公开(公告)号：US4774882A

公开(公告)日：1988-10-04

申请号：US74510

申请日：1987-07-17

申请人： Seiichi Ohsawa ,  Masahiko Kaneko ,  Takashi Yokoyama

发明人： Seiichi Ohsawa ,  Masahiko Kaneko ,  Takashi Yokoyama

IPC分类号： B41J2/30 ,  B41J9/48 ,  B41J9/26

CPC分类号： B41J9/48 ,  B41J2/30

摘要： A method for controlling printing impact in an impact type dot printer which controls printing impact energy to be increase in case of normal density imprint function and to be decreased in case of high density imprint function in the controlling means of the impact type dot printer in which the printing stylus strikes the printing paper so that the printing paper can be prevented from being damaged during the high density imprint function.

摘要翻译： 一种用于控制冲击式打印机中的打印冲击的方法，其控制打印冲击能量在正常密度压印功能的情况下增加，并且在冲击型打印机的控制装置中的高密度压印功能的情况下减少打印冲击的方法，其中 印刷笔打印打印纸，使得可以防止在高密度压印功能期间打印纸被损坏。

公开(公告)号：US4519764A

公开(公告)日：1985-05-28

申请号：US644548

申请日：1984-08-27

申请人： Yasuhiro Maeda ,  Takashi Yokoyama ,  Shinichi Yagihashi

发明人： Yasuhiro Maeda ,  Takashi Yokoyama ,  Shinichi Yagihashi

IPC分类号： C01B33/02 ,  B28B1/54 ,  C30B11/00 ,  H01L31/04 ,  B29C5/04

CPC分类号： C30B11/008 ,  C30B11/00 ,  C30B29/06 ,  C30B29/605

摘要： A method of fabricating a polycrystalline silicon wafer, which method advantageously has the steps of radially outwardly flowing molten liquid of silicon base material on the wafer forming surface of a turntable mechanism by means of centrifugal force, thereby forming a thin molten liquid layer in a prescribed atmosphere, and cooling and solidifying the same. An apparatus for fabricating the wafer is used to carry out the method with a recover tray arranged at the wafer forming surface for receiving the excessive silicon liquid scattered, and a wafer tray placed on the recovery tray, and the wafer forming surface is cooled with coolant flowing in the wafer forming mechanism. Thus, large crystalline grains can be grown on the wafer in free states with the atmosphere from the inner surfaces of the casting mold as the conventional method.

摘要翻译： 一种制造多晶硅晶片的方法，该方法有利地具有通过离心力将硅基材料的熔融液体径向向外流动在转台机构的晶片形成表面上的步骤，从而在规定的条件下形成薄的熔融液体层 气氛，冷却固化相同。 用于制造晶片的装置用于利用布置在晶片形成表面处的用于接收过量硅液体散射的回收托盘和放置在回收托盘上的晶片托盘来执行该方法，并且用冷却剂冷却晶片形成表面 在晶片形成机构中流动。 因此，作为常规方法，可以从铸模的内表面的气氛以自由状态在晶片上生长大晶粒。

公开(公告)号：USD276496S

公开(公告)日：1984-11-27

申请号：US390075

申请日：1982-06-18

申请人： Takashi Yokoyama

设计人： Takashi Yokoyama

公开(公告)号：USD272122S

公开(公告)日：1984-01-10

申请号：US218014

申请日：1980-12-18

申请人： Masahiko Nakamura ,  Takashi Yokoyama

设计人： Masahiko Nakamura ,  Takashi Yokoyama

公开(公告)号：US4064289A

公开(公告)日：1977-12-20

申请号：US606354

申请日：1975-08-21

申请人： Takashi Yokoyama ,  Yasuo Miyadera ,  Nobuhiko Shito ,  Hiroshi Suzuki ,  Yoshiaki Wakashima

发明人： Takashi Yokoyama ,  Yasuo Miyadera ,  Nobuhiko Shito ,  Hiroshi Suzuki ,  Yoshiaki Wakashima

