non-conductive thermal-setting material onto the terminal assembly within the capture flange. A feedthrough filter capacitor is loaded into the capture flange on top of the seat, and then the seat is cured. A conductive thermal-setting material is dispensed between an outer diameter of the feedthrough filter capacitor and the capture flange. The assembly is then centrifuged to pack the conductive thermal-setting material. The conductive thermal-setting material is then cured between the outer diameter of the feedthrough filter capacitor and the capture flange. Preferably, the height of the capture flange is one-quarter to three-quarters of an axial thickness of the capacitor.