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    Process for manufacturing microelectromechanical devices, in particular electroacoustic modules
    1.
    发明授权
    Process for manufacturing microelectromechanical devices, in particular electroacoustic modules 有权

    公开(公告)号：US11891298B2

    公开(公告)日：2024-02-06

    申请号：US17839131

    申请日：2022-06-13

    申请人： STMICROELECTRONICS S.r.l.

    发明人： Fabio Quaglia ,  Marco Ferrera ,  Marco Del Sarto

    IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L29/66

    CPC分类号： B81B7/007 ,  B81B7/008 ,  B81C1/0023 ,  B81C2203/035 ,  H01L29/66

    摘要： A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes.

    Read/write device for a hard-disk memory system, and corresponding manufacturing process
    2.
    发明授权
    Read/write device for a hard-disk memory system, and corresponding manufacturing process 有权

    公开(公告)号：US11482248B2

    公开(公告)日：2022-10-25

    申请号：US17088394

    申请日：2020-11-03

    申请人： STMICROELECTRONICS S.r.l.

    发明人： Domenico Giusti ,  Marco Ferrera

    IPC分类号： G11B21/24 ,  G11B5/60 ,  G11B5/48 ,  G11B5/73 ,  H01L41/09 ,  H01L41/25

    摘要： Various embodiments of the present disclosure provide a read/write device for a hard-disk memory system. The read/write device includes a fixed structure; a membrane region including a first and a second membrane, which are constrained to the fixed structure, and a central portion, interposed between the first and second membranes; a first and a second piezoelectric actuator, mechanically coupled, respectively, to the first and second membranes; and a read/write head, which is fixed to the central portion of the membrane region. The first and second piezoelectric actuators can be controlled so as to cause corresponding deformations of the first and second membranes, said deformations of the first and second membranes causing corresponding movements of the read/write head with respect to the fixed structure.

    PROCESS FOR MANUFACTURING A MICROMECHANICAL STRUCTURE HAVING A BURIED AREA PROVIDED WITH A FILTER
    5.
    发明申请
    PROCESS FOR MANUFACTURING A MICROMECHANICAL STRUCTURE HAVING A BURIED AREA PROVIDED WITH A FILTER 审中-公开
    制造具有过滤器的烧结区域的微观结构的方法

    公开(公告)号：US20150175410A1

    公开(公告)日：2015-06-25

    申请号：US14133290

    申请日：2013-12-18

    申请人： STMicroelectronics S.r.l.

    发明人： Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

    IPC分类号： B81C1/00

    CPC分类号： B81C1/00119 ,  B01D67/0062 ,  B01D71/02 ,  B01D2325/021 ,  B01D2325/028 ,  B01L3/502707 ,  B01L3/502753 ,  B01L2300/0681 ,  B81B2201/10 ,  B81C1/00071 ,  B81C1/00087 ,  B81C2201/0133 ,  B81C2201/0157 ,  F04B19/006

    摘要： A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.

    摘要翻译： 微机械结构的制造方法设想：在半导体材料体内形成通过第一表面层从主体顶表面分离的掩埋腔; 以及形成用于在所述掩埋腔和外部环境之间流体连通的进入管。 该方法设想：在第一进入区域的顶表面上形成蚀刻掩模; 在顶表面和蚀刻掩模上形成第二表面层; 进行蚀刻，以在对应于第一进入区域的位置中移除第二表面层的一部分，以及未被蚀刻掩模覆盖的第一表面层的下面部分，直到达到掩埋空腔，因此 形成第一进入管道和过滤元件，设置在第一进入管道和相同的掩埋空腔之间。