MICROMECHANICAL STRUCTURE AND MICROMECHANICAL SENSOR

    公开(公告)号:US20220091154A1

    公开(公告)日:2022-03-24

    申请号:US17447876

    申请日:2021-09-16

    Abstract: A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

    MICROMECHANICAL Z-ACCELERATION SENSOR
    3.
    发明公开

    公开(公告)号:US20240199409A1

    公开(公告)日:2024-06-20

    申请号:US18538538

    申请日:2023-12-13

    Inventor: Cristian Nagel

    Abstract: A micromechanical z-acceleration sensor. The sensor has a substrate with a main extension plane, and a micromechanical rocker which is arranged parallel to the extension plane above the substrate and can be tilted in a first direction z perpendicular to the extension plane, wherein the rocker in a first partial region: has first perforations, which extend through the rocker in the first direction z, with a first cross-section parallel to the main extension plane with a first aspect ratio of at least 1:1; and has second perforations, which extend through the rocker in the first direction z, with a second cross-section with a second aspect ratio of a longer side to a shorter side, wherein the first aspect ratio is smaller than the second aspect ratio. A first perforation and a second perforation are arranged alternately next to one another in a repeating pattern.

    SENSOR ASSEMBLY
    5.
    发明公开
    SENSOR ASSEMBLY 审中-公开

    公开(公告)号:US20240077512A1

    公开(公告)日:2024-03-07

    申请号:US18364050

    申请日:2023-08-02

    Inventor: Cristian Nagel

    CPC classification number: G01P15/0802 G01P15/125

    Abstract: A sensor assembly. The sensor assembly has a substrate, a seismic mass, and a functional layer arranged between the substrate and the seismic mass. The seismic mass is connected to the substrate in such a way that the seismic mass can be deflected at least along a first direction running perpendicular to the substrate. Within the functional layer and between the seismic mass and the substrate, at least one stop is formed that is spring-loaded and can be deflected along the first direction.

    MEMS SENSOR AND METHOD FOR MANUFACTURING A MEMS SENSOR

    公开(公告)号:US20210396616A1

    公开(公告)日:2021-12-23

    申请号:US17284633

    申请日:2020-01-24

    Inventor: Cristian Nagel

    Abstract: A MEMS sensor, including a substrate, and at least three functional layers, which are connected to the substrate on top of one another and spaced apart from one another. A first of the at least three functional layers is deflectably situated. A first electrode, which includes at least two areas being situated at the first functional layer. A first area of the first electrode together with a second electrode of a second of the at least three functional layers form a first capacitance, and a second area of the first electrode together with at least one area of a third electrode of a third functional layer form a second capacitance. The electrodes are situated in such a way that, upon a change in the distance of the electrodes of the first capacitance, a contrary change in the distance of the electrodes of the second capacitance takes place.

    Micromechanical device including a stop spring structure

    公开(公告)号:US11697583B2

    公开(公告)日:2023-07-11

    申请号:US17224613

    申请日:2021-04-07

    CPC classification number: B81B3/0027

    Abstract: A micromechanical device including a substrate, a movable mass, and a stop spring structure, which includes a stop. The substrate includes a substrate surface in parallel to a main extension plane and the movable mass is situated movably above the substrate surface in relation to the substrate. The stop spring structure is connected to the movable mass. The stop is designed to strike against the substrate surface in the event of a deflection of the movable mass in a z direction, perpendicular to the main extension plane. The stop spring structure, at the location of the stop, includes a first spring constant, a second spring constant, in parallel to the main extension plane, and a third spring constant, in parallel to the main extension plane and perpendicular to the x direction. The first spring constant is greater than the second spring constant and/or is greater than the third spring constant.

    MICROMECHANICAL STRUCTURE AND MICROMECHANICAL SENSOR

    公开(公告)号:US20220073341A1

    公开(公告)日:2022-03-10

    申请号:US17447002

    申请日:2021-09-07

    Abstract: A micromechanical structure, including a substrate, a seismic mass movable with respect to the substrate, and first and second detection means. A first direction and a second direction perpendicular to the first direction define a main extension plane of the substrate. The first and second detection means respectively detect a translatory deflection, and a rotatory deflection. The seismic mass is connected to the substrate via an anchoring element and four torsion spring sections. The first detection means include an electrode structure, including first electrodes attached at the seismic mass and second electrodes attached at the substrate. The first and second electrodes have a two-dimensional extension in the second direction and in a third direction perpendicular to the main extension plane. The anchoring element includes first and second sections with a gap between them. A connecting element connects two first electrodes and is guided through the gap.

    MICROMECHANICAL DEVICE INCLUDING A STOP SPRING STRUCTURE

    公开(公告)号:US20210323809A1

    公开(公告)日:2021-10-21

    申请号:US17224613

    申请日:2021-04-07

    Abstract: A micromechanical device including a substrate, a movable mass, and a stop spring structure, which includes a stop. The substrate includes a substrate surface in parallel to a main extension plane and the movable mass is situated movably above the substrate surface in relation to the substrate. The stop spring structure is connected to the movable mass. The stop is designed to strike against the substrate surface in the event of a deflection of the movable mass in a z direction, perpendicular to the main extension plane. The stop spring structure, at the location of the stop, includes a first spring constant, a second spring constant, in parallel to the main extension plane, and a third spring constant, in parallel to the main extension plane and perpendicular to the x direction. The first spring constant is greater than the second spring constant and/or is greater than the third spring constant.

    MICROMECHANICAL INERTIAL SENSOR, AND METHOD FOR OPERATING A MICROMECHANICAL INERTIAL SENSOR

    公开(公告)号:US20250033952A1

    公开(公告)日:2025-01-30

    申请号:US18769480

    申请日:2024-07-11

    Abstract: A micromechanical inertial sensor and a method for its operation. The micromechanical inertial sensor includes: a sensor element; a substrate having a substrate plane; a detection device for detecting a mechanical deflection due to tilting or deformation of the sensor element about a rotation axis substantially parallel to the substrate plane, wherein the mechanical deflection due to the tilting or deformation takes place along a detection direction substantially perpendicular to the substrate plane, wherein the detection device includes a first electrode structure and a second electrode structure that are firmly anchored to the substrate, wherein the detection device generates a measurement signal from the detected mechanical tilting or deformation of the sensor element about the rotation axis.

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