公开(公告)号：US09936298B2

公开(公告)日：2018-04-03

申请号：US15211137

申请日：2016-07-15

Applicant: Robert Bosch GmbH

Inventor： Thomas Buck ,  Fabian Purkl ,  Michael Stumber ,  Ricardo Ehrenpfordt ,  Rolf Scheben ,  Benedikt Stein ,  Christoph Schelling

IPC: H04R19/04 ,  H04R7/14 ,  H04R7/18 ,  H04R19/00 ,  H04R31/00 ,  B81B3/00 ,  H04R23/00 ,  H04R17/02

CPC classification number: H04R7/14 ,  B81B3/0072 ,  H04R7/18 ,  H04R17/02 ,  H04R19/005 ,  H04R19/04 ,  H04R23/006 ,  H04R31/006 ,  H04R2201/003

Abstract: For a MEMS component, in the layer structure of which at least one sound-pressure-sensitive diaphragm element is formed, which spans an opening or cavity in the layer structure and the deflections of which are detected with the aid of at least one piezosensitive circuit element in the attachment area of the diaphragm element, design measures are provided, by which the stress distribution over the diaphragm surface may be influenced intentionally in the event of deflection of the diaphragm element. In particular, measures are provided, by which the mechanical stresses are intentionally introduced into predefined areas of the diaphragm element, to thus amplify the measuring signal. For this purpose, the diaphragm element includes at least one designated bending area, which is defined by the structuring of the diaphragm element and is more strongly deformed in the event of sound action than the adjoining diaphragm sections.

公开(公告)号：US09914636B2

公开(公告)日：2018-03-13

申请号：US15212334

申请日：2016-07-18

Applicant: Robert Bosch GmbH

Inventor： Thomas Buck ,  Fabian Purkl ,  Michael Stumber ,  Rolf Scheben ,  Benedikt Stein ,  Christoph Schelling

IPC: B81B3/00 ,  H04R17/02

CPC classification number: B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/015 ,  B81B2207/07 ,  H04R17/02 ,  H04R2201/003

Abstract: A MEMS microphone component including at least one sound-pressure-sensitive diaphragm element is formed in the layer structure of the MEMS component, which spans an opening in the layer structure. The diaphragm element is attached via at least one column element in the central area of the opening to the layer structure of the component. The deflections of the diaphragm element are detected with the aid of at least one piezosensitive circuit element, which is implemented in the layer structure of the diaphragm element and is situated in the area of the attachment of the diaphragm element to the column element.

公开(公告)号：US09651375B2

公开(公告)日：2017-05-16

申请号：US13889791

申请日：2013-05-08

Applicant: Robert Bosch GmbH

Inventor： Burkhard Kuhlmann ,  Rolf Scheben ,  Daniel Christoph Meisel ,  Benjamin Schmidt ,  Thorsten Balslink

IPC: G01C19/00 ,  G01C19/56 ,  G01C19/5747

CPC classification number: G01C19/56 ,  G01C19/5747

Abstract: A yaw-rate sensor, having a substrate which has a main extension plane, for detecting a yaw rate about a first direction extending either parallel to the main extension plane or perpendicular to the main extension plane. The yaw-rate sensor has a drive device, a first Coriolis mass and a second Coriolis mass, the drive device being configured to drive at least one part of the first Coriolis mass and at least one part of the second Coriolis mass in a direction parallel to a drive direction extending perpendicular to the first direction.

