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公开(公告)号:US20170150606A1
公开(公告)日:2017-05-25
申请号:US15229354
申请日:2016-08-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Chan YOON , Dong Hwan LEE , Young Ghyu AHN
CPC classification number: H05K1/181 , H01F17/0013 , H01F17/0033 , H01F27/085 , H01F27/292 , H05K3/3442 , H05K2201/1003 , H05K2201/10636 , Y02P70/611
Abstract: A coil component includes: an internal coil; a magnetic body having the internal coil embedded therein, and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and external electrodes connected to the internal coil and disposed on outer surfaces of the magnetic body. 0
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公开(公告)号:US20150270053A1
公开(公告)日:2015-09-24
申请号:US14485402
申请日:2014-09-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Hye Yeon CHA , Dong Hwan LEE , Jung Hyuk JUNG , Chan YOON , Hye Min BANG , Tae Young KIM
CPC classification number: C25D7/001 , C25D5/02 , C25D5/10 , C25D5/16 , H01F17/0013 , H01F17/04 , H01F27/292 , H01F41/046
Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
Abstract translation: 提供了一种芯片电子部件及其制造方法,更具体地,涉及一种具有能够防止线圈部分之间发生短路并具有高纵横比(AR)的内部线圈结构的芯片电子部件,通过增加 与线圈的宽度相比,线圈的厚度及其制造方法。
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公开(公告)号:US20150048915A1
公开(公告)日:2015-02-19
申请号:US14459172
申请日:2014-08-13
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Chan YOON , Dong Hwan LEE , Tae Young KIM
CPC classification number: H01F27/292 , H01F17/0013 , H01F2017/0066
Abstract: A chip electronic component may include: a magnetic body including an insulating substrate; internal conductive pattern parts disposed on at least one surface of the insulating substrate; external electrodes disposed on the magnetic body and connected to the internal conductive pattern parts; and an additional magnetic layer disposed on a bottom surface of the magnetic body and covering portions of the external electrodes disposed on the bottom surface of the magnetic body.
Abstract translation: 芯片电子部件可以包括:包括绝缘基板的磁体; 设置在所述绝缘基板的至少一个表面上的内部导电图形部分; 设置在磁体上并连接到内部导电图案部分的外部电极; 以及设置在磁体的底面上并覆盖设置在磁性体的底面上的外部电极的部分的附加磁性层。
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公开(公告)号:US20220076881A1
公开(公告)日:2022-03-10
申请号:US17117219
申请日:2020-12-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Dong Hwan LEE , Sang Soo PARK , Chan YOON , Dong Jin LEE , Hwi Dae KIM , Hye Mi YOO
Abstract: A coil component includes a body; first and second coil portions spaced apart from each other in the body; first and second external electrodes disposed on the body to be spaced apart from each other and connected to both ends of the first coil portion; and first and second ground electrodes spaced apart from each other on the body and connected to both ends of the second coil portion.
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公开(公告)号:US20220037082A1
公开(公告)日:2022-02-03
申请号:US17117306
申请日:2020-12-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Dong Hwan LEE , Sang Soo PARK , Dong Jin LEE , Chan YOON , Hwi Dae KIM , Hye Mi YOO
Abstract: A coil component includes a body having a core, a coil portion disposed in the body and having a central portion in which the core is disposed, a first external electrode and a second external electrode, each connected to the coil portion, a third external electrode spaced apart from each of the first and second external electrodes, and a noise removal portion disposed to at least partially surround the coil portion between a surface of the body and the core and having both end portions, each connected to the third external electrode.
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公开(公告)号:US20210366649A1
公开(公告)日:2021-11-25
申请号:US16984586
申请日:2020-08-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Dong Jin LEE , Dong Hwan LEE , Chan YOON , Sang Soo PARK , Hye Mi YOO , Hwi Dae KIM
Abstract: A coil component includes a body; a wound coil disposed in the body, and having a plurality of turns and first and second lead-out portions exposed to the surfaces of the body; a noise removing portion spaced apart from the wound coil, and including a pattern portion having a first end portion and a second end portion spaced apart from each other and forming an open loop, and a third lead-out portion connected to the pattern portion and exposed to one surface of the body; an insulating layer disposed between the wound coil and the noise removing portion; and first to third external electrodes disposed on the surfaces of the body, spaced apart from one another, and connected to the first to third lead-out portions, respectively, wherein one of the plurality of turns of the wound coil has a line width greater than a thickness thereof.
