Microfluidic dispenser device for delivering inhalable substances

    公开(公告)号:US11484669B2

    公开(公告)日:2022-11-01

    申请号:US16408362

    申请日:2019-05-09

    Abstract: A microfluidic dispenser device of inhalable substances includes a casing, housed in which are a driving circuit and a microfluidic cartridge having a tank that contains a liquid to be delivered. The microfluidic cartridge is provided with at least one nebulizer controlled by the driving device. The nebulizer includes: a substrate; a plurality of chambers formed on the substrate and fluidically coupled to the tank for receiving the liquid to be delivered; and a plurality of heaters, which are formed on the substrate in positions corresponding to respective chambers, are thermally coupled to the respective chambers and are separated from the respective chambers by an insulating layer, and are controlled by the driving device. Each chamber is fluidically connected with the outside by at least one respective nozzle.

    Read/write device for a hard-disk memory system, and corresponding manufacturing process

    公开(公告)号:US11482248B2

    公开(公告)日:2022-10-25

    申请号:US17088394

    申请日:2020-11-03

    Abstract: Various embodiments of the present disclosure provide a read/write device for a hard-disk memory system. The read/write device includes a fixed structure; a membrane region including a first and a second membrane, which are constrained to the fixed structure, and a central portion, interposed between the first and second membranes; a first and a second piezoelectric actuator, mechanically coupled, respectively, to the first and second membranes; and a read/write head, which is fixed to the central portion of the membrane region. The first and second piezoelectric actuators can be controlled so as to cause corresponding deformations of the first and second membranes, said deformations of the first and second membranes causing corresponding movements of the read/write head with respect to the fixed structure.

    Fluid ejection device with reduced number of components, and method for manufacturing the fluid ejection device

    公开(公告)号:US11260659B2

    公开(公告)日:2022-03-01

    申请号:US16848549

    申请日:2020-04-14

    Abstract: Various embodiments provide an ejection device for a fluid. The ejection device includes a first semiconductor wafer, housing, on a first side thereof, a piezoelectric actuator and an outlet channel for the fluid alongside the piezoelectric actuator; a second semiconductor wafer having, on a first side thereof, a recess and, on a second side thereof opposite to the first side, at least one inlet channel for said fluid fluidically coupled to the recess; and a dry-film coupled to a second side, opposite to the first side, of the first wafer. The first and the second wafers are coupled together so that the piezoelectric actuator and the outlet channel are set directly facing, and completely contained in, the recess that forms a reservoir for the fluid. The dry-film has an ejection nozzle.

    Microfluidic device for spraying small drops of liquids

    公开(公告)号:US11117156B2

    公开(公告)日:2021-09-14

    申请号:US15601623

    申请日:2017-05-22

    Abstract: A microfluidic device provided in a body accommodating a fluid containment chamber. A fluidic access channel and a drop emission channel are formed in the body and are in fluidic connection with the fluid containment chamber to form a fluidic path towards the body outside through a nozzle having an outlet section. An actuator is operatively coupled to the fluid containment chamber and is configured to cause ejection of fluid drops through the drop emission channel in an operating condition of the microfluidic device. The drop emission channel comprises a portion of reduced section having a smaller area than the outlet section of the nozzle.

    Micro-electro-mechanical actuator device of piezoelectric type and apparatus integrating the micro-electro-mechanical actuator device

    公开(公告)号:US11066294B2

    公开(公告)日:2021-07-20

    申请号:US16705522

    申请日:2019-12-06

    Abstract: A micro-electro-mechanical (MEMS) actuator device includes a frame, and a first functional sub-structure positioned within the frame and mechanically coupled thereto by supporting elements. The first functional sub-structure is subdivided into first and second portions. The first portion is subdivided into first and second sub-portions separated from one another by a first through trench, and the second portion is subdivided into first and second sub-portions separated from one another by a second through trench. First and second piezo-electric structures are respectively carried by the first and second sub-portions of the first portion. Third and fourth piezo-electric structures are respectively carried by the first and second sub-portions of the second portion. A third through trench extends between the frame and the first functional sub-structure except for regions in which the supporting elements are present.

    Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process

    公开(公告)号:US10906801B2

    公开(公告)日:2021-02-02

    申请号:US16509367

    申请日:2019-07-11

    Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.

    Semiconductor integrated device with electrical contacts between stacked dies and corresponding manufacturing process

    公开(公告)号:US10392245B2

    公开(公告)日:2019-08-27

    申请号:US15591652

    申请日:2017-05-10

    Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.

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