公开(公告)号：US20170022047A1

公开(公告)日：2017-01-26

申请号：US15214193

申请日：2016-07-19

Applicant: Robert Bosch GmbH

Inventor： Fabian PURKL ,  Michael Stumber ,  Ricardo Ehrenpfordt ,  Rolf Scheben ,  Benedikt Stein ,  Christoph Schelling

IPC: B81B3/00 ,  H04R17/02

CPC classification number: B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0163 ,  H04R17/02 ,  H04R2201/003

Abstract: Measures are provided, by which mechanical stresses within the diaphragm structure of a MEMS component may be intentionally dissipated, and which additionally enable the implementation of diaphragm elements having a large diaphragm area in comparison to the chip area. The diaphragm element is formed in the layer structure of the MEMS component. It spans an opening in the layer structure and is attached via a spring structure to the layer structure. The spring structure includes at least one first spring component, which is oriented essentially in parallel to the diaphragm element and is formed in a layer plane below the diaphragm element. Furthermore, the spring structure includes at least one second spring component, which is oriented essentially perpendicularly to the diaphragm element. The spring structure is designed in such a way that the area of the diaphragm element is greater than the area of the opening which it spans.

Abstract translation: 提供了一种措施，通过其可以有意地消散MEMS部件的膜结构内的机械应力，并且这另外使得能够实现与芯片面积相比具有大的隔膜面积的隔膜元件。 隔膜元件形成在MEMS部件的层结构中。 它跨越层结构中的开口并且经由弹簧结构附接到层结构。 弹簧结构包括至少一个第一弹簧部件，其基本上平行于隔膜元件定向并且形成在隔膜元件下方的层平面中。 此外，弹簧结构包括至少一个第二弹簧部件，其基本上垂直于隔膜元件定向。 弹簧结构设计成使得隔膜元件的面积大于它所跨开的开口面积。

公开(公告)号：US09516424B2

公开(公告)日：2016-12-06

申请号：US14732368

申请日：2015-06-05

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Rolf Scheben ,  Ricardo Ehrenpfordt

IPC: H04R25/00 ,  H04R19/00 ,  H04R19/04 ,  H04R31/00

CPC classification number: H04R19/005 ,  H04R19/04 ,  H04R31/00

Abstract: A micromechanical sensor system combination, and a corresponding manufacturing method, includes an interposer chip including a first front side and a first back side which includes first electrical contacts on the first front side and second electrical contacts on the first back side, the interposer chip having first electrical vias which electrically connect the first electrical contacts to the second electrical contacts; as well as a micromechanical sensor chip system including a second front side a second back side including at least one first sensor device and a second sensor device which are laterally adjacent, the first front side being attached on the second front side so that the first sensor device and the second sensor device are electrically and mechanically connected to the first electrical contacts.

Abstract translation: 微机械传感器系统组合和相应的制造方法包括插入器芯片，其包括第一前侧和第一后侧，该第一前侧和第一后侧包括第一前侧上的第一电触点和第一背侧上的第二电触点，所述插入器芯片具有 第一电气通孔，其将第一电触头电连接到第二电触头; 以及包括第二前侧的微机械传感器芯片系统，第二后侧包括至少一个横向相邻的第一传感器装置和第二传感器装置，第一前侧附接在第二前侧，使得第一传感器 装置和第二传感器装置电连接和机械地连接到第一电触头。

公开(公告)号：US20150078590A1

公开(公告)日：2015-03-19

申请号：US14391139

申请日：2013-03-05

Applicant: Robert Bosch GmbH

Inventor： Mike Daley ,  Rolf Scheben ,  Christoph Schelling

IPC: H04R17/00

CPC classification number: H04R17/005 ,  B81B3/007 ,  B81B3/0086 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00158

Abstract: The disclosure relates to a micro-electromechanical membrane arrangement with a substrate, which has a multiplicity of recesses on a surface, a first electrically conductive electrode layer, which is arranged on the surface of the substrate and has a multiplicity of first depressions coinciding with the recesses, and an electrically conductive membrane layer, which can be deflected in a direction perpendicular to the active surface of the substrate, is arranged over the first electrode layer and is kept at a distance therefrom by a first distance value.

