中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

62 records (took 0.036 seconds)

    Optical inspector
    31.
    发明授权
    Optical inspector 有权
    光学检查员

    公开(公告)号：US08830456B2

    公开(公告)日：2014-09-09

    申请号：US13757099

    申请日：2013-02-01

    Applicant: Steven W. Meeks ,  Rusmin Kudinar ,  Hung P. Nguyen

    Inventor： Steven W. Meeks ,  Rusmin Kudinar ,  Hung P. Nguyen

    IPC: G01N21/00 ,  G01N21/95 ,  G01N21/94

    CPC classification number: G01N21/9501 ,  G01N21/94 ,  G01N21/9505 ,  G01N21/956 ,  G01N21/958

    Abstract: An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a separating mirror, and a first and second detector. The radiating source is configured to irradiate a first position on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. The telecentric scan lens directs specular reflection and near specular scattered radiation to the time varying beam reflector. The specular reflection is directed by the separating mirror to the first detector. The near specular scattered radiation is not reflected by the separating mirror and propagates to the second detector. In response, the optical inspector determines the total reflectivity, the surface slope, or the near specular scattered radiation intensity of the sample.

    Abstract translation: 光学检查器包括辐射源，时变光束反射器，远心扫描透镜，分离镜以及第一和第二检测器。 辐射源被配置成用源光束照射时变光束反射器上的第一位置。 时变光束反射器将源光束引导到远心扫描透镜，然后将远光扫描透镜引导到源样品。 远心扫描透镜将镜面反射和近镜面散射辐射引导到时变光束反射器。 镜面反射由分离镜引导到第一检测器。 近镜面散射辐射不会被分离镜反射并传播到第二检测器。 作为响应，光学检查器确定样品的总反射率，表面斜率或近镜面散射辐射强度。

    Detecting and classifying surface defects with multiple radiation collectors
    32.
    发明授权
    Detecting and classifying surface defects with multiple radiation collectors 有权
    用多个辐射收集器检测和分类表面缺陷

    公开(公告)号：US08823935B1

    公开(公告)日：2014-09-02

    申请号：US12556596

    申请日：2009-09-10

    Applicant: Steven W. Meeks ,  Xiaoqian Xu ,  Hung P. Nguyen ,  Alireza Shahdoost Moghadam ,  Mahendra Prabhu Ramachandran

    Inventor： Steven W. Meeks ,  Xiaoqian Xu ,  Hung P. Nguyen ,  Alireza Shahdoost Moghadam ,  Mahendra Prabhu Ramachandran

    IPC: G01N21/00

    CPC classification number: G01N21/8806 ,  G01N2021/8845 ,  G01N2021/8848 ,  G01N2021/8854

    Abstract: A system to detect and classify defects on a surface of a substrate. A first targeting assembly directs radiation in a first beam onto the substrate. A first collecting assembly collects first radiation specularly reflected from the substrate and produces first signals, a second collecting assembly collects first radiation scattered from the surface of the substrate by defects and not micro-roughness and produces second signals, and a third collecting assembly collects first radiation scattered from the surface of the substrate by defects and micro-roughness and produces third signals. A second targeting assembly directs radiation in a second beam onto the substrate. A fourth collecting assembly collects second radiation scattered from the substrate and produces fourth signals. A processor receives the first, second, third, and fourth signals. A module coupled to the processor has logic instructions stored in a computer-readable medium, which configure the processor to analyze the signals to detect and classify the defects on the substrate.