IPC分类号： C08L79/04 ,  H01B3/30 ,  H01L21/312 ,  H01L23/29 ,  H01L23/31 ,  H01L23/30

CPC分类号： H01B3/306 ,  C08L79/04 ,  H01L21/312 ,  H01L23/293 ,  H01L23/3171 ,  H01L2924/0002 ,  Y10T428/31721

摘要： Method of making a semiconductor device which includes applying a solution of a heterocyclic ring-containing polymer in an organic solvent to a desired surface of a semiconductor body and removing the organic solvent from the solution by heat thereby to form a coating of a polymer on the surface, wherein the polymer is a reaction product of a diamine represented by the formula: ##STR1## with a tetracarboxylic acid or anhydride of it. Since the coating exhibits good thermal stability and good electrical properties when applied to the surface of the semiconductor, it is useful as a passivating film.

摘要翻译： 制造半导体器件的方法包括将含有杂环的聚合物在有机溶剂中的溶液施加到半导体本体的所需表面，并通过热从溶液中除去有机溶剂，从而形成聚合物的涂层 表面，其中聚合物是由下式表示的二胺与四羧酸或其酸酐的反应产物。 由于当涂覆在半导体的表面上时，涂层具有良好的热稳定性和良好的电学性能，因此可用作钝化膜。

公开(公告)号：USD974667S1

公开(公告)日：2023-01-03

申请号：US29824124

申请日：2022-01-21

申请人： Takashi Yokoyama ,  Naoto Kamitake

设计人： Takashi Yokoyama ,  Naoto Kamitake

公开(公告)号：US09219077B2

公开(公告)日：2015-12-22

申请号：US13430212

申请日：2012-03-26

申请人： Takashi Yokoyama

发明人： Takashi Yokoyama

IPC分类号： H01L29/78 ,  H01L27/12 ,  H01L21/84 ,  H01L21/762 ,  H01L21/8238

CPC分类号： H01L29/7848 ,  H01L21/76251 ,  H01L21/823807 ,  H01L21/823878 ,  H01L21/84 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/53214 ,  H01L23/53228 ,  H01L23/53257 ,  H01L25/0657 ,  H01L27/0924 ,  H01L27/1203 ,  H01L29/045 ,  H01L29/1608 ,  H01L29/165 ,  H01L29/4966 ,  H01L29/518 ,  H01L29/7843 ,  H01L2224/9212 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2224/80896 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2224/80001 ,  H01L2224/82

摘要： A semiconductor device includes: a first substrate on which a first field effect transistor is provided; and a second substrate on which a second field effect transistor of a second conductive type is provided; the first and second substrates being bonded to each other at the substrate faces thereof on which the first and second field transistors are provided, respectively; the first field effect transistor and the second field effect transistor being electrically connected to each other.

摘要翻译： 半导体器件包括：第一衬底，其上设置有第一场效应晶体管; 以及第二基板，其上设置有第二导电类型的第二场效应晶体管; 第一和第二基板分别在其上设置有第一和第二场晶体管的基板面彼此接合; 第一场效应晶体管和第二场效应晶体管彼此电连接。

公开(公告)号：US20130064616A1

公开(公告)日：2013-03-14

申请号：US13509911

申请日：2010-11-10

申请人： Eiji Nakamura ,  Akihiko Kadota ,  Takashi Yokoyama ,  Yasuhiro Komai ,  Harumi Sawaki ,  Shun Sawaki ,  Aya Sawaki ,  Taku Sawaki

发明人： Eiji Nakamura ,  Norikazu Sawaki ,  Akihiko Kadota ,  Takashi Yokoyama ,  Yasuhiro Komai

IPC分类号： B23B47/22 ,  B23B35/00

CPC分类号： B23B29/03403 ,  B23B29/03421 ,  B23B29/03425 ,  B23B29/03489 ,  B23B35/00 ,  B23B2250/04 ,  B23B2270/025 ,  B23B2270/027 ,  B23B2270/48 ,  Y10T82/10 ,  Y10T408/03 ,  Y10T408/175 ,  Y10T408/85 ,  Y10T408/858

摘要： At a contact step in a tool radius adjusting method, a reference portion of a movable body provided radially movably on a housing of a boring tool and a position adjusting reference member fixed on a machine tool are brought into contact by sliding the movable body relative to the housing so that the position of a cutting blade comes to a predetermined position in a direction to go away from a rotational axis. Then, at an adjusting step, the position of the cutting blade relative to the rotational axis is adjusted by changing the relative position between a tool spindle holding the boring tool and the position adjusting reference member in a direction to come close to each other by drive mechanisms of the machine tool used for positioning a spindle head with the tool spindle relative to a workpiece in machining the workpiece with the cutting blade.