Abstract translation: 本公开涉及具有基板的微机电膜装置，该基板在表面上具有多个凹槽，第一导电电极层设置在基板的表面上，并且具有多个与该基板一致的第一凹陷 凹部和可以在垂直于衬底的有源表面的方向上偏转的导电膜层布置在第一电极层的上方，并且与其保持距离第一距离值。

公开(公告)号：US11697583B2

公开(公告)日：2023-07-11

申请号：US17224613

申请日：2021-04-07

Applicant: Robert Bosch GmbH

Inventor： Cristian Nagel ,  Johannes Classen ,  Rolf Scheben ,  Rudy Eid

IPC: B81B7/00 ,  B81B3/00

CPC classification number: B81B3/0027

Abstract: A micromechanical device including a substrate, a movable mass, and a stop spring structure, which includes a stop. The substrate includes a substrate surface in parallel to a main extension plane and the movable mass is situated movably above the substrate surface in relation to the substrate. The stop spring structure is connected to the movable mass. The stop is designed to strike against the substrate surface in the event of a deflection of the movable mass in a z direction, perpendicular to the main extension plane. The stop spring structure, at the location of the stop, includes a first spring constant, a second spring constant, in parallel to the main extension plane, and a third spring constant, in parallel to the main extension plane and perpendicular to the x direction. The first spring constant is greater than the second spring constant and/or is greater than the third spring constant.

公开(公告)号：US20230194262A1

公开(公告)日：2023-06-22

申请号：US18060052

申请日：2022-11-30

Applicant: Robert Bosch GmbH

Inventor： Alexander Tsapkolenko ,  Hartmut Ruf ,  Mirko Hofmann ,  Rolf Scheben

IPC: G01C19/5712 ,  G01P15/18

CPC classification number: G01C19/5712 ,  G01P15/18

Abstract: A sensor system. The sensor system includes a rotation rate sensor and a control unit, the rotation rate sensor including a seismic mass and being configured to drive a movement of the seismic mass with the aid of a driving force, the control unit being configured to detect a free fall of the sensor system and to deactivate the driving force in the event of a detection of the free fall. A method for securing a sensor system, in a detection step a free fall of the sensor system being detected by the control unit, and in a securing step the driving force being deactivated by the control unit, is also described.

公开(公告)号：US20210333103A1

公开(公告)日：2021-10-28

申请号：US17235363

申请日：2021-04-20

Applicant: Robert Bosch GmbH

Inventor： Matthias Kuehnel ,  Nils Felix Kuhlmann ,  Robert Maul ,  Rolf Scheben ,  Steffen Markisch ,  Thorsten Balslink ,  Wolfram Geiger

IPC: G01C19/5712 ,  G01P3/44 ,  B81B3/00 ,  G01C25/00

Abstract: A micromechanical component for a yaw rate sensor. The component includes a substrate having a substrate surface, a first rotor mass developed in one piece, which is able to be set into a first torsional vibration about a first axis of rotation aligned perpendicular to the substrate surface, and at least one first component of the micromechanical component. The first rotor mass is connected to the at least one first component via at least one first spring element. The at least one first spring element extends through a lateral concavity on the first rotor mass in each case and is connected to a recessed edge region of the first rotor mass. A yaw rate sensor and a production method for a micromechanical component for a yaw rate sensor, are also described.

公开(公告)号：US20210323809A1

公开(公告)日：2021-10-21

申请号：US17224613

申请日：2021-04-07

Applicant: Robert Bosch GmbH

Inventor： Cristian Nagel ,  Johannes Classen ,  Rolf Scheben ,  Rudy Eid

IPC: B81B3/00

Abstract: A micromechanical device including a substrate, a movable mass, and a stop spring structure, which includes a stop. The substrate includes a substrate surface in parallel to a main extension plane and the movable mass is situated movably above the substrate surface in relation to the substrate. The stop spring structure is connected to the movable mass. The stop is designed to strike against the substrate surface in the event of a deflection of the movable mass in a z direction, perpendicular to the main extension plane. The stop spring structure, at the location of the stop, includes a first spring constant, a second spring constant, in parallel to the main extension plane, and a third spring constant, in parallel to the main extension plane and perpendicular to the x direction. The first spring constant is greater than the second spring constant and/or is greater than the third spring constant.