    Abstract translation: 用于检测和分类衬底表面上的缺陷的系统。 第一瞄准组件将第一光束中的辐射引导到衬底上。 第一收集组件收集从衬底反射的第一辐射并产生第一信号，第二收集组件通过缺陷而不是微粗糙度收集从衬底的表面散射的第一辐射，并产生第二信号，并且第三收集组件首先收集 通过缺陷和微粗糙度从基板的表面散射的辐射产生第三信号。 第二瞄准组件将第二射束中的辐射引导到衬底上。 第四收集组件收集从衬底散射的第二辐射并产生第四信号。 处理器接收第一，第二，第三和第四信号。 耦合到处理器的模块具有存储在计算机可读介质中的逻辑指令，其配置处理器来分析信号以检测和分类衬底上的缺陷。

    Multi-wavelength system and method for detecting epitaxial layer defects
    33.
    发明授权
    Multi-wavelength system and method for detecting epitaxial layer defects 有权
    用于检测外延层缺陷的多波长系统和方法

    公开(公告)号：US07684032B1

    公开(公告)日：2010-03-23

    申请号：US11031248

    申请日：2005-01-06

    Applicant: Steven W. Meeks

    Inventor： Steven W. Meeks

    IPC: G01N21/00

    CPC classification number: G01N21/9501 ,  H01L22/12

    Abstract: The disclosed system provides a method and apparatus for automated detection of a variety of defects within an epitaxial layer by way of an optical surface analysis device containing at least two wavelengths of incident light. A unique defect detection algorithm is provided for generating defect maps for each wavelength of incident light and merging each defect map into one overall defect map in order to detect all defects within an epitaxial layer. The present system is enabled for detecting defects within an epitaxial layer independent of the thickness of the epitaxial layer. Topography, scatter, and phase measurements can also be made in order to increase the accuracy of defect detection.

    Abstract translation: 所公开的系统提供了一种用于通过包含入射光的至少两个波长的光学表面分析装置自动检测外延层内的各种缺陷的方法和装置。 提供了一种独特的缺陷检测算法，用于产生每个入射光波长的缺陷图，并将每个缺陷图合并成一个整体缺陷图，以便检测外延层内的所有缺陷。 本系统能够独立于外延层的厚度检测外延层内的缺陷。 还可以进行地形，散射和相位测量，以提高缺陷检测的准确性。

    Wafer edge inspection
    34.
    发明授权
    Wafer edge inspection 有权
    晶圆边缘检查

    公开(公告)号：US07656519B2

    公开(公告)日：2010-02-02

    申请号：US11848234

    申请日：2007-08-30

    Applicant: Steven W. Meeks ,  Rusmin Kudinar

    Inventor： Steven W. Meeks ,  Rusmin Kudinar

    IPC: G01N21/00

    CPC classification number: G01N21/9501 ,  G01B11/065 ,  G01N21/9503 ,  G01N21/9506

    Abstract: In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target radiation onto an edge surface of a wafer, the radiation targeting assembly comprising a first expanded paraboloid or expanded ellipsoid reflector positioned adjacent the edge surface of the wafer, a reflected radiation collecting assembly that collects radiation reflected from the surface, a signal processing module to generate surface parameter data from the reflected radiation, and a defect detection module to analyze the surface parameter data to detect a defect on the surface.

    Abstract translation: 在一个实施例中，表面分析器系统包括辐射瞄准组件以将辐射瞄准晶片的边缘表​​面，所述辐射瞄准组件包括邻近所述晶片的边缘表​​面定位的第一扩展的抛物面或扩展的椭球反射器，反射的辐射收集 收集从表面反射的辐射的组件，用于从反射辐射产生表面参数数据的信号处理模块，以及用于分析表面参数数据以检测表面上的缺陷的缺陷检测模块。

    Servo pattern characterization on magnetic disks
    36.
    发明授权
    Servo pattern characterization on magnetic disks 失效
    磁盘上的伺服模式表征

    公开(公告)号：US07397621B2

    公开(公告)日：2008-07-08

    申请号：US11432609

    申请日：2006-05-11

    Applicant: Zhen Hou ,  Ronny Soetarman ,  Vamsi Velidandla ,  Steven W. Meeks

    Inventor： Zhen Hou ,  Ronny Soetarman ,  Vamsi Velidandla ,  Steven W. Meeks

    IPC: G11B5/02

    CPC classification number: G11B5/59627

    Abstract: In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target radiation onto a surface, a reflected radiation collecting assembly that collects radiation reflected from the surface, and a signal processing module. The signal processing module generates an image of magnetic characteristics of the magnetic disk, wherein the image comprises a plurality of servo sector arcs, locates a sample of points on a plurality of the servo sector arcs, fits a circle to the sample of points on each of the plurality of servo sector arcs, and determines at least one pivot-to-gap measurement from the radius of the circles.

