公开(公告)号：US08968488B2

公开(公告)日：2015-03-03

申请号：US12307370

申请日：2007-07-03

申请人： Mitsuo Yamashita ,  Tomoaki Goto ,  Takeshi Asagi

发明人： Mitsuo Yamashita ,  Tomoaki Goto ,  Takeshi Asagi

IPC分类号： B23K35/34

CPC分类号： H05K3/341 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K2101/36 ,  B23K2101/42 ,  C22C1/0483 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01L2924/0132 ,  H01L2924/0133 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/04 ,  H05K2203/12 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01029

摘要： A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.

摘要翻译： 通过将Sn-Ag-Cu合金与助熔剂捏合而获得的膏状焊料，其中，Sn-Ag-Cu合金包括第一粉末合金和第二粉末合金的混合物，第一粉末合金由Sn- Ag相图具有固液共存区域，并且具有比共晶组合物（3.5重量％银）大的给定银量，第二粉末合金的银量为共晶组合物中的银量（ 3.5重量％的银），或者接近于共晶组合物中的银，并且小于第一粉末合金中的银。 这种膏状焊料具有优异的强度和热稳定性，并且具有令人满意的粘合性能。 它基于廉价的Sn-Ag-Cu焊料合金。 适用于符合温度梯度键合的高温侧无铅焊料。 还提供了一种焊接方法。

公开(公告)号：US08933325B2

公开(公告)日：2015-01-13

申请号：US13574568

申请日：2011-01-21

申请人： Kenichiro Sumida ,  Akihito Ito ,  Mitsuo Yamashita ,  Hiroaki Hirata

发明人： Kenichiro Sumida ,  Akihito Ito ,  Mitsuo Yamashita ,  Hiroaki Hirata

IPC分类号： H01L31/042 ,  H02N6/00 ,  F16B11/00

CPC分类号： H01L31/042 ,  F16B11/006 ,  H02S20/00 ,  H02S30/10 ,  Y02E10/50

摘要： A solar cell module is disclosed. The solar cell module includes a solar cell panel, first and second holding members, a reinforcing member. The panel includes a light-receiving surface, a non-light receiving surface, a first side part and a second side part. The first and second holding members hold the first and second side parts respectively. The reinforcing member is laid across the first and second holding member on a non-light receiving surface side. The adhesive is disposed between the non-light receiving surface and the reinforcing member. The reinforcing member includes a supporting part that is disposed with a gap with the non-light receiving surface and that supports the non-light receiving surface via the adhesive. The supporting part includes a first main surface, a second main surface and a through hole. At least one part of the adhesive is located within the through hole.

摘要翻译： 公开了一种太阳能电池组件。 太阳能电池模块包括太阳能电池板，第一和第二保持构件，加强构件。 面板包括光接收表面，非光接收表面，第一侧部和第二侧部。 第一和第二保持构件分别保持第一和第二侧面部分。 加强构件在非受光面侧横跨第一和第二保持构件。 粘合剂设置在非光接收表面和加强构件之间。 加强构件包括与非光接收表面间隔设置并且经由粘合剂支撑非光接收表面的支撑部。 支撑部分包括第一主表面，第二主表面和通孔。 粘合剂的至少一部分位于通孔内。

公开(公告)号：US08829333B2

公开(公告)日：2014-09-09

申请号：US13580665

申请日：2011-02-24

申请人： Mitsuo Yamashita ,  Takeshi Kyouda

发明人： Mitsuo Yamashita ,  Takeshi Kyouda

IPC分类号： H01L31/05 ,  H01L31/048

CPC分类号： H01L31/048 ,  H01L31/0504 ,  H01L31/0508 ,  H01L31/0516 ,  Y02E10/50 ,  Y02E10/52

摘要： A highly reliable solar cell module and method for manufacturing same are disclosed. The solar cell module is provided with first and second solar cell elements, each of which has a semiconductor substrate and an output taking out electrode; a circuit film which electrically connects together the first solar cell element and the second solar cell element; and a sealing material disposed between the circuit film and the second surface of the first and the second solar cell elements. The sealing material has a through hole, and the circuit film has: a base sheet having a protruding section which protrudes toward the second surface of the solar cell element; and a wiring conductor which electrically connects the output taking out electrode of the first solar cell element and the output taking out electrode of the second solar cell element.

