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公开(公告)号：US06879098B2
公开(公告)日：2005-04-12
申请号：US10756037
申请日：2004-01-13
IPC分类号： G02F1/1362 , H01L27/32 , H01J1/62
CPC分类号： G02F1/1362 , H01L27/32 , H01L27/3255 , Y10T29/4913 , Y10T29/4981 , Y10T29/49895
摘要： A method for fabricating a display device patterns a conductive layer on a display substrate and forms pixel electrodes on the display substrate. A plate is employed for carrying separately fabricated active devices to the display substrate. The separately fabricated devices are connected to the conductive layers and the pixel electrode.
摘要翻译： 一种显示装置的制造方法，在显示基板上形成导电层，并在显示基板上形成像素电极。 采用板将单独制造的有源器件携带到显示器基板。 单独制造的器件连接到导电层和像素电极。
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32.发明授权Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped 有权选择性地与铟或锡青铜和/或其氧化物覆盖互连的方法以及如此封闭的互连公开(公告)号：US06784088B2
公开(公告)日：2004-08-31
申请号：US10345288
申请日：2003-01-16
申请人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
发明人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
IPC分类号： H01L2144
CPC分类号： H01L21/76849 , H01L21/2885 , H01L21/76856 , H01L21/76858 , H01L21/76862 , H01L23/53238 , H01L24/11 , H01L2224/0401 , H01L2224/04042 , H01L2224/05546 , H01L2224/13099 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/15747 , H05K3/244 , H01L2924/00
摘要： A method to selectively cap a cooper BEOL terminal pad with a Cu/Sn/Au alloy. The method includes providing one or more Cu BEOL terminal pads and coating the pads with a Sn coating followed by coating the Sn with a Au coating. The coated pads are then annealed to form the Cu/Sn/Au capping alloy.
摘要翻译： 一种用Cu / Sn / Au合金选择性地覆盖铜合金BEOL端子焊盘的方法。 该方法包括提供一个或多个Cu BEOL端子焊盘并且用焊锡涂覆Sn涂层，然后用Au涂层涂覆Sn。 然后将涂覆的焊盘退火以形成Cu / Sn / Au封盖合金。
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