Abstract:
A memory may comprise a first bank configured to include first to Nth word lines and first to Mth redundancy word lines to replace M number of word lines among the first to Nth word lines, a second bank configured to include first to Nth word lines and first to Mth redundancy word lines to replace M number of word lines among the first to Nth word lines, and a control circuit configured to activate, in the case where a word line corresponding to an inputted address among the first to Nth word lines in a bank selected between the first bank and the second bank is replaced with a Kth (1≦K≦M) redundancy word line among the first to Mth redundancy word lines during an operation in a first mode, at least one adjacent word line adjacent to the Kth redundancy word line of the selected bank.
Abstract translation:存储器可以包括配置成包括第一至第N字线和第一至第M冗余字线以替代第一至第N字线中的M个字线的第一存储体,被配置为包括第一至第N字线和第一字线 到第M冗余字线以替换第一至第N字线中的M行字线;以及控制电路,配置为在与银行中的第一至第N字线中输入的地址相对应的字线的情况下, 在第一模式的操作期间,在第一至第M冗余字线之间用第K(1 @ K @ M)个冗余字线替换第一存储体和第二存储体之间的选择,在与第K模式相邻的至少一个相邻字线 所选银行的冗余字线。
Abstract:
A semiconductor memory device includes a memory cell array configured to include a plurality of word lines, a clock enable buffer configured to receive a clock enable signal, a plurality of command buffers configured to receive a plurality of commands, a refresh control unit configured to sequentially activate the plurality of word lines in a self-refresh mode, a command decoder configured to decode the clock enable signal and the plurality of commands, and to allow the refresh control unit to enter the self-refresh mode or exit from the self-refresh mode, and a buffer control unit configured to disable the plurality of command buffers when the clock enable signal is deactivated, and to enable the plurality of command buffers when the refresh control unit exits from the self-refresh mode.
Abstract:
An integrated circuit chip includes a plurality of test input pads configured to receive a plurality of test input signals, a plurality of single-ended type buffers configured to receive signals input to the plurality of test input pads in a connectivity test mode, a plurality of differential-type buffers configured to receive signals input to the plurality of test input pads in a normal mode, a signal combination unit configured to combine the plurality of test input signals input through the plurality of single-ended type buffers, and to generate a plurality of test output signals, and a plurality of test output pads configured to output the plurality of test output signals in the connectivity test mode.
Abstract:
A delay circuit includes a delay unit configured to generate a delayed transmission signal by delaying a transmission signal activated when a first signal or a second signal is activated, a signal type storing unit configured to store whether the first signal and the second signal is activated, and a transmitting unit configured to transmits the delayed transmission signal as a first delayed signal or a second delayed signal in response to a value stored in the signal type storing unit.
Abstract:
A memory module includes an emergency power supplier, a plurality of ranks each including one or more volatile memories, a non-volatile memory, and a controller suitable for backing up data of the ranks into the non-volatile memory by using the emergency power supplier during a power failure, wherein the ranks are sequentially backed up, and while one rank is backed up among the ranks, the other ranks are controlled in a self-refresh mode.
Abstract:
A memory includes a first cell array configured to include a plurality of first memory cells connected to a plurality of word lines, a second cell array configured to include a plurality of second memory cells connected to the plurality of word lines, wherein a group of the plurality of second memory cells which are connected to a corresponding word line stores the number of activations for the corresponding word line, and an activation number update unit configured to update a value stored in the corresponding group of the plurality of second memory cells connected to the activated word line of the plurality of word lines.
Abstract:
A semiconductor device may include: a plurality of data pads; a plurality of data buffers each suitable for buffering a signal inputted through a first input node using a voltage inputted through a second input node, and outputting the buffered signal; and a calibration control unit suitable for generating a test signal in a calibration mode, adjusting the level of the test signal, receiving outputs of the plurality of data buffers while adjusting the level of the test signal, and adjusting offsets of the data buffers such that the logical values of the outputs of the data buffers transit when the test signal has a target level.
Abstract:
A semiconductor memory device includes a command buffering unit suitable for receiving and buffering a command signal based on an enable control signal, a fuse array suitable for programming data based on the command signal, and an enable control unit suitable for generating the enable control signal, wherein an activation operation on the command buffering unit by the enable control signal is controlled during a programming operation period of the fuse array.
Abstract:
A semiconductor system includes multiple semiconductor devices operating commonly in response to a command signal, wherein each of the multiple semiconductor devices is independently activated according to each of multiple data strobe signals respectively corresponding to the multiple semiconductor devices; and a controller suitable for providing the command signal and the multiple data strobe signals.
Abstract:
A memory system includes a memory module including a plurality of memories and a memory controller suitable for controlling an operation timing of each of the memories, wherein the memories enter a refresh operation mode simultaneously in response to a refresh operation command of the memory controller and individually perform a refresh operation according to the operation timing.