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    INTEGRATED CIRCUIT WITH AN EMBEDDED INDUCTOR OR TRANSFORMER
    31.
    发明申请
    INTEGRATED CIRCUIT WITH AN EMBEDDED INDUCTOR OR TRANSFORMER 审中-公开

    公开(公告)号：US20190057942A1

    公开(公告)日：2019-02-21

    申请号：US15678841

    申请日：2017-08-16

    申请人： Texas Instruments Incorporated

    发明人： Barry Jon Male ,  Rajarshi Mukhopadhyay

    IPC分类号： H01L23/64 ,  H01F27/28 ,  H01F27/24 ,  H01L49/02 ,  H01L23/495

    摘要： In a described example, an integrated circuit includes: a semiconductor substrate having a first surface and an opposite second surface; at least one dielectric layer overlying the first surface of the semiconductor substrate; at least one inductor coil in the at least one dielectric layer with a plurality of coil windings separated by coil spaces, the at least one inductor coil lying in a plane oriented in a first direction parallel to the first surface of the semiconductor substrate, the at least one inductor coil electrically isolated from the semiconductor substrate by a portion of the at least one dielectric layer; and trenches extending into the semiconductor substrate in a second direction at an angle with respect to the first direction, the trenches underlying the inductor coil and filled with dielectric replacement material.

    METHODS AND APPARATUS FOR SPARK GAP DEVICES WITHIN INTEGRATED CIRCUITS
    32.
    发明申请
    METHODS AND APPARATUS FOR SPARK GAP DEVICES WITHIN INTEGRATED CIRCUITS 审中-公开

    公开(公告)号：US20180190556A1

    公开(公告)日：2018-07-05

    申请号：US15396121

    申请日：2016-12-30

    申请人： Texas Instruments Incorporated

    发明人： Barry Jon Male ,  Steve Kummerl ,  Robert Alan Neidorff ,  Benjamin Stassen Cook

    IPC分类号： H01L23/31 ,  H02H9/04 ,  H01L23/495 ,  H01L27/02 ,  H01L21/48 ,  H01L21/56

    摘要： In a described example, an apparatus includes: an integrated circuit die having multiple terminals; a leadframe having leads for external connections, at least some of the leads electrically coupled to at least one of the multiple terminals of the integrated circuit die; a first electrode having a first end portion; a second electrode having a second end portion positioned proximal to and spaced apart from the first end portion of the first electrode, the first end portion and the second end portion spaced by a spark gap; encapsulation material surrounding the integrated circuit die to form a packaged integrated circuit having a cavity surrounding the first end portion, the second end portion, and the spark gap so that the first end portion of the first electrode, the second end portion of the second electrode and the spark gap are spaced from the encapsulation material.

    Semiconductor package with top circuit and an IC with a gap over the IC
    34.
    发明授权
    Semiconductor package with top circuit and an IC with a gap over the IC 有权

    公开(公告)号：US11302611B2

    公开(公告)日：2022-04-12

    申请号：US16202925

    申请日：2018-11-28

    申请人： Texas Instruments Incorporated

    发明人： Barry Jon Male ,  Paul Merle Emerson ,  Sandeep Shylaja Krishnan

    IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

    摘要： A packaged integrated circuit (IC) includes a leadframe including a die pad and leads around the die pad, an analog IC die having first bond pads on its active top side, and a second circuit including second circuit bond pads attached to the analog IC die by an attachment layer configured as a ring with a hollow center that provides an inner gap. A bottom side of the analog IC or the second circuit is attached to the die pad. Bond wires couple at least some of the first bond pads or some of the second circuit bond pads to the leads, and there is a second coupling between others of the second circuit bond pads and others of the first bond pads. A mold compound is for encapsulating the second circuit and the analog IC.

    Integrated circuit with an embedded inductor or transformer
    38.
    发明授权
    Integrated circuit with an embedded inductor or transformer 有权

    公开(公告)号：US10734331B2

    公开(公告)日：2020-08-04

    申请号：US15678841

    申请日：2017-08-16

    申请人： Texas Instruments Incorporated

    发明人： Barry Jon Male ,  Rajarshi Mukhopadhyay

    IPC分类号： H01L23/64 ,  H01F27/28 ,  H01F27/24 ,  H01L49/02 ,  H01L23/495 ,  H01F17/00 ,  H01L23/66 ,  H01F41/04 ,  H01L23/522

    摘要： In a described example, an integrated circuit includes: a semiconductor substrate having a first surface and an opposite second surface; at least one dielectric layer overlying the first surface of the semiconductor substrate; at least one inductor coil in the at least one dielectric layer with a plurality of coil windings separated by coil spaces, the at least one inductor coil lying in a plane oriented in a first direction parallel to the first surface of the semiconductor substrate, the at least one inductor coil electrically isolated from the semiconductor substrate by a portion of the at least one dielectric layer; and trenches extending into the semiconductor substrate in a second direction at an angle with respect to the first direction, the trenches underlying the inductor coil and filled with dielectric replacement material.

    THERMAL AND STRESS ISOLATION FOR PRECISION CIRCUIT
    40.
    发明申请
    THERMAL AND STRESS ISOLATION FOR PRECISION CIRCUIT 审中-公开

    公开(公告)号：US20200043828A1

    公开(公告)日：2020-02-06

    申请号：US16055395

    申请日：2018-08-06

    申请人： Texas Instruments Incorporated

    发明人： Peter Smeys ,  Ting-Ta Yen ,  Barry Jon Male ,  Paul Merle Emerson

    IPC分类号： H01L23/433 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

    摘要： Described examples include microelectronic devices and integrated circuits with an active first circuit in a first segment of a first wafer, a second circuit in a second segment of the first wafer, and second and third wafers bonded to different surfaces of the first wafer to provide first and second cavities with surfaces spaced from the first segment. An opening extends through the first wafer between the first and second cavities to separate portions of the first and second segments and to form a sealed cavity that surrounds the first segment. A bridge segment of the first wafer supports the first segment in the sealed cavity and includes one or more conductive structures to electrically connect the first and second circuits.