Method and apparatus for measuring shape of bumps
    33.
    发明申请
    Method and apparatus for measuring shape of bumps 失效
    用于测量凸块形状的方法和装置

    公开(公告)号:US20050129304A1

    公开(公告)日:2005-06-16

    申请号:US10964690

    申请日:2004-10-15

    摘要: The present invention provides a bump shape measuring apparatus comprising an illumination optical system which illuminates bumps arranged on a board with illumination light of a low tilt angle to a surface of the board; a detection optical system where reflected light from the bumps is condensed for detection of image signals of the bumps by a high tilt angle to the surface of the board; an image processing unit where an outline of the tip and the base of each of the bumps is calculated based on the image signals of each of the bumps, and geometric characteristics including at least a position and height of each of the bumps are calculated based on the outline of the tip and the base of each of the bumps; and a main control unit where information on the calculated geometric characteristics of the bumps is displayed on a display unit.

    摘要翻译: 本发明提供一种凸起形状测量装置,包括照明光学系统,其照射布置在基板上的凸起与板的表面具有低倾斜角的照明光; 检测光学系统,其中来自所述凸块的反射光被聚集以便用于检测所述凸块的图像信号与所述板的表面成高度倾斜角; 基于每个凸块的图像信号计算每个凸块的尖端和基部的轮廓的图像处理单元,并且基于每个凸块的至少一个位置和高度的几何特性基于 每个凸起的尖端和基部的轮廓; 以及主控制单元,其中在显示单元上显示关于所计算的凸块的几何特性的信息。

    Method of polishing a film
    34.
    发明授权
    Method of polishing a film 失效
    抛光膜的方法

    公开(公告)号:US06794206B2

    公开(公告)日:2004-09-21

    申请号:US10232707

    申请日:2002-09-03

    IPC分类号: H01L2166

    摘要: A method of polishing a film formed on a wafer includes steps of polishing a film formed on a surface of a wafer which is chucked by a wafer chuck and set on a polishing disk so that the film faces the polishing disk, irradiating a plurality of portions of the film under polishing process with lights having different wavelengths from one another through a plurality of holes formed in the polishing disk, detecting lights reflected from the plurality of portions of the film caused by the irradiation, evaluating a thickness distribution of the film from information of an intensity ratio of the detected reflected lights, and controlling a pushing pressure of the wafer chuck according to the evaluated thickness distribution under polishing process.

    摘要翻译: 抛光形成在晶片上的膜的方法包括以下步骤:在由晶片卡盘夹持的晶片表面上形成的膜进行抛光,并将其设置在研磨盘上,使得该膜面向抛光盘,照射多个部分 通过形成在研磨盘中的多个孔彼此不同波长的光进行研磨处理,检测从照射引起的膜的多个部分反射的光,从信息中评价胶片的厚度分布 检测反射光的强度比,根据研磨过程中的评价厚度分布来控制晶片卡盘的推压。

    Pattern test apparatus including a plurality of pattern generators
    35.
    发明授权
    Pattern test apparatus including a plurality of pattern generators 失效
    图案测试装置,包括多个图案发生器

    公开(公告)号:US4744047A

    公开(公告)日:1988-05-10

    申请号:US793219

    申请日:1985-10-31

    CPC分类号: G01R31/281

    摘要: An apparatus for testing printed wiring patterns for use in combination with an apparatus including a plurality of dedicated pattern generators for generating arcuate wiring patterns. In contrast to the conventional LSI pattern inspection effected with design data being inputted, the apparatus can inspect the pattern including curved portions peculiar to the printed wiring pattern. Although the conventional LSI inspection technique involves an impracticably increased amount of design data, the invention allows the test or inspection to be performed at a high speed with an improved reliability and can be applied to the inspection of any pattern including arcuate patterns. By inputting graphic data in conformance with the order for generating patterns, pattern generation can be accomplished not only through ordinary raster scan but also by other various scanning methods.

    摘要翻译: 一种用于测试印刷布线图案的装置,用于与包括用于产生弓形布线图案的多个专用图案发生器的装置组合使用。 与通过输入设计数据进行的常规LSI图案检查相反,该设备可以检查包括印刷布线图案特有的弯曲部分的图案。 虽然传统的LSI检测技术涉及到不切实际地增加的设计数据量,但是本发明允许以高速度提高测试或检查的可靠性,并且可以应用于包括弧形图案的任何图案的检查。 通过根据生成图案的顺序输入图形数据,不仅可以通过普通光栅扫描也可以通过其他各种扫描方法来实现图案生成。

