公开(公告)号：US20160081234A1

公开(公告)日：2016-03-17

申请号：US14607743

申请日：2015-01-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Hsin-Lung Chung ,  Chia-Yang Chen ,  Chao-Ya Yang ,  Yude Chu ,  Chih-Ming Cheng

IPC: H05K9/00

CPC classification number: H01L23/552 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A package structure is provided, including an electronic element with a low frequency, a shielding member connected to the electrosnic element, and an encapsulant covering the electronic element and the shielding member, such that the electronic element is shielded from erroneous signals.

Abstract translation: 提供一种封装结构，包括低频电子元件，连接到电气元件的屏蔽构件，以及覆盖电子元件和屏蔽构件的密封剂，使得电子元件被屏蔽而不会发生错误信号。

公开(公告)号：US20250132273A1

公开(公告)日：2025-04-24

申请号：US19007957

申请日：2025-01-02

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai

IPC: H01L23/66 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552

Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.

公开(公告)号：US20250125237A1

公开(公告)日：2025-04-17

申请号：US18990236

申请日：2024-12-20

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Ko-Wei Chang ,  Wen-Jung Tsai ,  Che-Wei Yu ,  Chia-Yang Chen

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065

Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.

公开(公告)号：US12224255B2

公开(公告)日：2025-02-11

申请号：US18607815

申请日：2024-03-18

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai

IPC: H01L23/49 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00

Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.

公开(公告)号：US20240321784A1

公开(公告)日：2024-09-26

申请号：US18607815

申请日：2024-03-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai

IPC: H01L23/66 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552

CPC classification number: H01L23/66 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/552 ,  H01L23/49833 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/3025

Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.

公开(公告)号：US11984412B2

公开(公告)日：2024-05-14

申请号：US18097965

申请日：2023-01-17

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Ko-Wei Chang

IPC: H01L23/64 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L49/02

CPC classification number: H01L23/645 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/16 ,  H01L28/10 ,  H01L2224/16227 ,  H01L2924/19042 ,  H01L2924/19103

Abstract: An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.

公开(公告)号：US11973043B2

公开(公告)日：2024-04-30

申请号：US18103196

申请日：2023-01-30

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/552 ,  H01L23/49833 ,  H01L24/16 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2924/3025

Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.

公开(公告)号：US20230154872A1

公开(公告)日：2023-05-18

申请号：US18097847

申请日：2023-01-17

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Ko-Wei CHANG

IPC: H01L23/64 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/645 ,  H01L24/16 ,  H01L23/3128 ,  H01L23/49838 ,  H01L21/4853 ,  H01L21/565 ,  H01L28/10 ,  H01L2924/19103 ,  H01L2224/16227 ,  H01L2924/19042

Abstract: An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.

公开(公告)号：US20220059475A1

公开(公告)日：2022-02-24

申请号：US17518146

申请日：2021-11-03

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chih-Hsien Chiu ,  Wen-Jung Tsai

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L21/56

Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.

公开(公告)号：US20210328339A1

公开(公告)日：2021-10-21

申请号：US16890128

申请日：2020-06-02

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Wen-Jung Tsai ,  Chih-Hsien Chiu

IPC: H01Q1/52 ,  H01L25/16 ,  H01L23/31 ,  H01L23/482 ,  H01L21/56

Abstract: Provided is a packaging structure, which includes a carrier and an electronic component, an antenna module and a connector disposed on the carrier, and a packaging layer encapsulating the electronic component and the connector. A portion of a surface of the connector is exposed from the packaging layer so as to facilitate the electrical connection with a motherboard of an electronic product. A method for fabricating the packaging structure is also provided.