摘要翻译： 在工具半径调整方法的接触步骤中，通过使可移动体相对于所述移动体相对于所述可移动体相对于所述移动体相对于所述移动体相对于所述移动体相对于所述移动体 所述壳体使得切割刀片的位置在远离旋转轴线的方向上到达预定位置。 然后，在调整步骤中，通过在保持钻孔工具的工具主轴与位置调整基准构件之间的相对位置通过驱动方向彼此靠近的方向来改变切割刀片相对于旋转轴线的位置 机床用于在与切割刀片一起加工工件时，将主轴头与工具主轴相对于工件定位。

公开(公告)号：US20120058871A1

公开(公告)日：2012-03-08

申请号：US13217555

申请日：2011-08-25

申请人： Eiji NAKAMURA ,  Akihiko Kadota ,  Takashi Yokoyama

发明人： Eiji NAKAMURA ,  Akihiko Kadota ,  Takashi Yokoyama

IPC分类号： B23Q3/157

CPC分类号： B23Q3/15713 ,  B23B29/03421 ,  B23B29/03425 ,  B23B29/03432 ,  B23Q3/1574 ,  Y10T408/76 ,  Y10T408/856 ,  Y10T408/85843 ,  Y10T483/12 ,  Y10T483/13 ,  Y10T483/15 ,  Y10T483/1738

摘要： A tool radius adjusting device executes an operation for adjusting the tool radius of a boring holder in parallel with execution of a machining program for executing an operation of a spindle head and an operation of a tool changer. A carrier control unit determines whether the tool changer is executing a tool changing process. When the tool changing process is not being executed, the carrier control unit allows the carrier device to execute an operation for picking the boring holder out from the tool magazine and an operation for returning the boring holder, of which the tool radius has been adjusted, to the tool magazine.

摘要翻译： 刀具半径调节装置执行与执行用于执行主轴头的操作的加工程序和刀具更换器的操作并行地调整镗刀架的刀具半径的操作。 载体控制单元确定换刀器是否正在执行换刀过程。 当不执行换刀过程时，承运人控制单元允许承运人装置执行从工具仓中取出镗刀架的操作和用于使已经调整了刀具半径的镗刀架返回的操作， 到工具杂志。

公开(公告)号：US20110022400A1

公开(公告)日：2011-01-27

申请号：US12847701

申请日：2010-07-30

申请人： Yukihiko KIMURA ,  Takashi Yokoyama ,  Tetsuya Oooka

发明人： Yukihiko KIMURA ,  Takashi Yokoyama ,  Tetsuya Oooka

IPC分类号： G10L19/00 ,  G06F17/00

CPC分类号： G10L19/167

摘要： An audio playback device includes an interruption-information storage memory which holds frame information at the time of an interruption of playback, a compressed-stream control section which calculates a start position of reading the compressed stream from a recording medium, and reads the compressed stream accordingly, a compressed-stream decode section which decodes the compressed audio stream and transmits decoding information on the frame to the compressed-stream control section as additional resume information, and an output control section which outputs a decoding result. When playback is restarted after an interruption, playback can be restarted without any section not played back in terms of time and without any frequency range not played back, by calculating the start position of reading the compressed stream based on both the additional resume information and the frame information at the time of the interruption, and by reading the compressed stream accordingly.

摘要翻译： 音频播放装置包括：中断信息存储存储器，其在重放中断时保存帧信息;压缩流控制部分，其计算从记录介质读取压缩流的开始位置，并读取压缩流 因此，压缩流解码部分对压缩音频流进行解码，并将该帧上的解码信息作为附加恢复信息发送到压缩流控制部分，以及输出控制部分，其输出解码结果。 当在中断之后重新开始播放时，可以重新开始播放，而不会在时间上没有播放的部分，而没有任何频率范围不被重放，通过计算基于附加的恢复信息和 在中断时的帧信息，以及相应地读取压缩流。