摘要翻译： 公开了一种高度可靠的太阳能电池组件及其制造方法。 太阳能电池模块设置有第一和第二太阳能电池元件，每个元件具有半导体衬底和输出取出电极; 将第一太阳能电池元件和第二太阳能电池元件电连接在一起的电路膜; 以及设置在电路膜和第一和第二太阳能电池元件的第二表面之间的密封材料。 密封材料具有通孔，电路膜具有：具有向太阳能电池元件的第二表面突出的突出部的基片; 以及电连接第一太阳能电池元件的输出取出电极和第二太阳能电池元件的输出取出电极的布线导体。

公开(公告)号：US20130312814A1

公开(公告)日：2013-11-28

申请号：US13983032

申请日：2012-01-30

申请人： Mitsuo Yamashita ,  Kazuhide Toda ,  Ken-ichiro Sumida

发明人： Mitsuo Yamashita ,  Kazuhide Toda ,  Ken-ichiro Sumida

IPC分类号： H01L31/042

CPC分类号： H02S30/10 ,  F24S25/30 ,  F24S2025/016 ,  F24S2025/601 ,  F24S2025/806 ,  F24S2080/09 ,  Y02E10/47

摘要： A solar cell module comprises: a solar cell panel including a light-receiving surface and a non-light-receiving surface, and also including first and second side parts which are disposed between the light-receiving surface and the non-light-receiving surface and are not on the same surface; a first retaining member retaining the first side part; a second retaining member retaining the second side part; and a reinforcing member disposed between the first retaining member and the second retaining member on the non-light-receiving surface side, the reinforcing member being in an elongated shape. The reinforcing member comprises a support part supporting the non-light-receiving surface. The support part includes a horizontal part parallel to the non-light-receiving surface and also includes an inclined part disposed at an end of the horizontal part, the inclined part being inclined so as to be apart from the non-light-receiving surface as the inclined part is apart from the horizontal part.

摘要翻译： 太阳能电池模块包括：太阳能电池板，其包括受光面和非受光面，并且还包括配置在受光面与非受光面之间的第一和第二侧面 并不在同一个表面上; 保持第一侧部的第一保持构件; 保持第二侧部的第二保持构件; 以及加强构件，其在所述非受光面侧设置在所述第一保持构件和所述第二保持构件之间，所述加强构件为细长形状。 加强构件包括支撑非光接收表面的支撑部分。 支撑部分包括平行于非光接收表面的水平部分，并且还包括设置在水平部分的端部的倾斜部分，倾斜部分倾斜以远离非光接收表面，如 倾斜部分与水平部分分开。

公开(公告)号：US07891306B2

公开(公告)日：2011-02-22

申请号：US11845818

申请日：2007-08-28

申请人： Mitsuo Yamashita

发明人： Mitsuo Yamashita

IPC分类号： A47B57/00

CPC分类号： A47C13/00 ,  A47C9/08

摘要： A stool includes a seat board, a plurality of legs, and a connecting board. The plurality of legs is attached to the seat board so as to protrude from the seat board in a downward direction, and to support the seat board such that the seat board is horizontally held. The connecting board is disposed such that one surface thereof faces a bottom surface of the seat board. The connecting board is surrounded by and secured to the plurality of legs.

摘要翻译： 凳子包括座椅板，多个腿部和连接板。 多个腿部沿着向下的方向安装在座椅板上，从座椅板向下方突出，并支撑座椅板，使得座椅板水平地保持。 连接板设置成使得其一个表面面向座椅板的底表面。 连接板被多个腿包围并固定。

公开(公告)号：US20090286093A1

公开(公告)日：2009-11-19

申请号：US12497039

申请日：2009-07-02

申请人： Kazuyuki MAKITA ,  Masaki Ichinose ,  Taketo Watashima ,  Masayuki Soutome ,  Mitsuo Yamashita ,  Takeshi Asagi ,  Masatoshi Hirai ,  Toru Murata

发明人： Kazuyuki MAKITA ,  Masaki Ichinose ,  Taketo Watashima ,  Masayuki Soutome ,  Mitsuo Yamashita ,  Takeshi Asagi ,  Masatoshi Hirai ,  Toru Murata

IPC分类号： B23K35/14 ,  B32B15/04 ,  C22C1/00

CPC分类号： B23K35/262 ,  Y10T428/31678

摘要： According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.

摘要翻译： 根据本发明的一个实施例，提供了一种无铅焊料，其包括卷成片状的合金。 合金包括：锡; 从10重量％至小于25重量％的银; 和3重量％至5重量％的铜。 该合金不含铅。

公开(公告)号：US20070169373A1

公开(公告)日：2007-07-26

申请号：US11624404

申请日：2007-01-18

申请人： Shigeki Aoki ,  Yuichi Sakai ,  Mitsuo Yamashita ,  Hiroshi Shinya

发明人： Shigeki Aoki ,  Yuichi Sakai ,  Mitsuo Yamashita ,  Hiroshi Shinya

IPC分类号： F26B3/00 ,  F26B19/00

CPC分类号： F26B3/20 ,  F26B9/103 ,  F26B21/001 ,  G03F7/168 ,  G03F7/40 ,  H01L21/67109 ,  H01L21/67178 ,  H01L21/67248 ,  H01L21/677 ,  H01L21/67748

摘要： A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.

