摘要:
According to one embodiment, a false color mask signal generation circuit generates a false color pixel mask signal to exclude false color component pixels based on an edge component signal from an edge component extraction circuit. A white balance gain calculation circuit calculates a white balance gain from an integrated value calculated by the false color component pixels being excluded based on the false color pixel mask signal.
摘要:
There is provided a method of generating nitrogen which includes cryogenically separating compressed air introduced into a high-pressure column 11, storing liquid air 13 in a bottom portion of the high-pressure column 11 and taking nitrogen in gaseous form from an upper portion of the high-pressure column 11, introducing the liquid air 13 stored in the bottom portion of the high-pressure column 11 into a low-pressure column 12, cryogenically separating the liquid air 13 introduced into the low-pressure column 12 and storing oxygen-enriched liquid air 22 in a bottom portion of the low-pressure column 12 and taking nitrogen in gaseous form from an upper portion of the low-pressure column 12 as a product gas. Liquid air 13 taken through an extraction pipe 20 is introduced into a portion of a rectification part 12a of the low-pressure column 12 in which the number of theoretical plates from a column bottom side is set within the range of one to ten.
摘要:
A coupling oxide film is formed on a silicon substrate, a polysilicon film is further formed thereupon, and a low-temperature oxide film is deposited to a thickness of 10 nm, for example. Next, a silicon nitride film is formed on this low-temperature oxide film, and selectively removed by dry etching. At this time, the low-temperature oxide film serves as an etching stopper film, so the low-temperature oxide film and polysilicon film are not over-etched. Subsequently, the polysilicon film is dry-etched, forming a recess. A floating gate is then formed of the polysilicon film.
摘要:
A coupling oxide film is formed on a silicon substrate, a polysilicon film is further formed thereupon, and a low-temperature oxide film is deposited to a thickness of 10 nm, for example. Next, a silicon nitride film is formed on this low-temperature oxide film, and selectively removed by dry etching. At this time, the low-temperature oxide film serves as an etching stopper film, so the low-temperature oxide film and polysilicon film are not over-etched. Subsequently, the polysilicon film is dry-etched, forming a recess. A floating gate is then formed of the polysilicon film.
摘要:
A semiconductor memory device includes a first insulating film provided on a semiconductor substrate between first and second diffusion regions, a first gate electrode provided on the first insulating film, a second insulating film provided on the semiconductor substrate between the second diffusion region and a third diffusion region, and a second gate electrode provided on the second insulating film. The first and second diffusion regions, first insulating film, and first gate electrode constitute a first memory cell, while the second and third diffusion regions, second insulating film, and second gate electrode constitute a second memory cell. The first and second gate electrodes are connected in common to form a word line electrode. The first and third diffusion regions are connected to first and second read bit lines. The second diffusion region is connected to a program and erase bit line.
摘要:
Nonvolatile semiconductor memory devices and methods for manufacturing thereof, which provide inhibiting the shortcutting of the channel due to the creation of the bird's beak to promote the manufacturing of the devices with higher-density or higher-integration, lowering the operation voltage and improving the characteristics of maintaining the electric charge, without complicating the manufacturing process. Immediately after forming ONO films comprising a first silicon oxide film, a second silicon nitride film and a third silicon oxide film on a silicon substrate, a silicon layer is formed, and then, arsenic ions are implanted over the silicon layer and/or ONO films to form a bit line, and a second electrical conductive layer is deposited while remaining the silicon layer to form a word line comprising a dual layer structure of two electrical conductive layers.
摘要:
A first diffused layer and a second diffused layer are formed on the major surface of a silicon substrate. A first insulating layer, a second insulating layer or a semiconductor layer, and a third insulating layer are laminated on the major surface of the silicon substrate in the vicinity of the first diffused layer or the second diffused layer and are partially formed. A fourth insulating layer is formed as a gate insulating film. A fifth insulating layer is formed on the side walls of the second insulating layer or the semiconductor layer. In a region of most of a channel, the gate insulating film is formed and a gate electrode is formed so that it covers the gate insulating film and the laminated films. According to this structure, the operating voltage of a flash memory is reduced, the operation is easily sped up and the holding characteristic of information charge can be enhanced.
摘要:
A nonvolatile semiconductor storage device has a semiconductor substrate, a gate electrode formed on a surface of the semiconductor substrate, and a first diffusion layer and a second diffusion layer formed in the surface of the semiconductor substrate on opposite sides of the gate electrode, a channel region being formed between the first and second diffusion layers. A first insulating layer, isolated pieces of material and a second insulating layer are formed in order in a multilayer structure on the surface of the semiconductor substrate on the channel region.
摘要:
There are included a fractionating tower for liquefying and separating the compressed air cooled by heat exchangers to an ultralow temperature, a liquid oxygen takeout path for guiding the liquid oxygen in the above-mentioned fractionating tower to the above-mentioned heat exchangers to gasify so as to become a gasified oxygen, and a product oxygen gas takeout path which extends from the front end of the above-mentioned liquid oxygen takeout path and increases the temperature of the above-mentioned gasified oxygen so as to obtain a product oxygen gas, the above-mentioned liquid oxygen takeout path being provided with an oxygen gas pressurizing pump, and the above-mentioned product oxygen gas takeout path on the side upstream the above-mentioned heat exchangers being provided with an expansion turbine. In the present invention, the liquid oxygen taken out from the fractionating tower is pressurized in a liquid state, then introduced into the expansion turbine to generate a cold, which cold is fed to the heat exchangers, so that the cold is used as a cold source for the entire equipment to reduce the cost of generating the cold.
摘要:
The invention provides a method of fabricating a semiconductor device on an SOI substrate having a single crystal silicon substrate, a silicon dioxide film laid on top of the silicon substrate and a single crystal silicon layer laid on top of the silicon dioxide film. The method includes the steps of forming a single crystal silicon island composed of the single crystal silicon layer in a first region in which the semiconductor device is to be fabricated, and selectively forming a low temperature deposition silicon dioxide film in a second region in which the semiconductor device is not to be fabricated in the presence of photoresist, so that the low temperature deposition silicon dioxide film covers side surfaces of the silicon island. The second region turns into an isolation region for electrically separating adjacent semiconductor devices.