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公开(公告)号:US20190013141A1
公开(公告)日:2019-01-10
申请号:US15818440
申请日:2017-11-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Chan YOON , Won Chul SIM , Dong Hwan LEE , Young Ghyu AHN
CPC classification number: H01F27/2804 , H01F17/0006 , H01F27/255 , H01F27/292 , H01F2017/002 , H01F2017/0073 , H01F2017/048 , H01F2027/2809
Abstract: A thin film-type inductor includes a body having a coil, and a first external electrode and a second external electrode. The first and second external electrodes are each disposed on an external surface of the body. The coil includes a coil body and a via portion. The via portion is directly connected to the first external electrode. The coil body includes a base conductor layer in a lower portion and a plating layer in an upper portion.
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公开(公告)号:US20180033538A1
公开(公告)日:2018-02-01
申请号:US15457202
申请日:2017-03-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Chan YOON , Dong Hwan LEE , Young Ghyu AHN
CPC classification number: H01F27/2804 , H01F17/0013 , H01F17/04 , H01F27/29 , H01F27/292 , H01F27/323 , H01F2017/048 , H01F2027/2809 , H05K1/181 , H05K2201/1003 , H05K2201/10636 , Y02P70/611
Abstract: An inductor includes a body including a coil part therein. The coil part includes a support member and first and second coil patterns respectively formed on an upper surface and a lower surface of the support member, and 1.15≦b/a≦1.45, where a is a length from a central plane between the upper surface and the lower surface of the support member to an upper surface of the body, and b is a length from the central plane of the support member to a lower surface of the body.
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公开(公告)号:US20170150608A1
公开(公告)日:2017-05-25
申请号:US15258382
申请日:2016-09-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Chan YOON , Dong Hwan LEE , Young Ghyu AHN
CPC classification number: H05K1/181 , H01F17/0013 , H01F17/0033 , H01F27/24 , H01F27/2804 , H01F27/292 , H01F41/0206 , H01F41/041 , H01F41/046 , H01F2027/2809 , H05K1/111 , H05K3/46 , H05K2201/1003 , Y02P70/611
Abstract: A coil component includes a main substrate; a first coil pattern disposed on a first surface of the main substrate; a first insulating layer disposed on one surface of the first coil pattern; a third coil pattern disposed on one surface of the first insulating layer and electrically connected to the first coil pattern; a second coil pattern disposed on a second surface of the main substrate opposing the first surface; a second insulating layer disposed on one surface of the second coil pattern; a fourth coil pattern disposed on one surface of the second insulating layer and electrically connected to the second coil pattern; and a magnetic body in which the first to fourth coil patterns are embedded, and a board having the same.
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公开(公告)号:US20170148561A1
公开(公告)日:2017-05-25
申请号:US15229366
申请日:2016-08-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Chan YOON , Dong Hwan LEE , Young Ghyu AHN
IPC: H01F27/28 , H01F27/29 , H05K1/18 , H01F27/255
CPC classification number: H01F27/2804 , H01F27/022 , H01F27/255 , H01F27/292 , H01F2027/2809 , H05K1/181 , H05K3/3431 , H05K2201/1003
Abstract: A coil component includes: a first coil and a second coil; a first magnetic region embedding the first coil therein and a second magnetic region embedding the second coil therein; a magnetic body embedding the first and second magnetic regions therein; first and second external electrodes disposed on external surfaces of the magnetic body and connected to a first end portion and a second end portion of the first coil, respectively; and third and fourth external electrodes disposed on the external surfaces of the magnetic body and connected to a first end portion and a second end portion of the second coil, respectively.
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