摘要翻译： 热处理装置包括：加热板，其被配置为加热所述基板; 盖构造成围绕加热板上方的空间; 排气流动形成机构，其构造成在所述盖内排出气体，以在所述加热板上方的空间内形成废气流; 下降形成机构，其被配置为形成均匀地供给到放置在所述加热板上的所述基板的上表面上的下流; 以及控制机构，其被配置为在通过下流形成机构形成下流的同时，在布置成加热所述基板的模式之间执行模式切换控制，以及布置成在形成所述废气的同时由所述排气流动形成机构流动的模式。

公开(公告)号：US07034879B2

公开(公告)日：2006-04-25

申请号：US09947371

申请日：2001-09-07

申请人： Mitsuo Yamashita

发明人： Mitsuo Yamashita

IPC分类号： H04N5/22

CPC分类号： H04N1/2112 ,  H04N1/00442 ,  H04N1/00448 ,  H04N1/00461 ,  H04N1/2125 ,  H04N1/2141 ,  H04N2201/0084

摘要： The imaging device displays an image under imaging at present and also past images picked up before it on the display means, thus at the time of continuous imaging, even when the next imaging is started immediately after end of imaging, an image after the framing process is displayed, for example, as an image picked up just prior, so that the imaging condition, for example, whether closing of eyes is caused in the image picked up already can be checked. Therefore, the next imaging can be started without waiting for the time required for the framing process after imaging, so that the imaging can be speeded up.

摘要翻译： 成像装置目前显示图像成像，并且还显示在显示装置之前拾取的图像，因此即使在成像结束后立即开始下一次成像，连续成像时，成帧处理之后的图像 例如可以被显示为刚刚拾取的图像，从而可以检查成像条件，例如是否在已拾取的图像中引起了眼睛的闭合。 因此，可以在不等待成像后的成帧处理所需的时间的情况下开始下一次成像，从而能够加快成像。

公开(公告)号：US06365097B1

公开(公告)日：2002-04-02

申请号：US09492219

申请日：2000-01-27

申请人： Mitsuo Yamashita ,  Shinji Tada ,  Kunio Shiokawa

发明人： Mitsuo Yamashita ,  Shinji Tada ,  Kunio Shiokawa

IPC分类号： C22C1302

CPC分类号： B23K35/262

摘要： A novel lead-free Sn—Bi based alloy having an improved wettability in comparison to conventional Sn—Bi based alloys, a melting point lower than 221° C., the eutectic point of an Sn—Ag alloy, and proper bonding and heat-resistant properties is provided. This alloy is an Sn—Bi based alloy containing tin as a major component, and 21 wt.% or less bismuth, 4 wt.% or less silver, 2 wt.% or less copper (inclusive of zero), and 0.2 wt.% or less nickel.

摘要翻译： 与传统的Sn-Bi基合金相比，具有改进的润湿性，熔点低于221℃，Sn-Ag合金的共晶点以及适当的粘合和耐热性的新型无铅Sn-Bi基合金， 提供了耐受性。 该合金是以锡为主成分，21重量％以下的铋，4重量％以下的银，2重量％以下的铜（包括零）和0.2重量％的Sn-Bi系合金。 ％以下的镍。

公开(公告)号：US6156132A

公开(公告)日：2000-12-05

申请号：US244034

申请日：1999-02-04

申请人： Mitsuo Yamashita ,  Shinji Tada ,  Kunio Shiokawa

发明人： Mitsuo Yamashita ,  Shinji Tada ,  Kunio Shiokawa

IPC分类号： B23K35/26 ,  B23K35/22

CPC分类号： B23K35/264 ,  B23K35/262

摘要： Lead-free alloys of the present invention includes bismuth in the amount of 30 to 58% by weight and one of the following first to fourth compositions in addition to tin as a main component. In the first composition, germanium is present in the amount of 0.1 or less % by weight. In the second composition, silver is present in the amount of 5% by weight or less and antimony is present in the amount of 5% by weight or less in addition to 0.1% by weight or less of germanium of silver. In the third composition, nickel and copper are included, preferably 0.2 or less % by weight or less of nickel and 1% by weight of copper. In the fourth composition, at least one selected from the group of 5 or less % by weight of silver, 5 or less % by weight of antimony, and 0.1 or less % by weight of germanium in addition to 0.2 or less % by weight of nickel and 1 or less % by weight of copper. Accordingly, the solder alloys of the present invention can be provided as lead-free and low-fusing solder alloys having good ductility, heat resistance, and wettability, compared with the conventional one.

摘要翻译： 本发明的无铅合金除了以锡为主要成分之外，还包括30至58重量％的铋和随后的第一至第四组合物之一。 在第一组合物中，锗的存在量为0.1重量％或更少。 在第二组合物中，银以5重量％以下的量存在，除了0.1重量％以下的银之外，锑以5重量％以下的量存在。 在第三组合物中，包括镍和铜，优选为0.2重量％或更少的镍和1重量％的铜。 在第四组合物中，除了0.2重量％以下的重量比以外，还可以使用选自银，银，锑的5重量％以下，锗0.1重量％以下的锗中的至少1重量％ 镍和1重量％以下的铜。 因此，与现有技术相比，本发明的焊料合金可以提供具有良好延展性，耐热性和润湿性的无铅低熔点焊料合金。