公开(公告)号：US20240038623A1

公开(公告)日：2024-02-01

申请号：US17815629

申请日：2022-07-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ping-Yin Hsieh ,  Chih-Hao Chen ,  Yi-Huan Liao ,  Pu Wang ,  Li-Hui Cheng

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/3735 ,  H01L23/3675 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4871 ,  H01L21/563 ,  H01L21/565

Abstract: In an embodiment, a device includes a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component. The device also includes a back-side metal layer on a back-side of the package component. The device also includes an indium thermal interface material on a back-side of the back-side metal layer. The device also includes a lid on a back-side of the indium thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.

公开(公告)号：US20220367212A1

公开(公告)日：2022-11-17

申请号：US17815410

申请日：2022-07-27

Applicant: Taiwan Semiconductor Manufacturing Co, Ltd.

Inventor： Jing-Cheng Lin ,  Li-Hui Cheng ,  Po-Hao Tsai

IPC: H01L21/56 ,  H01L23/538 ,  H01L23/367 ,  H01L23/31 ,  H01L25/11 ,  H01L21/48 ,  H01L25/00 ,  H01L23/00 ,  H01L23/42 ,  H01L23/373 ,  H01L21/683

Abstract: A method includes forming a release film over a carrier, attaching a device over the release film through a die-attach film, encapsulating the device in an encapsulating material, performing a planarization on the encapsulating material to expose the device, detaching the device and the encapsulating material from the carrier, etching the die-attach film to expose a back surface of the device, and applying a thermal conductive material on the back surface of the device.

公开(公告)号：US11424174B2

公开(公告)日：2022-08-23

申请号：US17063143

申请日：2020-10-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Chien Pan ,  Chin-Fu Kao ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00

Abstract: A method of forming a semiconductor device includes attaching a first semiconductor device to a first surface of a substrate; forming a sacrificial structure on the first surface of the substrate around the first semiconductor device, the sacrificial structure encircling a first region of the first surface of the substrate; and forming an underfill material in the first region.

公开(公告)号：US20220037229A1

公开(公告)日：2022-02-03

申请号：US16941509

申请日：2020-07-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Chen ,  Chin-Fu Kao ,  Li-Hui Cheng ,  Szu-Wei Lu ,  Chih-Chien Pan

IPC: H01L23/42 ,  H01L27/06 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

Abstract: Provided are a package structure and a method of forming the same. The package structure includes a first die, a second die, an interposer, an underfill layer, a thermal interface material (TIM), and an adhesive pattern. The first die and the second die are disposed side by side on the interposer. The underfill layer is disposed between the first die and the second die. The TIM is disposed on the first die, the second die, and the underfill layer. The adhesive pattern is disposed between the underfill layer and the TIM to separate the underfill layer from the TIM.

公开(公告)号：US20210313304A1

公开(公告)日：2021-10-07

申请号：US16836927

申请日：2020-04-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Chien Pan ,  Chin-Fu Kao ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/24 ,  H01L21/56 ,  G02B6/13

Abstract: A package structure and method of forming the same are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is laterally aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element insertion. The encapsulant laterally encapsulates the second die and the wall structure.

公开(公告)号：US20210225727A1

公开(公告)日：2021-07-22

申请号：US16745338

申请日：2020-01-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Chen ,  Chin-Fu Kao ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683

Abstract: A structure includes a circuit substrate, a device, a metal layer, a lid and a thermal interface material layer. The device is disposed on and electrically connected to the circuit substrate. The device includes at least one semiconductor die laterally encapsulated by an insulating encapsulation. The metal layer is covering a back surface of the at least one semiconductor die and the insulating encapsulation. The lid is disposed on the circuit substrate, and the lid is adhered to the metal layer through the thermal interface material layer

公开(公告)号：US20210066151A1

公开(公告)日：2021-03-04

申请号：US16846400

申请日：2020-04-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsien-Pin Hu ,  Chin-Fu Kao ,  Li-Hui Cheng ,  Szu-Wei Lu ,  Wen-Hsin Wei ,  Chih-Chien Pan

IPC: H01L23/31 ,  H01L29/78 ,  H01L23/498 ,  H01L27/06

Abstract: A package structure includes a circuit substrate, a semiconductor package, a lid structure, a passive device and a barrier structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The lid structure is disposed on the circuit substrate covering the semiconductor package. The lid structure is attached to the circuit substrate through an adhesive material. The passive device is disposed on the circuit substrate in between the semiconductor package and the lid structure. The barrier structure is separating the passive device from the lid structure and the adhesive material, and the barrier structure is in contact with the adhesive material.

公开(公告)号：US20210020534A1

公开(公告)日：2021-01-21

申请号：US17063143

申请日：2020-10-05

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Chien Pan ,  Chin-Fu Kao ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00

Abstract: A method of forming a semiconductor device includes attaching a first semiconductor device to a first surface of a substrate; forming a sacrificial structure on the first surface of the substrate around the first semiconductor device, the sacrificial structure encircling a first region of the first surface of the substrate; and forming an underfill material in the first region.

公开(公告)号：US10852476B2

公开(公告)日：2020-12-01

申请号：US16285234

申请日：2019-02-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hao Chen ,  Chin-Fu Kao ,  Li-Hui Cheng ,  Szu-Wei Lu

IPC: G02B6/12 ,  G02B6/43 ,  G02B6/30 ,  G02B6/122

Abstract: A semiconductor package includes a photonic integrated circuit, an encapsulating material, and a redistribution structure. The photonic integrated circuit includes a coupling surface, a back surface opposite to the coupling surface and a plurality of optical couplers disposed on the coupling surface and configured to be coupled to a plurality of optical fibers. The encapsulating material encapsulates the photonic integrated circuit and revealing the plurality of optical couplers. The redistribution structure is disposed over the encapsulating material and the back surface of the photonic integrated circuit, wherein the redistribution structure is electrically connected to the photonic integrated circuit.

公开(公告)号：US10535627B2

公开(公告)日：2020-01-14

申请号：US16218495

申请日：2018-12-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jing-Cheng Lin ,  Li-Hui Cheng ,  Po-Hao Tsai ,  Chih-Chien Pan

IPC: H01L21/00 ,  H01L23/00 ,  H01L25/10 ,  H01L21/56 ,  H01L21/67 ,  H01L25/00 ,  H01L21/683

Abstract: A printing module, printing method and system of forming a printed structure are provided. The printing module includes a first printing dispenser operable to dispense a first material, a second printing dispenser operable to dispense a second material, a first curing unit, a second curing unit and a third curing unit. The first, the second and the third curing units each is operable to irradiate a light capable of curing the first and second materials and are alternately arranged with the first and second printing dispensers along a line. The first and second printing dispensers and the first, second and third curing units are simultaneously movable along the line. During the second curing unit and one of the first curing unit and the third curing unit are operable to irradiate the light, the other of the first curing unit and the third curing unit is off.