Abstract:
Apparatus and method evaluate a wafer fabrication process for forming patterns on a wafer based upon design data. Within a recipe database, two or more inspection regions are defined on the wafer for analysis. Patterns within each of the inspection regions are automatically selected based upon tendency for measurement variation resulting from variation in the fabrication process. For each inspection region, at least one image of patterns within the inspection region is captured, a reference pattern, represented by one or both of (a) one or more line segments and (b) one or more curves, is automatically generated from the design data. An inspection unit detects edges within each of the images and registers the image with the reference pattern. One or more measurements are determined from the edges for each of the selected patterns and are processed within a statistical analyzer to form statistical information associated with the fabrication process.
Abstract:
A pattern inspection apparatus is used for inspecting a fine pattern, such as a semiconductor integrated circuit (LSI), a liquid crystal panel, and a photomask (reticle) for the semiconductor or the liquid crystal panel, which are fabricated based on data for fabricating the fine pattern such as design data. The pattern inspection apparatus includes a reference pattern generation device configured to generate a reference pattern represented by one or more lines, comprising one of a line segment and a curve, from the data, an image generation device configured to generate the image of the pattern to-be-inspected, a detecting device configured to detect an edge of the image of the pattern to-be-inspected, and an inspection device configured to inspect the pattern to-be-inspected by comparing the edge of the image of the pattern to-be-inspected with the one or more lines of the reference pattern.
Abstract:
A system and method is described for evaluating a wafer fabrication process for forming patterns on a wafer based upon data. Multiple inspection regions are defined on the wafer for analysis. For each inspection region, images of patterns within the inspection region are captured, edges are detected, and lines are registered to lines of a reference pattern automatically generated from the design data. Line widths are determined from the edges. Measured line widths are analyzed to provide statistics and feedback information regarding the fabrication process. In particular embodiments defects are identified as where measured line widths lie outside boundaries determined from the statistics. In particular embodiments, lines of different drawn width and/or orientation are grouped and analyzed separately. Measured line widths may also be grouped for analysis according to geometry such as shape or proximity to other shapes in the inspection region to provide feedback for optical proximity correction rules.
Abstract:
A sealant composition for a plastic liquid display cell is composed of a one-component epoxy resin composition of a base resin liquid and a curing agent liquid, wherein the base resin is a liquid epoxy resin having from 1.7 to 6 in weight average of epoxy groups in one molecule and an ionic conductivity of 2 mS/m or less; and the curing agent has an ionic conductivity of 0.6 mS/m or less. The sealant composition facilitates the fabrication of plastic liquid crystal displays having enhanced durability and sealant properties, particularly in high temperature and high humidity environments.
Abstract:
A method for producing a liquid crystal display cell comprising processes of applying a sealing agent on a sealing portion of at least one liquid crystal display cell substrate, dropping liquid crystal on the substrate, and bonding substrates to each other under vacuum, wherein the sealing agent comprising a material to be cured and a curing agent is applied to the sealing portion without mixing the material to be cured and the curing agent, and then the substrates are bonded to each other under vacuum at room temperature to cure the sealing agent, is disclosed. A sealing agent for a liquid crystal display cell wherein the above material to be cured comprise a radically polymerizable resin and an organic peroxide, and the above curing agent comprises a radically polymerizable resin and a decomposition accelerator, is also disclosed.
Abstract:
Provided is an anisotropic conductive paste in which an aqueous solution obtained by admixing the anisotropic conductive paste with purified water has an ionic conductivity of 1 mS/m or less; the B stage-reduced composition has a viscosity of 50 to 10000 Pa.s at 80 to 100° C.; and the cured matter of the anisotropic conductive paste has a linear expansion coefficient of 10×10−5 mm/mm/° C. or less at 0 to 100° C., a heat deformation temperature Tg of 100° C. or higher, a water absorption coefficient of 2 mass % or less and a specific resistance of 1×109&OHgr;.cm or more.
Abstract translation:提供一种各向异性导电浆料,其中通过将各向异性导电浆料与纯化水混合而获得的水溶液具有1mS / m以下的离子电导率; B阶段还原组合物在80〜100℃下的粘度为50〜10000Pa·s。 并且各向异性导电糊的固化物在0〜100℃下的线膨胀系数为10×10 -5 mm / mm /℃以下,热变形温度Tg为100℃以上, 吸水系数为2质量%以下,电阻率为1×10 9Ω·cm以上。
Abstract:
A method for automatically recognizing a stage position of a feature of a semiconductor wafer comprises the steps of identifying a feature of a semiconductor wafer disposed at a predetermined distance from an alignment mark on the semiconductor wafer and obtaining an electron beam image, an optical image or a differential image thereof of the feature of the semiconductor wafer. A normalized correlation coefficient from the image of the feature is then calculated, and a stage position of the feature of the semiconductor wafer is automatically recognized in accordance with the normalized correlation coefficient.
Abstract:
A method of automatically setting a coordinate conversion factor in which, under the condition where a sample having a simple contour, such as a wafer with a known contour, is installed in a shape observing unit, in order to determine the conversion factor between a coordinate system defined by the contour of the sample and a control coordinate system for an observing position such as a stage coordinate system, the edge position of the contour of the sample is automatically recognized at a high accuracy from a secondary electron picture which has been obtained from the shape observing unit, from the result of which the conversion factor between the sample coordinate system and the stage coordinate system is automatically set.
Abstract:
Conductive cured products which have superior initial conductivity which is substantially retained even under high temperature and humidity conditions are obtained by curing a resinous composition comprising (a) a metallic copper powder, (b) a copper compound, (c) a compound having a 1,4-dihydroxy benzene ring or 1,2-dihydroxy benzene ring structure, and (d) a resinous curable component. Additionally, inclusion of a chelate forming compound in the uncured composition prevents a curing phenomenon on the surface of the composition during storage. The compound having the dihydroxy benzene ring (compound c) reduces the copper compound (b) to deposit metallic copper, and the resinous curable component integrates the constituents into a conductive product upon curing. The compositions are used as paints, adhesives, printing inks, and moulded articles, and they are useful in the electric, electronic, automobile, and housing fields.