    Abstract translation: 在一个实施例中，表面分析器系统包括将辐射瞄准到表面上的辐射瞄准组件，收集从表面反射的辐射的反射辐射收集组件和信号处理模块。 信号处理模块生成磁盘的磁特性的图像，其中图像包括多个伺服扇区弧，定位多个伺服扇区弧上的点样本，将圆适合于每个点上的点样本 并且从圆的半径确定至少一个枢轴对间隙测量。

    Method of detecting and classifying scratches, particles and pits on thin film disks or wafers
    39.
    发明授权
    Method of detecting and classifying scratches, particles and pits on thin film disks or wafers 有权
    在薄膜盘或晶片上检测和分类划痕，颗粒和凹坑的方法

    公开(公告)号：US06909500B2

    公开(公告)日：2005-06-21

    申请号：US10219632

    申请日：2002-08-14

    Applicant: Steven W. Meeks

    Inventor： Steven W. Meeks

    IPC: G01B11/06 ,  G01B11/30 ,  H01L21/66 ,  G01N21/88

    CPC classification number: G01B11/0616 ,  G01B11/0641 ,  G01B11/306 ,  H01L22/12

    Abstract: Scratches, pits and particles which are smaller or larger than the beam size may be measured and identified by a dual beam technique. This invention uses a pair of orthogonally oriented laser beams, one in the radial and one in the circumferential direction. The scattered light from radial and circumferential beams allows the detection and classification of particles, pits and scratches.

    Abstract translation: 可以通过双光束技术来测量和识别小于或大于光束尺寸的划痕，凹坑和颗粒。 本发明使用一对正交定向的激光束，一个在径向上和一个沿圆周方向。 来自径向和圆周波束的散射光允许检测和分类颗粒，凹坑和划痕。

    High speed optical profilometer for measuring surface height variation
    40.
    发明授权
    High speed optical profilometer for measuring surface height variation 有权
    用于测量表面高度变化的高速光学轮廓仪

    公开(公告)号：US06392749B1

    公开(公告)日：2002-05-21

    申请号：US09718054

    申请日：2000-11-20

    Applicant: Steven W. Meeks ,  Rusmin Kudinar

    Inventor： Steven W. Meeks ,  Rusmin Kudinar

    IPC: G01B1106

    CPC classification number: G01B11/065 ,  G01B11/303 ,  G01N21/211

    Abstract: A system and a method for measuring a height of a thin film disk or a silicon wafer having a first and a second electromagnetic signal source for generating a first and a second signal toward a first position on the thin film magnetic disk at two different angles, a first and a second sensitive detector positioned at a right angle from each other to receive a reflected portion of the first and the second signal that reflects off of the object, and to determine a radial portion of the first and the second signals and a circumferential portion of the first and the second signals. The system also includes a processor for determining the height of the first position based upon a difference between the circumferential portion of the second signal and the circumferential portion of the first signal that does not include slope information.

    Abstract translation: 一种用于测量具有第一和第二电磁信号源的薄膜盘或硅晶片的高度的系统和方法，用于以两个不同的角度向薄膜磁盘上的第一位置产生第一和第二信号， 第一和第二灵敏检测器，其彼此成直角定位，以接收反射离开物体的第一和第二信号的反射部分，并确定第一和第二信号的径向部分，以及周向 第一和第二信号的一部分。 该系统还包括一个处理器，用于基于第二信号的圆周部分与不包括斜率信息的第一信号的圆周部分之间的差来确定第一位置的高度。

Patent Agency Ranking