    METHOD AND APPARATUS FOR MEASURING DISPLACEMENT OF A SAMPLE TO BE INSPECTED USING AN INTERFERENCE LIGHT
    37.
    发明申请
    METHOD AND APPARATUS FOR MEASURING DISPLACEMENT OF A SAMPLE TO BE INSPECTED USING AN INTERFERENCE LIGHT 有权
    用于测量使用干扰光检测样品的位移的方法和装置

    公开(公告)号:US20120062903A1

    公开(公告)日:2012-03-15

    申请号:US13302948

    申请日:2011-11-22

    IPC分类号: G01B9/02

    摘要: In a displacement measurement apparatus using light interference, a probe light path is spatially separated from a reference light path. Therefore, when a temperature or refractive index distribution by a fluctuation of air or the like, or a mechanical vibration is generated, an optical path difference fluctuates between both of the optical paths, and a measurement error is generated. In the solution, an optical axis of probe light is brought close to that of reference light by a distance which is not influenced by any disturbance, a sample is irradiated with the probe light, a reference surface is irradiated with the reference light, reflected light beams are allowed to interfere with each other, and a displacement of the sample is obtained from the resultant interference light to thereby prevent the measurement error from being generated by the fluctuation of the optical path difference.

    摘要翻译: 在使用光干涉的位移测量装置中,探针光路在空间上与参考光路分离。 因此,当通过空气等的波动或机械振动产生温度或折射率分布时,光路差在两个光路之间波动,并且产生测量误差。 在该解决方案中,将探测光的光轴靠近参考光的光轴不受任何干扰影响的距离,用探测光照射样品,用参考光照射参考表面,反射光 允许光束彼此干涉,并且从所得到的干涉光中获得样品的位移,从而防止由于光程差的波动而产生测量误差。

    METHOD AND APPARATUS FOR MEASURING DISPLACEMENT OF A SAMPLE
    38.
    发明申请
    METHOD AND APPARATUS FOR MEASURING DISPLACEMENT OF A SAMPLE 有权
    测量样品位移的方法和装置

    公开(公告)号:US20100039652A1

    公开(公告)日:2010-02-18

    申请号:US12605089

    申请日:2009-10-23

    IPC分类号: G01B9/02

    摘要: In a displacement measurement apparatus using light interference, a probe light path is spatially separated from a reference light path. Therefore, when a temperature or refractive index distribution by a fluctuation of air or the like, or a mechanical vibration is generated, an optical path difference fluctuates between both of the optical paths, and a measurement error is generated. In the solution, an optical axis of probe light is brought close to that of reference light by a distance which is not influenced by any disturbance, a sample is irradiated with the probe light, a reference surface is irradiated with the reference light, reflected light beams are allowed to interfere with each other, and a displacement of the sample is obtained from the resultant interference light to thereby prevent the measurement error from being generated by the fluctuation of the optical path difference.

    摘要翻译: 在使用光干涉的位移测量装置中,探针光路在空间上与参考光路分离。 因此,当通过空气等的波动或机械振动产生温度或折射率分布时,光路差在两个光路之间波动,并且产生测量误差。 在该解决方案中,将探测光的光轴靠近参考光的光轴不受任何干扰影响的距离,用探测光照射样品,用参考光照射参考表面,反射光 允许光束彼此干涉,并且从所得到的干涉光中获得样品的位移,从而防止由于光程差的波动而产生测量误差。

    Method and apparatus for measuring shape of bumps
    40.
    发明授权
    Method and apparatus for measuring shape of bumps 失效
    用于测量凸块形状的方法和装置

    公开(公告)号:US07336816B2

    公开(公告)日:2008-02-26

    申请号:US10964690

    申请日:2004-10-15

    IPC分类号: G06K9/00

    摘要: The present invention provides a bump shape measuring apparatus comprising an illumination optical system which illuminates bumps arranged on a board with illumination light of a low tilt angle to a surface of the board; a detection optical system where reflected light from the bumps is condensed for detection of image signals of the bumps by a high tilt angle to the surface of the board; an image processing unit where an outline of the tip and the base of each of the bumps is calculated based on the image signals of each of the bumps, and geometric characteristics including at least a position and height of each of the bumps are calculated based on the outline of the tip and the base of each of the bumps; and a main control unit where information on the calculated geometric characteristics of the bumps is displayed on a display unit.

    摘要翻译: 本发明提供一种凸起形状测量装置,包括照明光学系统,其照射布置在基板上的凸起与板的表面具有低倾斜角的照明光; 检测光学系统,其中来自所述凸块的反射光被聚集以便用于检测所述凸块的图像信号与所述板的表面成高度倾斜角; 基于每个凸块的图像信号计算每个凸块的尖端和基部的轮廓的图像处理单元,并且基于每个凸块的至少一个位置和高度的几何特性基于 每个凸起的尖端和基部的轮廓; 以及主控制单元,其中在显示单元上显示关于所计算的凸块的几何特性的信息。